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MC56F8322MFA60

NXP Semiconductors

MC56F8322MFA60 by NXP Semiconductors

MC56F8322MFA60 by NXP Semiconductors is a 48-terminal DSP with max clock freq of 120MHz. Ideal for automotive applications, it operates b/w -40 to 125 °C and features low power mode, barrel shifter, and boundary scan capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,797 parts In-Stock

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Anansix

USA . 1,141 parts In-Stock

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Vyrian

USA . 1,008 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Ampacity Inc.

Singapore . 895 parts In-Stock

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$13.000

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895

$13.000

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Vigor

Singapore . 334 parts In-Stock

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$15.320

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AZTECH Wire

Italy . 560 parts In-Stock

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$16.726

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Aztec Data Supply Inc.

USA . 1,543 parts In-Stock

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$22.450

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One Stop Electronics

USA . 2,030 parts In-Stock

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$24.000

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$24.000

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Semicontronic

India . 1,001 parts In-Stock

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$30.000

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$29.250

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$29.100

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$29.100

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Corohmni

South Africa . 2,194 parts In-Stock

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$61.861

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Corphita

USA . 4,432 parts In-Stock

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Argo Parts USA

USA . 3,148 parts In-Stock

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UNI Independent Distributors

Spain . 2,795 parts In-Stock

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Microchip USA

USA . 1,415 parts In-Stock

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Continental Prestige Electronics

USA . 1,009 parts In-Stock

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Bastille Electronics

Australia . 22 parts In-Stock

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Overview

Experience the power and precision of the MC56F8322MFA60 by NXP Semiconductors, a leading manufacturer in the industry. This Digital Signal Processor (DSP) offers exceptional performance and versatility for a wide range of applications. From automotive to industrial automation, this product delivers unparalleled value with its cutting-edge technology and low power mode. Discover the advantages of seamless integration and high-speed processing, making it the ideal choice for your next project. Elevate your designs with the MC56F8322MFA60 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is known for its durability and reliability, making the product resistant to external factors such as high temperatures and moisture.

Surface Mount: YES

Surface mount technology allows for compact and efficient PCB designs, saving space and reducing overall system size.

Maximum Supply Voltage: 2.75 V

A higher maximum supply voltage allows for increased flexibility in power supply options, accommodating a wider range of applications.

Package Shape: SQUARE

A square package shape is convenient for efficient PCB layout and component placement, optimizing thermal performance and signal routing.

No. of Terminals: 48

Having a high number of terminals allows for more connectivity options, enabling the DSP to interface with various other components in a system.

Maximum Clock Frequency: 120 MHz

A high maximum clock frequency signifies fast processing capabilities, making the DSP suitable for tasks requiring real-time data processing and high-speed calculations.

Technical Specifications

Digital Signal Processors (DSPs) MC56F8322MFA60 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

120 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

Low Power Mode:

YES

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Trade Compliance

MC56F8322MFA60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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