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TMX320C28FZL

Texas Instruments

TMX320C28FZL by Texas Instruments

TMX320C28FZL by Texas Instruments is a 16-bit DSP with 544 RAM words, operating at 5V. It comes in a ceramic chip carrier package with J bend terminals and operates b/w 0-70°C. Ideal for commercial applications requiring fixed-point technology and high processing power.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,276 parts In-Stock

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Digiode

USA . 4,209 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 828 parts In-Stock

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$10.601

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828

$10.601

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One Stop Electronics

USA . 360 parts In-Stock

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$27.000

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360

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Parana Technologies

USA . 1,390 parts In-Stock

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$58.596

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$58.596

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IDEA Electronic Components Group

UK . 1,864 parts In-Stock

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$65.838

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$62.546

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$59.254

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1,864

$65.838

$62.546

$59.254

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ChromeModa Solutions

Germany . 974 parts In-Stock

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$65.838

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$53.987

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974

$65.838

$53.987

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Corohmni

South Africa . 673 parts In-Stock

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$82.639

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673

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Corphita

USA . 4,277 parts In-Stock

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DigiPath Technology Company

USA . 975 parts In-Stock

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$59.360

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975

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Overview

Unleash the power of digital signal processing with the TMX320C28FZL by Texas Instruments. This cutting-edge DSP offers unmatched quality and reliability, making it the top choice for a wide range of applications. From audio processing to telecommunications, this versatile chip delivers superior performance and efficiency. Experience the benefits of Texas Instruments' advanced technology and elevate your projects to new heights with the TMX320C28FZL.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high thermal conductivity and durability, making it ideal for applications that require excellent heat dissipation and robustness.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, making the product suitable for mass production and compact designs.

Bit Size: 16

A 16-bit DSP offers a good balance between performance and cost, making it suitable for a wide range of signal processing applications.

Power Supplies (V): 5

Having a standard power supply voltage of 5V simplifies the design process and allows for easy integration into existing systems.

No. of Terminals: 68

Having a high number of terminals provides flexibility in connecting the DSP to other components, allowing for complex signal processing tasks to be performed.

Package Style (Meter): CHIP CARRIER

Chip carrier packages are known for their compact size and good thermal performance, making them suitable for applications where space and heat dissipation are critical.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the DSP can reliably operate in a wide range of environments, ensuring stability and performance under varying conditions.

Minimum Operating Temperature: 0 °C

The DSP can operate at low temperatures, making it suitable for applications where cold environments may be encountered.

RAM Words: 544

With a large amount of RAM, the DSP can store and process a significant amount of data efficiently, enabling complex signal processing algorithms to be executed effectively.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the DSP energy-efficient and capable of handling demanding processing tasks.

Maximum Supply Current: 185 mA

The maximum supply current specification provides valuable information for system designers to ensure that the power supply can meet the current requirements of the DSP, preventing potential issues related to power delivery.

Nominal Supply Voltage: 5 V

A standard nominal supply voltage of 5V ensures compatibility with a wide range of power sources and simplifies the integration of the DSP into various systems.

Format: FIXED POINT

Fixed-point format simplifies mathematical calculations in the DSP, making it efficient for applications that do not require high precision arithmetic operations.

Technical Specifications

Digital Signal Processors (DSPs) TMX320C28FZL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Bit Size:

16

Format:

FIXED POINT

JESD-30 Code:

S-XQCC-J68

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

544

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

185 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMX320C28FZL Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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