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TMX320C44-40PDB

Texas Instruments

TMX320C44-40PDB by Texas Instruments

TMX320C44-40PDB by Texas Instruments is a 32-bit DSP with 5V supply, 40MHz clock frequency, and 4096 RAM words. Ideal for digital signal processing applications requiring high-speed data processing and multiple timers. Features include boundary scan, 24-bit address bus width, and 304 terminals in a square flatpack package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,297 parts In-Stock

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Digiode

USA . 2,256 parts In-Stock

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Inland Empire Components Inc.

USA . 30 parts In-Stock

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30

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One Stop Electronics

USA . 1,179 parts In-Stock

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$2.000

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$2.000

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AZTECH Wire

Italy . 242 parts In-Stock

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$10.850

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$10.850

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Parana Technologies

USA . 1,753 parts In-Stock

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$36.728

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ChromeModa Solutions

Germany . 4,795 parts In-Stock

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$41.267

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$33.839

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$41.267

$33.839

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IDEA Electronic Components Group

UK . 1,721 parts In-Stock

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$41.267

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$39.204

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$37.140

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$37.140

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Corohmni

South Africa . 446 parts In-Stock

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$81.376

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Corphita

USA . 4,072 parts In-Stock

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DigiPath Technology Company

USA . 1,018 parts In-Stock

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$37.206

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Overview

Unlock the power of digital signal processing with the TMX320C44-40PDB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and performance. This DSP is designed for a wide range of applications, offering unparalleled value and benefits to customers. Whether you're in need of high-speed processing or advanced data manipulation, this product provides the reliability and efficiency you're looking for. Upgrade your technology with the TMX320C44-40PDB today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly of electronic devices.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures reliable performance and flexibility in various applications.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width enables fast data processing and storage capabilities.

Address Bus Width: 24

The wide address bus width allows for efficient memory addressing and access.

Package Shape: SQUARE

The square package shape facilitates easy mounting and placement on circuit boards.

Bit Size: 32

A 32-bit architecture allows for high-speed processing and enhanced computational capabilities.

Power Supplies (V): 5

Operating at a standard voltage of 5V ensures compatibility with a wide range of power sources.

No. of Terminals: 304

Having a high number of terminals provides connectivity options for interfacing with external components.

Package Style (Meter): FLATPACK

The flatpack package style offers a slim profile and efficient use of space on a circuit board.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures operation at lower power levels for energy efficiency.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the DSP can perform reliably in demanding environments.

No. of External Interrupts: 5

Having multiple external interrupts allows the DSP to respond quickly to external events or signals.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable operation even in cold conditions.

Terminal Position: QUAD

Quad terminal position provides stability and secure connection with other components.

RAM Words: 4096

With a large number of RAM words, the DSP can store and access a significant amount of data efficiently.

Boundary Scan: YES

Boundary scan feature allows for comprehensive testing and debugging of the DSP during production and operation.

External Data Bus Width: 32

A wide external data bus width enables high-speed data transfer between the DSP and external devices.

Maximum Clock Frequency: 40 MHz

Operating at a high clock frequency of 40 MHz allows for fast processing and response times.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture provides efficient data routing and transfer within the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor enables the product to handle complex signal processing tasks efficiently.

No. of Timers: 2

Having multiple timers allows for precise timing and scheduling of tasks within the DSP.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and ease of soldering during assembly.

Maximum Supply Current: 850 mA

The high maximum supply current ensures the DSP can deliver sufficient power for demanding tasks.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources.

No. of DMA Channels: 6

Having multiple DMA channels allows for efficient data transfer and management within the DSP.

Terminal Pitch: 0.5 mm

A small terminal pitch of 0.5mm provides compact and space-saving connectivity options for the DSP.

Format: FLOATING POINT

Using floating-point format allows for high-precision calculations and accurate signal processing.

Barrel Shifter: YES

Having a barrel shifter improves the efficiency of arithmetic and logical operations within the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C44-40PDB attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

4 COMMUNICATION PORTS

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G304

Low Power Mode:

NO

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

304

No. of Timers:

2

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

HQFP304,1.7SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

4096

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

850 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

TMX320C44-40PDB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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