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TMX320C28FNL

Texas Instruments

TMX320C28FNL by Texas Instruments

TMX320C28FNL by Texas Instruments is a 16-bit DSP with 544 RAM words, operating at 5V. It comes in a square chip carrier package and supports commercial temperature grade applications. With J bend terminals and CMOS technology, it's ideal for digital signal processing tasks requiring fixed-point format computations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,949 parts In-Stock

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Digiode

USA . 2,732 parts In-Stock

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2,732

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Distributors (Availability)

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AZTECH Wire

Italy . 461 parts In-Stock

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$12.176

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461

$12.176

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One Stop Electronics

USA . 147 parts In-Stock

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$31.000

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Corohmni

South Africa . 2,887 parts In-Stock

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$47.186

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Parana Technologies

USA . 1,130 parts In-Stock

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$54.240

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DigiPath Technology Company

USA . 1,638 parts In-Stock

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$59.725

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1,638

$59.725

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ChromeModa Solutions

Germany . 6,788 parts In-Stock

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$60.944

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$49.974

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6,788

$60.944

$49.974

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IDEA Electronic Components Group

UK . 1,082 parts In-Stock

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$60.944

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$57.897

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$54.850

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1,082

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$54.850

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Corphita

USA . 341 parts In-Stock

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Overview

Upgrade your digital signal processing capabilities with the TMX320C28FNL by Texas Instruments. Known for their high-quality products, Texas Instruments offers a top-of-the-line DSP that is perfect for applications in audio processing, telecommunications, and more. With a 16-bit size and 544 RAM words, this chip carrier package provides optimal performance and efficiency. Trust in Texas Instruments to deliver cutting-edge technology that will elevate your projects to new heights. Experience the value and benefits of the TMX320C28FNL today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material helps in reducing the overall weight of the product and makes it more durable for various applications.

Surface Mount: YES

Surface mount capability allows for easy assembly and integration into a variety of electronic devices.

Bit Size: 16

With a 16-bit size, this DSP offers high processing power and accuracy for complex signal processing tasks.

Power Supplies (V): 5

Operating at 5V ensures compatibility with standard power supplies, making it easy to power and integrate into existing systems.

No. of Terminals: 68

Having 68 terminals provides ample connectivity options for interfacing with other components and systems.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compactness and efficient heat dissipation, making it ideal for space-constrained applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this DSP can perform reliably in various environmental conditions.

RAM Words: 544

Having 544 RAM words allows for efficient data storage and retrieval, enhancing the overall performance of the DSP.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP suitable for battery-operated devices and noise-sensitive applications.

Maximum Supply Current: 185 mA

The maximum supply current of 185 mA ensures that the DSP operates within safe limits and does not overload the power supply.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes the DSP compatible with standard power sources and simplifies integration.

Format: FIXED POINT

Being a fixed-point DSP, it offers fast and efficient processing of integer-based calculations, suitable for many signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C28FNL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

16

Format:

FIXED POINT

JESD-30 Code:

S-PQCC-J68

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

544

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

185 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMX320C28FNL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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