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TMS320F2812PGFQ

Texas Instruments

TMS320F2812PGFQ by Texas Instruments

TMS320F2812PGFQ by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 18432 RAM words, and 16-bit data RAM width. Ideal for automotive applications due to AEC-Q100 screening level, low power mode, and 3 external interrupts for enhanced performance in harsh environments.

Median Price

$28.826

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2 parts In-Stock

1+ parts

$10.799

100+ parts

$10.671

1k+ parts

$10.612

10k+ parts

-

2

$10.799

$10.671

$10.612

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Farnell

UK . 195 parts In-Stock

1+ parts

$23.070

100+ parts

$17.330

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-

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$23.070

$17.330

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Verical

USA . 2 parts In-Stock

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$24.033

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2

$24.033

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Texas Instruments

USA . 323 parts In-Stock

1+ parts

$26.873

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$23.887

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$17.564

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323

$26.873

$23.887

$17.564

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Newark

USA . 195 parts In-Stock

1+ parts

$30.780

100+ parts

$24.240

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$23.120

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195

$30.780

$24.240

$23.120

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Chip1Stop

Japan . 2 parts In-Stock

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$33.750

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$33.750

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DigiKey

USA . 431 parts In-Stock

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$45.750

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$34.518

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$31.915

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431

$45.750

$34.518

$31.915

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Element14

Singapore . 195 parts In-Stock

1+ parts

$46.390

100+ parts

$36.530

1k+ parts

$34.840

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195

$46.390

$36.530

$34.840

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Distributors (In-Stock)

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Digiode

USA . 2,963 parts In-Stock

1+ parts

$25.529

100+ parts

-

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2,963

$25.529

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Nova Conductors

Japan . 99 parts In-Stock

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$30.561

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$30.561

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Chip Stock

USA . 5,414 parts In-Stock

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Vyrian

USA . 4,746 parts In-Stock

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Semtec, LLC

USA . 68 parts In-Stock

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68

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Bristol Electronics

USA . 40 parts In-Stock

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40

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Martec Srl

Italy . 10 parts In-Stock

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10

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Speed Components Ltd

Israel . 3 parts In-Stock

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Sensible Micro Corp

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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AZTECH Wire

Italy . 585 parts In-Stock

1+ parts

$15.465

100+ parts

-

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585

$15.465

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Ampacity Inc.

Singapore . 85 parts In-Stock

1+ parts

$22.840

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85

$22.840

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Semicontronic

India . 85 parts In-Stock

1+ parts

$22.840

100+ parts

$22.269

1k+ parts

$22.155

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85

$22.840

$22.269

$22.155

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Parana Technologies

USA . 644 parts In-Stock

1+ parts

$24.097

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-

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$24.750

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644

$24.097

-

$24.750

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Corphita

USA . 1,512 parts In-Stock

1+ parts

$24.186

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$24.186

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DigiPath Technology Company

USA . 1,432 parts In-Stock

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$26.534

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$26.534

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ChromeModa Solutions

Germany . 5,522 parts In-Stock

1+ parts

$27.075

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$22.202

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5,522

$27.075

$22.202

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IDEA Electronic Components Group

UK . 2,107 parts In-Stock

1+ parts

$27.075

100+ parts

$25.721

1k+ parts

$24.368

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2,107

$27.075

$25.721

$24.368

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Corohmni

South Africa . 3,086 parts In-Stock

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$27.177

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$27.177

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Continental Prestige Electronics

USA . 2,848 parts In-Stock

1+ parts

$28.015

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$27.454

2,848

$28.015

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$27.454

Bastille Electronics

Australia . 300 parts In-Stock

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$30.560

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$29.032

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$27.198

300

$30.560

$29.032

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$27.198

Advanced Electronics

New Zealand . 61 parts In-Stock

1+ parts

$56.435

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$51.356

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$46.277

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61

$56.435

$51.356

$46.277

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Microchip USA

USA . 1,091 parts In-Stock

1+ parts

$81.860

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$80.430

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$79.720

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$79.010

1,091

$81.860

$80.430

$79.720

$79.010

iodParts Technologies Inc.

India . 10,713 parts In-Stock

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Lixinc

USA . 6,644 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Formix International (Excess)

India . 1,969 parts In-Stock

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1,969

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Futuretech Components

Singapore . 1,040 parts In-Stock

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Infinite Electronics LLP (Excess)

. 852 parts In-Stock

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852

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Argo Parts USA

USA . 423 parts In-Stock

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423

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

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$2.509

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$2.509

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$2.509

100

-

$2.509

$2.509

$2.509

Overview

Experience unparalleled performance and reliability with the TMS320F2812PGFQ by Texas Instruments, a leading manufacturer in the industry. This advanced Digital Signal Processor (DSP) offers cutting-edge technology for a wide range of applications, from automotive to industrial control systems. With its 32-bit architecture and low power mode, this product provides exceptional value, efficiency, and precision to customers looking for top-tier performance. Upgrade your projects with the TMS320F2812PGFQ and elevate your designs to the next level of excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 2 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

On Chip Data RAM Width: 16

The wide on-chip data RAM width enables fast data processing and manipulation.

Address Bus Width: 19

The large address bus width allows for accessing a larger memory space, enhancing the product's performance.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures the product's reliability and suitability for automotive applications.

Package Shape: SQUARE

The square package shape makes it easier to mount and integrate into various systems.

Bit Size: 32

The 32-bit size enhances the processing capabilities and speed of the product.

Power Supplies (V): 1.9,3.3

The availability of multiple power supply options provides flexibility in different operating conditions.

No. of Terminals: 176

The high number of terminals allows for a greater range of connections and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style options offer versatility in installation and space-saving benefits.

Minimum Supply Voltage: 1.81 V

The low minimum supply voltage ensures efficient power consumption and operation.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures reliability in extreme conditions.

CPU Family: C28X

The C28X CPU family provides advanced processing capabilities for demanding applications.

No. of External Interrupts: 3

The availability of external interrupts allows for efficient handling of external events and real-time operations.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2812PGFQ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 SUPPLY AT 135MHZ

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

176

No. of Timers:

8

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

OTPROM

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320F2812PGFQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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