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TMS320DM8168CCYG2

Texas Instruments

TMS320DM8168CCYG2 by Texas Instruments

TMS320DM8168CCYG2 by Texas Instruments is a 32-bit DSP with integrated cache, 15-bit address bus width, and 32-bit external data bus width. Ideal for commercial applications requiring low power mode, it features multiple internal bus architecture and 72 DMA channels for efficient processing.

Median Price

$150.350

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 1,338 parts In-Stock

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$116.782

100+ parts

$113.270

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$87.806

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1,338

$116.782

$113.270

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Chip1Stop

Japan . 6 parts In-Stock

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$124.310

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Arrow

USA . 4 parts In-Stock

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$150.330

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$128.920

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$150.330

$128.920

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Verical

USA . 4 parts In-Stock

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$150.370

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$128.920

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4

$150.370

$128.920

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DigiKey

USA . 152 parts In-Stock

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$196.250

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$156.480

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$156.480

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Mouser Electronics

USA . 27 parts In-Stock

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$197.250

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$160.490

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$197.250

$160.490

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Distributors (In-Stock)

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Digiode

USA . 4,046 parts In-Stock

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$110.943

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4,046

$110.943

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Nova Conductors

Japan . 84 parts In-Stock

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$145.407

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Vyrian

USA . 3,950 parts In-Stock

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Chip Stock

USA . 3,500 parts In-Stock

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Elcom Components

USA . 60 parts In-Stock

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Velocity Electronics

USA . 56 parts In-Stock

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Sensible Micro Corp

USA . 42 parts In-Stock

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Bristol Electronics

USA . 18 parts In-Stock

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Atlantic Semiconductor

USA . 18 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Dan-Mar Components

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Distributors (Availability)

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Parana Technologies

USA . 1,090 parts In-Stock

1+ parts

$46.350

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1,090

$46.350

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DigiPath Technology Company

USA . 2,022 parts In-Stock

1+ parts

$51.037

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$46.954

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2,022

$51.037

$46.954

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ChromeModa Solutions

Germany . 4,603 parts In-Stock

1+ parts

$52.079

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$42.705

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4,603

$52.079

$42.705

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IDEA Electronic Components Group

UK . 621 parts In-Stock

1+ parts

$52.079

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$49.475

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$46.871

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621

$52.079

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$46.871

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Corohmni

South Africa . 577 parts In-Stock

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$57.084

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577

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Advanced Electronics

New Zealand . 75 parts In-Stock

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$83.701

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$79.516

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$79.516

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Ampacity Inc.

Singapore . 267 parts In-Stock

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$99.260

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Semicontronic

India . 267 parts In-Stock

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$99.260

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$96.778

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$96.282

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$99.260

$96.778

$96.282

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Corphita

USA . 4,153 parts In-Stock

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$105.104

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Microchip USA

USA . 1,962 parts In-Stock

1+ parts

$143.270

100+ parts

$139.450

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$137.540

10k+ parts

$135.630

1,962

$143.270

$139.450

$137.540

$135.630

Continental Prestige Electronics

USA . 5,665 parts In-Stock

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$145.407

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$142.499

5,665

$145.407

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$142.499

Netroflash

USA . 2,000 parts In-Stock

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$145.407

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2,000

$145.407

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Perfect Parts

USA . 756 parts In-Stock

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Argo Parts USA

USA . 620 parts In-Stock

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Lixinc

USA . 574 parts In-Stock

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Emar International I/E

Canada . 50 parts In-Stock

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Kepictronics

USA . 44 parts In-Stock

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Overview

Experience superior performance and efficiency with the TMS320DM8168CCYG2 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge Digital Signal Processors that are ideal for a wide range of applications. From multimedia systems to communications equipment, this DSP offers unparalleled value and benefits to customers. With integrated cache, low power mode, and advanced technology, this product ensures optimal functionality and reliability. Elevate your projects with the TMS320DM8168CCYG2 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the DSP, ensuring a longer lifespan and reliability.

Integrated Cache: YES

Integrated cache helps in faster data processing and improves overall efficiency of the DSP.

Surface Mount: YES

Surface mount technology allows for easy and compact installation of the DSP onto circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05V ensures energy efficiency and helps in reducing power consumption.

Address Bus Width: 15

A wider address bus width of 15 allows for efficient memory addressing, enhancing the overall performance of the DSP.

Package Shape: SQUARE

Square package shape provides uniformity in design and allows for easy integration into various electronic devices.

Bit Size: 32

A 32-bit architecture enables the DSP to handle large data sets and complex algorithms efficiently.

No. of Terminals: 1031

Having a large number of terminals enables connectivity to multiple peripherals and external devices, making the DSP versatile and adaptable.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

Grid array package style with heat sink/slug allows for effective heat dissipation, ensuring optimal performance under heavy workloads.

Minimum Supply Voltage: 0.95 V

Operating at a minimum supply voltage of 0.95V helps in reducing power consumption and improving energy efficiency.

Maximum Operating Temperature: 95 °C

With a maximum operating temperature of 95°C, the DSP can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures reliable performance in various environmental conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Terminal finish with tin/silver/copper provides corrosion resistance and ensures a reliable electrical connection.

Terminal Position: BOTTOM

Bottom terminal position allows for easy installation and connectivity to other components within the electronic system.

Maximum Seated Height: 3.31 mm

Compact maximum seated height of 3.31mm enables the DSP to be used in space-constrained electronic devices.

RAM Words: 16384

With 16384 RAM words, the DSP can store and access data quickly, improving overall processing speed and efficiency.

Width: 25 mm

Compact width of 25mm allows for easy integration into various electronic systems without taking up too much space.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the DSP during the manufacturing process, ensuring high quality and reliability.

External Data Bus Width: 32

A wide external data bus width of 32 bits enables faster data transfer between the DSP and external devices, improving overall performance.

Peak Reflow Temperature °C: 245

Peak reflow temperature of 245°C ensures reliable soldering during the manufacturing process, resulting in a durable and long-lasting product.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data processing capabilities and allows for efficient communication between different components within the DSP.

Length: 25 mm

Compact length of 25mm enables the DSP to be used in various electronic devices without compromising on functionality.

Temperature Grade: COMMERCIAL

Commercial grade temperature rating ensures reliable performance in standard operating conditions, making it suitable for a wide range of applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Being a digital signal processor with mixed peripheral IC type, this DSP can handle a variety of tasks and is versatile in its application.

No. of Timers: 8

Having 8 timers allows for precise time measurement and synchronization, making the DSP suitable for applications that require accurate timing.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the DSP energy efficient and effective in data processing.

Terminal Form: BALL

Ball terminal form ensures easy installation and connectivity, making it suitable for automated manufacturing processes.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1V ensures stable performance and energy efficiency in various operating conditions.

No. of DMA Channels: 72

Having 72 DMA channels enables efficient data transfer between memory and peripherals, enhancing overall system performance.

Terminal Pitch: 0.65 mm

Compact terminal pitch of 0.65mm allows for high density mounting and efficient connectivity within electronic systems.

Format: FLOATING POINT

Floating point format allows for high precision arithmetic calculations and complex data processing, making the DSP suitable for demanding computational tasks.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the DSP is less sensitive to moisture, ensuring reliable performance in humid environments.

Low Power Mode: YES

Having a low power mode option allows the DSP to operate efficiently in power-constrained environments, extending the battery life of portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8168CCYG2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

72

No. of Terminals:

No. of Timers:

8

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8168CCYG2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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