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TMX320C26FNL

Texas Instruments

TMX320C26FNL by Texas Instruments

TMX320C26FNL by Texas Instruments is a 16-bit DSP with 1568 RAM words, operating at 5V. It comes in a square chip carrier package with J bend terminals and operates b/w 0-70°C. Ideal for commercial applications requiring fixed-point technology and high processing power within a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,045 parts In-Stock

1+ parts

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5,045

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Digiode

USA . 4,884 parts In-Stock

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4,884

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 236 parts In-Stock

1+ parts

$17.000

100+ parts

-

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236

$17.000

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AZTECH Wire

Italy . 375 parts In-Stock

1+ parts

$19.379

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-

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375

$19.379

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Parana Technologies

USA . 2,374 parts In-Stock

1+ parts

$72.665

100+ parts

-

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2,374

$72.665

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DigiPath Technology Company

USA . 1,855 parts In-Stock

1+ parts

$80.013

100+ parts

$73.612

1k+ parts

-

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1,855

$80.013

$73.612

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ChromeModa Solutions

Germany . 2,503 parts In-Stock

1+ parts

$81.646

100+ parts

$66.950

1k+ parts

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10k+ parts

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2,503

$81.646

$66.950

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IDEA Electronic Components Group

UK . 1,849 parts In-Stock

1+ parts

$81.646

100+ parts

$77.564

1k+ parts

$73.481

10k+ parts

-

1,849

$81.646

$77.564

$73.481

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Corohmni

South Africa . 2,020 parts In-Stock

1+ parts

$83.310

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2,020

$83.310

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Corphita

USA . 709 parts In-Stock

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709

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Overview

Discover the TMX320C26FNL from Texas Instruments, a top-tier manufacturer of high-quality Digital Signal Processors. This cutting-edge DSP offers unparalleled performance and versatility for a wide range of applications. With its advanced technology and reliable design, this chip is perfect for any project requiring fast data processing and efficient power management. Upgrade your system with the TMX320C26FNL and experience the value, benefits, and advantages it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing production costs.

Bit Size: 16

A 16-bit architecture provides improved precision and performance for signal processing applications.

No. of Terminals: 68

The high number of terminals allows for greater connectivity options and flexibility in system integration.

RAM Words: 1568

With a large RAM capacity, the DSP can handle complex algorithms and data processing tasks efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Pitch: 1.27 mm

A small terminal pitch enables higher density integration on the PCB, saving space and reducing overall system size.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C26FNL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

16

Format:

FIXED POINT

JESD-30 Code:

S-PQCC-J68

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1568

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

220 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMX320C26FNL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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