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TMX320C32PCM60

Texas Instruments

TMX320C32PCM60 by Texas Instruments

TMX320C32PCM60 by Texas Instruments is a 32-bit DSP with 512 RAM words, operating at 5V. It comes in a square flatpack package with gull wing terminals and supports floating-point format. Ideal for digital signal processing applications requiring high computational power and precision.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,934 parts In-Stock

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7,934

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Digiode

USA . 2,610 parts In-Stock

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2,610

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Distributors (Availability)

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AZTECH Wire

Italy . 232 parts In-Stock

1+ parts

$14.793

100+ parts

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232

$14.793

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One Stop Electronics

USA . 986 parts In-Stock

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$25.000

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986

$25.000

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Corohmni

South Africa . 432 parts In-Stock

1+ parts

$36.855

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432

$36.855

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Parana Technologies

USA . 801 parts In-Stock

1+ parts

$77.199

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801

$77.199

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DigiPath Technology Company

USA . 2,028 parts In-Stock

1+ parts

$85.005

100+ parts

$78.205

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2,028

$85.005

$78.205

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ChromeModa Solutions

Germany . 6,044 parts In-Stock

1+ parts

$86.740

100+ parts

$71.127

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6,044

$86.740

$71.127

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IDEA Electronic Components Group

UK . 339 parts In-Stock

1+ parts

$86.740

100+ parts

$82.403

1k+ parts

$78.066

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339

$86.740

$82.403

$78.066

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Corphita

USA . 1,770 parts In-Stock

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1,770

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Overview

Unleash the power of cutting-edge technology with the TMX320C32PCM60 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unmatched quality and reliability in their products. This DSP is perfect for applications requiring high-speed data processing and precision calculations. With a 32-bit size and 512 RAM words, this device offers unparalleled performance. Upgrade your projects with the TMX320C32PCM60 and experience the value and advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures good durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier and more cost-effective PCB assembly, saving time and reducing manufacturing costs.

Package Shape: SQUARE

Square package shape provides better uniformity and PCB space efficiency, making the product fit well within compact designs.

Bit Size: 32

32-bit processing enables higher precision and efficiency in signal processing tasks, leading to faster and more accurate results.

Power Supplies (V): 5

Operating at a standard 5V supply voltage simplifies power requirements and compatibility with other components in the system.

No. of Terminals: 144

Having a higher number of terminals provides more connectivity options and flexibility in interfacing with external devices or peripherals.

Package Style (Meter): FLATPACK

Flatpack package style offers better thermal dissipation and lower profile, making it suitable for space-constrained applications with efficient heat management.

Terminal Position: QUAD

Quad terminal position enables easier soldering and reliable connections, enhancing the overall robustness and longevity of the product.

RAM Words: 512

512 RAM words allow for larger data storage and faster access times, improving the overall performance and efficiency of the signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring optimal performance while keeping energy usage at a minimum.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and better soldering joints, enhancing the reliability and durability of the product during operation.

Maximum Supply Current: 475 mA

With a maximum supply current of 475mA, the product ensures stable operation under varying load conditions without risking overheating or performance degradation.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and simplifies the overall design and integration process.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635mm allows for high-density packaging and easier PCB layout optimization, improving signal integrity and reducing signal interference.

Format: FLOATING POINT

Floating-point format enables more precise and dynamic range calculations, essential for complex signal processing applications that require accurate numerical representations.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C32PCM60 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

32

Format:

FLOATING POINT

JESD-30 Code:

S-PQFP-G144

No. of Terminals:

144

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

512

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

475 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMX320C32PCM60 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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