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TMX320C30PPM

Texas Instruments

TMX320C30PPM by Texas Instruments

TMX320C30PPM by Texas Instruments is a 32-bit DSP with 24-bit address bus and 32-bit external data bus width. It operates b/w 0-85°C, suitable for digital signal processing applications requiring high-speed calculations in a compact FLATPACK package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,430 parts In-Stock

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4,430

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Digiode

USA . 2,937 parts In-Stock

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2,937

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Distributors (Availability)

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AZTECH Wire

Italy . 219 parts In-Stock

1+ parts

$12.689

100+ parts

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219

$12.689

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Corohmni

South Africa . 2,014 parts In-Stock

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$24.403

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2,014

$24.403

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One Stop Electronics

USA . 988 parts In-Stock

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$26.000

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988

$26.000

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Parana Technologies

USA . 2,107 parts In-Stock

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$37.500

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2,107

$37.500

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DigiPath Technology Company

USA . 717 parts In-Stock

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$41.292

100+ parts

$37.989

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717

$41.292

$37.989

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IDEA Electronic Components Group

UK . 1,861 parts In-Stock

1+ parts

$42.135

100+ parts

$40.028

1k+ parts

$37.922

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1,861

$42.135

$40.028

$37.922

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ChromeModa Solutions

Germany . 1,458 parts In-Stock

1+ parts

$42.135

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$34.551

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1,458

$42.135

$34.551

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Corphita

USA . 3,271 parts In-Stock

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Overview

Experience the cutting-edge technology and superior performance of the TMX320C30PPM by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments is known for delivering top-quality digital signal processors that excel in various applications. Whether you're in need of exceptional processing power for audio, video, or telecommunications, this DSP offers unmatched value with its efficient design, reliable operation, and advanced features. Upgrade your projects with the TMX320C30PPM and unlock a world of possibilities in signal processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the DSP, making it suitable for a variety of environments.

Surface Mount: YES

Enables easy installation onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 5.25 V

Allows for flexibility in power input, ensuring compatibility with a wide range of systems.

Address Bus Width: 24

Provides a large address space for efficient data processing and memory access.

Package Shape: SQUARE

Optimizes space utilization on circuit boards, facilitating compact designs.

No. of Terminals: 208

Offers ample connectivity options for interfacing with other components and peripherals.

Minimum Supply Voltage: 4.75 V

Ensures stable operation even under varying voltage conditions.

Maximum Operating Temperature: 85 °C

Allows the DSP to function reliably in high-temperature environments.

Minimum Operating Temperature: 0 °C

Ensures the DSP can operate effectively even in low-temperature conditions.

Terminal Position: QUAD

Facilitates easy connection and integration into circuit layouts.

Maximum Seated Height: 4.1 mm

Provides a low profile design for space-constrained applications.

Width: 28 mm

Compact form factor for versatile mounting options.

External Data Bus Width: 32

Enhances data processing capabilities and speeds up operations.

Internal Bus Architecture: MULTIPLE

Optimizes data flow and communication within the DSP for improved performance.

Length: 28 mm

Balanced dimensions for space-efficient placement on PCBs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile support for various peripheral devices and signal processing tasks.

Technology: CMOS

Low power consumption and high noise immunity, suitable for efficient signal processing.

Terminal Form: GULL WING

Allows for easy soldering and secure connections on PCBs.

Nominal Supply Voltage: 5 V

Standard voltage specification for seamless integration into existing systems.

Terminal Pitch: 0.5 mm

Fine pitch layout for high-density mounting and space-saving designs.

Format: FIXED POINT

Precise arithmetic calculations and control for accurate signal processing.

Barrel Shifter: YES

Enhances data manipulation capabilities and speeds up processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C30PPM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Boundary Scan:

NO

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G208

Length:

28 mm

Low Power Mode:

NO

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

TMX320C30PPM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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