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SM320C30HFGM40

Texas Instruments

SM320C30HFGM40 by Texas Instruments

Texas Instruments SM320C30HFGM40 is a 32-bit DSP with 5V supply, 40MHz clock, and 1024 RAM words. Ideal for military applications due to its -55 to 125 °C operating range and ceramic-metal package. Features include floating-point format, low power mode, and barrel shifter for efficient signal processing.

Median Price

$1,216.460

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8 parts In-Stock

1+ parts

$973.170

100+ parts

$914.780

1k+ parts

$856.390

10k+ parts

-

8

$973.170

$914.780

$856.390

-

DigiKey

USA . 8 parts In-Stock

1+ parts

$1,216.460

100+ parts

-

1k+ parts

-

10k+ parts

-

8

$1,216.460

-

-

-

Verical

USA . 8 parts In-Stock

1+ parts

$1,216.463

100+ parts

$1,143.475

1k+ parts

$1,070.487

10k+ parts

-

8

$1,216.463

$1,143.475

$1,070.487

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,707 parts In-Stock

1+ parts

$1,073.462

100+ parts

-

1k+ parts

-

10k+ parts

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2,707

$1,073.462

-

-

-

Vyrian

USA . 5,511 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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5,511

-

-

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Mil-Aero Solutions, Inc.

USA . 17 parts In-Stock

1+ parts

-

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-

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17

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DigiKey Marketplace

USA . 9 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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9

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,177 parts In-Stock

1+ parts

$36.231

100+ parts

-

1k+ parts

-

10k+ parts

-

2,177

$36.231

-

-

-

DigiPath Technology Company

USA . 726 parts In-Stock

1+ parts

$39.895

100+ parts

$36.703

1k+ parts

-

10k+ parts

-

726

$39.895

$36.703

-

-

ChromeModa Solutions

Germany . 4,646 parts In-Stock

1+ parts

$40.709

100+ parts

$33.381

1k+ parts

-

10k+ parts

-

4,646

$40.709

$33.381

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IDEA Electronic Components Group

UK . 988 parts In-Stock

1+ parts

$40.709

100+ parts

$38.674

1k+ parts

$36.638

10k+ parts

-

988

$40.709

$38.674

$36.638

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Corohmni

South Africa . 2,850 parts In-Stock

1+ parts

$59.550

100+ parts

-

1k+ parts

-

10k+ parts

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2,850

$59.550

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-

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Microchip USA

USA . 1,585 parts In-Stock

1+ parts

$555.360

100+ parts

$527.590

1k+ parts

$513.700

10k+ parts

$515.440

1,585

$555.360

$527.590

$513.700

$515.440

Corphita

USA . 4,122 parts In-Stock

1+ parts

$1,016.964

100+ parts

-

1k+ parts

-

10k+ parts

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4,122

$1,016.964

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-

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Component Stockers USA

USA . 22 parts In-Stock

1+ parts

-

100+ parts

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22

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Overview

Unleash the power of cutting-edge technology with the Texas Instruments SM320C30HFGM40 Digital Signal Processor. Manufactured by industry leader Texas Instruments, this high-quality DSP offers unmatched performance and reliability for a wide range of applications. Whether you're looking to enhance audio quality, improve image processing, or optimize communications systems, this versatile processor delivers exceptional value and benefits to customers. Experience the advantages of advanced signal processing capabilities and elevate your projects to new heights with the SM320C30HFGM40 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material ensures excellent durability and reliability, making this product suitable for harsh environments.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power supply design and operation, accommodating various voltage requirements.

Bit Size: 32

With a 32-bit architecture, this product is capable of handling complex algorithms and processing tasks efficiently, making it ideal for advanced signal processing applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in extreme temperature conditions, making this product suitable for industrial and automotive applications.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for efficient data transfer and processing within the DSP, enhancing overall performance and speed.

Low Power Mode: YES

The ability to operate in a low power mode helps in reducing power consumption and extending battery life, making this product energy-efficient and suitable for portable devices.

Technical Specifications

Digital Signal Processors (DSPs) SM320C30HFGM40 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CQFP-F196

Length:

34.29 mm

Low Power Mode:

YES

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Serial I/Os:

2

No. of Terminals:

196

No. of Timers:

2

On Chip Data RAM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

TPAK196,2.5SQ,25

Package Shape:

Package Style (Meter):

FLATPACK, GUARD RING

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

600 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

34.29 mm

Peripheral IC Type:

Trade Compliance

SM320C30HFGM40 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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