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TMX320C44PDB

Texas Instruments

TMX320C44PDB by Texas Instruments

TMX320C44PDB by Texas Instruments is a 32-bit DSP with 24-bit address bus width, operating b/w 0-85°C. It features a CMOS technology, GULL WING terminal form, and supports boundary scan. Ideal for digital signal processing applications requiring high-speed data processing in various industries.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 6,055 parts In-Stock

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Digiode

USA . 1,822 parts In-Stock

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Inland Empire Components Inc.

USA . 10 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 9 parts In-Stock

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AZTECH Wire

Italy . 843 parts In-Stock

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$13.652

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One Stop Electronics

USA . 1,083 parts In-Stock

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Corohmni

South Africa . 155 parts In-Stock

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Parana Technologies

USA . 304 parts In-Stock

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ChromeModa Solutions

Germany . 1,845 parts In-Stock

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IDEA Electronic Components Group

UK . 25 parts In-Stock

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$50.014

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$47.381

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DigiPath Technology Company

USA . 1,195 parts In-Stock

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Corphita

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Assy Fe

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Overview

Unlock the power of advanced digital signal processing with the Texas Instruments TMX320C44PDB. Designed with precision and expertise by a trusted industry leader, this DSP offers unparalleled performance and reliability in a wide range of applications. From audio processing to telecommunications, this versatile chip delivers high-quality results with ease. Experience the value and benefits of cutting-edge technology with the TMX320C44PDB, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for efficient PCB assembly and saves space, making the product suitable for compact designs.

Maximum Supply Voltage: 5.25 V

The higher supply voltage tolerance provides flexibility and reliability in various operating conditions.

Address Bus Width: 24

The wide address bus width allows for processing larger amounts of data efficiently.

Package Shape: SQUARE

The square package shape is easy to handle and mount, contributing to ease of installation.

No. of Terminals: 304

Having a higher number of terminals allows for more connectivity options and functionality.

Package Style (Meter): FLATPACK

The flatpack style offers a compact and low-profile package design suitable for space-constrained applications.

Minimum Supply Voltage: 4.75 V

The lower supply voltage threshold ensures the product can operate efficiently even under low voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand elevated temperature environments without performance degradation.

Minimum Operating Temperature: 0 °C

The product can function effectively even in low-temperature conditions, ensuring reliability in various operating environments.

Terminal Position: QUAD

The quad terminal position provides multiple connection points for improved signal routing and connectivity.

Boundary Scan: YES

Having boundary scan capability allows for efficient testing and diagnosis of the product during manufacturing and maintenance.

External Data Bus Width: 32

A wider external data bus width enables faster data transfer and processing speed, enhancing overall performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture optimizes data flow and communication within the processor, increasing efficiency.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The versatility offered by supporting various peripheral IC types enhances the product's compatibility with different systems and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and inspection during assembly, ensuring a robust and reliable connection.

Nominal Supply Voltage: 5 V

Having a stable nominal supply voltage simplifies the power management design and ensures consistent performance.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and accelerates signal processing tasks, improving overall efficiency.

Barrel Shifter: YES

The presence of a barrel shifter allows for efficient bit manipulation and data processing operations, enhancing computational capabilities.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C44PDB attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G304

Low Power Mode:

NO

No. of Terminals:

304

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Peripheral IC Type:

Trade Compliance

TMX320C44PDB Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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