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TMX320C28PHL

Texas Instruments

TMX320C28PHL by Texas Instruments

TMX320C28PHL by Texas Instruments is a 16-bit DSP with 544 RAM words, operating at 5V. It comes in a rectangular flatpack package style and CMOS technology, suitable for commercial-grade applications requiring fixed-point format processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,015 parts In-Stock

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7,015

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Digiode

USA . 1,531 parts In-Stock

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1,531

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Distributors (Availability)

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One Stop Electronics

USA . 547 parts In-Stock

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$17.000

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547

$17.000

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AZTECH Wire

Italy . 246 parts In-Stock

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$18.971

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246

$18.971

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Parana Technologies

USA . 1,320 parts In-Stock

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$67.915

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$67.915

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IDEA Electronic Components Group

UK . 2,230 parts In-Stock

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$76.309

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$72.494

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$68.678

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2,230

$76.309

$72.494

$68.678

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ChromeModa Solutions

Germany . 1,336 parts In-Stock

1+ parts

$76.309

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$62.573

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1,336

$76.309

$62.573

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Corohmni

South Africa . 168 parts In-Stock

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$77.972

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168

$77.972

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Corphita

USA . 2,003 parts In-Stock

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2,003

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DigiPath Technology Company

USA . 1,736 parts In-Stock

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$68.800

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1,736

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Overview

Unlock the power of cutting-edge technology with the TMX320C28PHL by Texas Instruments. As a leader in digital signal processors, Texas Instruments guarantees top-notch quality and reliability. Ideal for a wide range of applications, this DSP offers unparalleled performance and efficiency. Experience seamless integration and superior processing capabilities, all at a competitive price. Trust Texas Instruments to deliver innovation that exceeds expectations and propels your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic devices, making the DSP a convenient choice for manufacturing processes.

Bit Size: 16

With a larger bit size, this DSP can handle more complex processing tasks and calculations, making it suitable for advanced signal processing applications.

Power Supplies (V): 5

Operating at a standard voltage of 5V, this DSP can be easily integrated into existing systems without the need for additional power conversion.

No. of Terminals: 80

Having a high number of terminals allows for greater connectivity options and functionality, making the DSP versatile and suitable for a wide range of applications.

RAM Words: 544

The large RAM capacity of 544 words enables the DSP to store and process more data simultaneously, improving its performance and efficiency.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this DSP can operate effectively in a variety of environments without overheating.

Minimum Operating Temperature: 0 °C

The DSP can also operate at as low as 0°C, ensuring reliable performance in colder conditions as well.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption and high-speed operation, making the DSP energy-efficient and ideal for battery-powered applications.

Maximum Supply Current: 185 mA

The maximum supply current of 185 mA indicates the power consumption of the DSP, which is important for determining overall system efficiency and design considerations.

Nominal Supply Voltage: 5 V

Operating at a nominal voltage of 5V provides compatibility with standard power sources and ensures reliable performance without voltage fluctuations.

Format: FIXED POINT

The fixed-point format simplifies signal processing calculations and reduces complexity, making the DSP easier to program and integrate into systems.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C28PHL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

16

Format:

FIXED POINT

JESD-30 Code:

R-PQFP-G80

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.7X.9,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

544

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

185 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMX320C28PHL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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