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TMX320C25GBL

Texas Instruments

TMX320C25GBL by Texas Instruments

TMX320C25GBL by Texas Instruments is a 16-bit DSP with 544 RAM words, operating at 5V. It comes in a square grid array package and CMOS technology, suitable for commercial applications requiring fixed-point format processing.

Median Price

$82.564

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 11 parts In-Stock

1+ parts

$82.564

100+ parts

$86.692

1k+ parts

$81.738

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11

$82.564

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$81.738

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Vyrian

USA . 3,042 parts In-Stock

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Digiode

USA . 582 parts In-Stock

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582

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Electronic Expediters

USA . 2 parts In-Stock

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Resion

USA . 1 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 880 parts In-Stock

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$7.525

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One Stop Electronics

USA . 1,508 parts In-Stock

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$34.000

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Parana Technologies

USA . 2,258 parts In-Stock

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$67.892

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DigiPath Technology Company

USA . 1,497 parts In-Stock

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$74.757

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$68.777

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$74.757

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ChromeModa Solutions

Germany . 5,565 parts In-Stock

1+ parts

$76.283

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$62.552

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IDEA Electronic Components Group

UK . 2,293 parts In-Stock

1+ parts

$76.283

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$72.469

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$68.655

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2,293

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Corphita

USA . 4,943 parts In-Stock

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Overview

Upgrade your digital signal processing capabilities with the TMX320C25GBL by Texas Instruments. Known for their high-quality products, Texas Instruments offers a reliable solution for a variety of applications in the DSP category. With its 16-bit size and commercial-grade temperature performance, this DSP provides exceptional value and benefits to customers looking for top-notch processing power. Don't settle for less when you can have the best with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and lightweight, making the product easy to handle and transport.

Package Shape: SQUARE

The square shape allows for easier mounting and integration into various electronic systems.

Bit Size: 16

A bit size of 16 provides a good balance between performance and power consumption.

Power Supplies (V): 5

Operating at 5 volts makes the product compatible with standard power sources, improving compatibility.

No. of Terminals: 68

Having a higher number of terminals allows for more connectivity options and functionality.

Package Style (Meter): GRID ARRAY

The grid array package style provides better thermal conductivity and improved electrical performance.

Maximum Operating Temperature: 70 °C

Being able to operate up to 70°C ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Operating from 0°C and above ensures the product can be used in a wide range of climates.

RAM Words: 544

Having 544 RAM words allows for efficient data storage and processing capabilities.

Temperature Grade: COMMERCIAL

Being classified as commercial grade means the product is suitable for standard commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an efficient choice for signal processing.

Terminal Form: PIN/PEG

The pin/peg terminal form provides secure connections and ease of installation.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 volts ensures compatibility with standard power sources.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, the product offers convenient and precise connections.

Format: FIXED POINT

Using fixed point format allows for efficient and accurate mathematical calculations, making the product suitable for various applications.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C25GBL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

16

Format:

FIXED POINT

JESD-30 Code:

S-PPGA-P68

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

PGA

Package Equivalence Code:

PGA68,11X11

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

544

Sub-Category:

Digital Signal Processors

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMX320C25GBL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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