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SM320F28335GJZMEP

Texas Instruments

SM320F28335GJZMEP by Texas Instruments

The Texas Instruments SM320F28335GJZMEP is a DSP with 32-bit external data bus width, 150 MHz max clock frequency, and 20 ADC channels. Ideal for military applications due to its -55 to 125 °C operating temperature range and fine pitch grid array package style. It features low power mode and multiple internal bus architecture for efficient signal processing tasks.

Median Price

$90.720

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 307 parts In-Stock

1+ parts

$60.588

100+ parts

$53.856

1k+ parts

$39.600

10k+ parts

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307

$60.588

$53.856

$39.600

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DigiKey

USA . 437 parts In-Stock

1+ parts

$90.720

100+ parts

$72.030

1k+ parts

$67.385

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437

$90.720

$72.030

$67.385

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Mouser Electronics

USA . 294 parts In-Stock

1+ parts

$90.720

100+ parts

$67.390

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-

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294

$90.720

$67.390

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Distributors (In-Stock)

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Bristol Electronics

USA . 12 parts In-Stock

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$54.000

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12

$54.000

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Digiode

USA . 1,628 parts In-Stock

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$57.559

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1,628

$57.559

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Nova Conductors

Japan . 41 parts In-Stock

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$63.360

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41

$63.360

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Vyrian

USA . 6,452 parts In-Stock

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Holdelec - ElecDif-Pro

France . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 840 parts In-Stock

1+ parts

$11.771

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840

$11.771

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Corohmni

South Africa . 123 parts In-Stock

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$45.928

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123

$45.928

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Ampacity Inc.

Singapore . 245 parts In-Stock

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$51.500

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$51.500

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Corphita

USA . 2,556 parts In-Stock

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$54.529

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2,556

$54.529

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Continental Prestige Electronics

USA . 4,750 parts In-Stock

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$63.360

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$62.093

4,750

$63.360

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$62.093

Netroflash

USA . 500 parts In-Stock

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$63.360

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500

$63.360

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Parana Technologies

USA . 2,337 parts In-Stock

1+ parts

$73.753

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2,337

$73.753

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DigiPath Technology Company

USA . 2,046 parts In-Stock

1+ parts

$81.211

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2,046

$81.211

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ChromeModa Solutions

Germany . 5,458 parts In-Stock

1+ parts

$82.868

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$67.952

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5,458

$82.868

$67.952

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IDEA Electronic Components Group

UK . 513 parts In-Stock

1+ parts

$82.868

100+ parts

$78.725

1k+ parts

$74.581

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513

$82.868

$78.725

$74.581

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Microchip USA

USA . 2,274 parts In-Stock

1+ parts

$157.800

100+ parts

$155.060

1k+ parts

$153.690

10k+ parts

$152.310

2,274

$157.800

$155.060

$153.690

$152.310

iodParts Technologies Inc.

India . 8,016 parts In-Stock

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Argo Parts USA

USA . 4,966 parts In-Stock

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Lixinc

USA . 4,780 parts In-Stock

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Perfect Parts

USA . 3,334 parts In-Stock

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Kepictronics

USA . 3,000 parts In-Stock

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Epart123

USA . 2,600 parts In-Stock

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$83.000

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$83.000

Futuretech Components

Singapore . 665 parts In-Stock

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665

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Overview

Experience unparalleled performance and reliability with the Texas Instruments SM320F28335GJZMEP Digital Signal Processor. As a leader in innovative technology, Texas Instruments brings you a cutting-edge solution for a wide range of applications. Whether you're working on industrial automation, power electronics, or motor control systems, this DSP offers superior processing power, high-speed clock frequency, and advanced features to optimize your designs. Trust in Texas Instruments to deliver top-of-the-line quality and efficiency, providing you with the competitive edge you need to succeed in today's fast-paced market. Elevate your projects with the SM320F28335GJZMEP and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, ensuring long-term reliability.

Surface Mount: YES

Enables easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 1.995 V

Allows for stable and safe operation under varying voltage conditions.

Address Bus Width: 20

Provides ample addressing capability to handle complex data processing tasks efficiently.

Package Shape: SQUARE

Optimal shape for space efficiency and easy integration into compact electronic devices.

No. of Terminals: 176

Sufficient terminals for connecting to external components and interfaces, enhancing the DSP's functionality.

Minimum Supply Voltage: 1.805 V

Allows for low-power operation while maintaining performance, reducing power consumption.

Maximum Operating Temperature: 125 °C

Ensures reliable operation even under high-temperature conditions, making it suitable for various environments.

CPU Family: C28X

Part of a recognized CPU family known for its performance and reliability in signal processing applications.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold conditions, expanding its usability in different temperature environments.

Terminal Finish: TIN LEAD

Provides good solderability and conductivity for reliable connections in the manufacturing process.

ADC Channels: YES

Integration of analog-to-digital converters enables the DSP to interface with analog signals, widening its application range.

Terminal Position: BOTTOM

Facilitates easier PCB layout and component placement in the overall system design.

Maximum Seated Height: 2.05 mm

Low profile design for space-constrained applications, allowing for compact and slim device designs.

Width: 15 mm

Compact form factor for easy integration into different electronic systems and devices.

Boundary Scan: YES

Enables testing and debugging capabilities for the DSP, ensuring easier development and troubleshooting processes.

External Data Bus Width: 32

Wide data bus width for efficient data transfer and processing, enhancing the DSP's overall performance.

Maximum Clock Frequency: 150 MHz

High clock frequency for fast data processing, making the DSP suitable for real-time signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 20

Sufficient time for the solder reflow process during manufacturing, ensuring proper solder joint formation.

Peak Reflow Temperature °C: 235

Suitable reflow temperature for the soldering process, maintaining component integrity during assembly.

Internal Bus Architecture: MULTIPLE

Multiple internal buses allow for efficient data transfer within the DSP, improving overall performance and throughput.

Length: 15 mm

Compact dimensions for versatile placement options in electronic assemblies.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, ensuring reliability and durability in harsh environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

A specialized IC type dedicated to digital signal processing tasks, offering optimized performance for signal processing applications.

RAM Bytes: 69632

Ample RAM capacity for storing and processing data, enabling complex signal processing algorithms and applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, improving overall efficiency and reliability.

Terminal Form: BALL

Ball terminal form for reliable and secure connections during assembly and operation.

Nominal Supply Voltage: 1.9 V

Stable nominal supply voltage for consistent operation and performance of the DSP.

No. of DMA Channels: 6

Multiple DMA channels for efficient data transfer, reducing CPU load and improving overall system performance.

PWM Channels: YES

Integration of PWM channels for precise control and modulation of signals, expanding the DSP's application range.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting, allowing for compact designs and space-saving layouts.

Format: FLOATING POINT

Floating-point format for accurate and efficient mathematical operations, crucial for signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the DSP is suitable for reflow soldering, ensuring reliability in manufacturing processes.

Low Power Mode: YES

Incorporation of low power mode for energy efficiency and extended battery life in portable electronic devices.

Technical Specifications

Digital Signal Processors (DSPs) SM320F28335GJZMEP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

20

Barrel Shifter:

NO

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B176

JESD-609 Code:

e0

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of Terminals:

176

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

235

RAM Bytes:

69632

Maximum Seated Height:

2.05 mm

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.805 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15 mm

Peripheral IC Type:

Trade Compliance

SM320F28335GJZMEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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