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TMX320C40GFL40

Texas Instruments

TMX320C40GFL40 by Texas Instruments

TMX320C40GFL40 by Texas Instruments is a 32-bit DSP with 8192 RAM words, operating at 5V. Its GRID ARRAY package has 325 terminals on a ceramic body, with a terminal pitch of 1.27mm. This CMOS technology device is ideal for applications requiring high processing power in digital signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 2,729 parts In-Stock

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Digiode

USA . 1,235 parts In-Stock

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Q Components

USA . 16 parts In-Stock

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Manotoh

Italy . 2 parts In-Stock

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One Stop Electronics

USA . 862 parts In-Stock

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$8.000

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$8.000

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AZTECH Wire

Italy . 262 parts In-Stock

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$10.814

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Corohmni

South Africa . 3,245 parts In-Stock

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Parana Technologies

USA . 1,687 parts In-Stock

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DigiPath Technology Company

USA . 727 parts In-Stock

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$84.845

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ChromeModa Solutions

Germany . 5,146 parts In-Stock

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$86.577

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$70.993

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IDEA Electronic Components Group

UK . 337 parts In-Stock

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$86.577

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$82.248

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$77.919

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Corphita

USA . 2,185 parts In-Stock

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Overview

Experience unmatched performance and reliability with the TMX320C40GFL40 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and cutting-edge technology in their products. The TMX320C40GFL40 falls under the category of Digital Signal Processors (DSPs) and is suitable for a variety of applications. With its advanced features and benefits, this product offers customers exceptional value and advantages, making it the perfect choice for all your digital signal processing needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal properties, ensuring effective heat dissipation and overall product reliability.

Package Shape: SQUARE

Square packages are typically more space-efficient and easier to handle during manufacturing and assembly processes.

Bit Size: 32

A 32-bit architecture allows for complex signal processing tasks to be executed efficiently and accurately.

Power Supplies (V): 5

Operating at 5 volts ensures compatibility with standard power sources, making integration into various systems straightforward.

No. of Terminals: 325

Having a large number of terminals enables connectivity to multiple inputs and outputs, increasing the versatility of the product.

Package Style (Meter): GRID ARRAY

Grid array packages provide improved signal integrity and high-density interconnections, enhancing overall performance.

Terminal Position: PERPENDICULAR

Perpendicular terminal layout simplifies PCB design and assembly, making the product more user-friendly for engineers.

RAM Words: 8192

With a large RAM capacity, the product can efficiently store and retrieve data during signal processing tasks, enhancing performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy-efficient and reliable operation.

Terminal Form: PIN/PEG

Pin/peg terminal form provides secure connections and ease of soldering, ensuring robust electrical connectivity.

Maximum Supply Current: 850 mA

Capable of handling high supply currents, the product can manage demanding processing tasks without compromising performance.

Nominal Supply Voltage: 5 V

Operating at a standard 5-volt supply voltage simplifies power management and integration within existing systems.

Terminal Pitch: 1.27 mm

A compact terminal pitch facilitates high-density mounting, enabling space-efficient PCB layouts and compact system designs.

Format: FLOATING POINT

Floating-point format allows for precise numerical calculations and processing, suitable for handling complex signal algorithms effectively.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C40GFL40 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

32

Format:

FLOATING POINT

JESD-30 Code:

S-XPGA-P325

No. of Terminals:

325

Package Body Material:

CERAMIC

Package Code:

PGA

Package Equivalence Code:

SPGA325,35X35MOD

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

8192

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

850 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

PERPENDICULAR

Trade Compliance

TMX320C40GFL40 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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