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SM320F2812PGFMEPG4

Texas Instruments

SM320F2812PGFMEPG4 by Texas Instruments

The Texas Instruments SM320F2812PGFMEPG4 is a 32-bit DSP with 16-bit data RAM and 19-bit address bus. Operating at up to 150 MHz, it features 8 timers, ADC channels, and PWM channels. Ideal for military applications due to its low power mode, FLASH ROM programmability, and boundary scan capability.

Median Price

$86.350

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 88 parts In-Stock

1+ parts

$86.350

100+ parts

$54.860

1k+ parts

$54.850

10k+ parts

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88

$86.350

$54.860

$54.850

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,940 parts In-Stock

1+ parts

$49.723

100+ parts

-

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1,940

$49.723

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Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$51.090

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870

$51.090

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Vyrian

USA . 5,127 parts In-Stock

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5,127

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Chip Stock

USA . 3,550 parts In-Stock

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3,550

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Distributors (Availability)

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AZTECH Wire

Italy . 560 parts In-Stock

1+ parts

$7.667

100+ parts

-

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560

$7.667

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Ampacity Inc.

Singapore . 40 parts In-Stock

1+ parts

$44.490

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40

$44.490

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Corphita

USA . 151 parts In-Stock

1+ parts

$47.106

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$47.106

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Continental Prestige Electronics

USA . 5,408 parts In-Stock

1+ parts

$51.090

100+ parts

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$50.068

5,408

$51.090

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$50.068

Parana Technologies

USA . 1,147 parts In-Stock

1+ parts

$53.816

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$53.816

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IDEA Electronic Components Group

UK . 1,570 parts In-Stock

1+ parts

$60.467

100+ parts

$57.444

1k+ parts

$54.420

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1,570

$60.467

$57.444

$54.420

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ChromeModa Solutions

Germany . 1,426 parts In-Stock

1+ parts

$60.467

100+ parts

$49.583

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1,426

$60.467

$49.583

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Corohmni

South Africa . 2,140 parts In-Stock

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$70.705

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2,140

$70.705

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Microchip USA

USA . 941 parts In-Stock

1+ parts

$116.890

100+ parts

$114.850

1k+ parts

$113.840

10k+ parts

$112.820

941

$116.890

$114.850

$113.840

$112.820

QUARKTWIN TECHNOLOGY LTD

USA . 24,735 parts In-Stock

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Argo Parts USA

USA . 3,497 parts In-Stock

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3,497

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DigiPath Technology Company

USA . 1,123 parts In-Stock

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$54.517

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1,123

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$54.517

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Kepictronics

USA . 620 parts In-Stock

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620

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Overview

Unleash the power of cutting-edge technology with the SM320F2812PGFMEPG4 from Texas Instruments. As a top-tier manufacturer in the industry, Texas Instruments offers unparalleled quality and reliability. This Digital Signal Processor is perfect for a wide range of applications, providing customers with seamless performance and efficiency. With its advanced features and high-speed processing capabilities, this product delivers exceptional value, benefits, and advantages to meet all your digital signal processing needs. Experience innovation like never before with the SM320F2812PGFMEPG4 by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for a compact design and easy installation on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 2 V

Operating at a maximum supply voltage of 2 V ensures efficient power consumption and reduces the risk of damage from voltage spikes.

On Chip Data RAM Width: 16

Having a wider data RAM width allows for faster data processing and storage, enhancing the performance of the DSP.

Address Bus Width: 19

A wider address bus width enables the DSP to access a larger memory address space, facilitating complex data processing tasks.

Package Shape: SQUARE

The square package shape helps in easy mounting and alignment on PCBs, ensuring a secure and stable connection.

Bit Size: 32

A 32-bit architecture enables the DSP to handle larger data sets and perform calculations with higher precision, making it suitable for demanding applications.

Power Supplies (V): 1.9,3.3

Support for multiple power supply voltages provides flexibility in design and compatibility with different voltage requirements.

No. of Terminals: 176

Having a higher number of terminals allows for more connectivity options and interfaces, enhancing the versatility of the DSP.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The package style options offer a variety of form factors for different design requirements, ensuring compatibility with various PCB layouts.

Minimum Supply Voltage: 1.81 V

Operating at a low minimum supply voltage helps in reducing power consumption and extending the battery life of portable devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the DSP can withstand harsh environmental conditions and maintain reliable performance in challenging situations.

CPU Family: C28X

Belonging to the C28X CPU family signifies high-performance computing capabilities and compatibility with a range of DSP software and tools.

No. of External Interrupts: 3

Multiple external interrupts allow the DSP to respond to time-critical events promptly, enhancing real-time processing capabilities.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, the DSP can operate reliably in extreme cold climates or industrial settings with sub-zero temperatures.

Terminal Finish: NICKEL PALLADIUM GOLD

The terminal finish provides a reliable electrical connection and corrosion resistance, ensuring long-term performance and durability.

ADC Channels: YES

Having ADC channels enables the DSP to convert analog signals into digital data, expanding its connectivity and sensor interface capabilities.

Terminal Position: QUAD

The quad terminal position offers increased stability and improved heat dissipation during operation, enhancing the reliability of the DSP.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a slim and compact form factor, making the DSP suitable for space-constrained applications.

RAM Words: 18432

The large RAM capacity enables the DSP to store and process a significant amount of data efficiently, facilitating complex signal processing algorithms.

Width: 24 mm

With a moderate width, the DSP can easily fit into standard PCB layouts and enclosures, simplifying integration into various electronic systems.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging during manufacturing and maintenance, ensuring reliable performance and easy troubleshooting.

External Data Bus Width: 16

Having a wider external data bus width enables faster data transfer between the DSP and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 150 MHz

Operating at a high maximum clock frequency enables the DSP to execute instructions quickly and process data in real-time, making it suitable for high-speed applications.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at the peak reflow temperature ensures proper soldering and component bonding during manufacturing, ensuring a reliable connection to the PCB.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the DSP can withstand the soldering process without damage and ensure a secure attachment to the PCB.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architectures provide flexible data routing and communication pathways within the DSP, optimizing data transfer efficiency and reducing latency.

Length: 24 mm

With a moderate length, the DSP can fit into standard PCB form factors and enclosures, ensuring compatibility with various electronic designs.

Temperature Grade: MILITARY

Designed for military-grade applications, the DSP meets stringent reliability and performance standards, making it ideal for demanding and rugged environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor and supporting other peripheral IC types, the DSP offers versatile interfacing and connectivity options for diverse application requirements.

No. of Timers: 8

Having multiple timers enables the DSP to perform time-sensitive tasks, scheduling operations, and synchronization in real-time applications.

RAM Bytes: 36864

The large RAM capacity in bytes provides ample storage for program instructions and data, allowing the DSP to handle complex algorithms and calculations efficiently.

Technology: CMOS

CMOS technology offers low power consumption, high-speed performance, and compatibility with a wide range of electronic systems, making the DSP energy-efficient and versatile.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and easy soldering during assembly, ensuring a strong and reliable connection to the PCB.

Maximum Supply Current: 230 mA

Operating at a maximum supply current of 230 mA ensures efficient power usage and minimal heat dissipation, contributing to the overall reliability and longevity of the DSP.

Nominal Supply Voltage: 1.9 V

Having a stable nominal supply voltage simplifies power management and reduces the risk of voltage fluctuations, ensuring consistent performance of the DSP.

PWM Channels: YES

Support for PWM channels enables the DSP to generate precise analog output signals, facilitating motor control, power management, and audio processing applications.

ROM Programmability: FLASH

Using flash ROM for programmability offers reprogrammable storage for firmware and software updates, allowing for flexible and adaptive functionality in the DSP.

Terminal Pitch: 0.5 mm

Having a small terminal pitch allows for a higher density of connection points, enabling more features and functionality in a compact form factor.

Format: FIXED POINT

Operating in fixed-point format simplifies arithmetic calculations and reduces processing overhead, making the DSP efficient in handling numerical computations.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates moderate moisture sensitivity, ensuring proper handling and storage procedures to prevent moisture-related damage during manufacturing and assembly.

Low Power Mode: YES

Support for a low-power mode allows the DSP to conserve energy during idle or low-load periods, prolonging battery life and reducing overall power consumption.

On Chip Program ROM Width: 16

The on-chip program ROM width of 16 bits provides ample space for storing program instructions and data, enhancing the overall processing capabilities of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) SM320F2812PGFMEPG4 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V SUPPLY AT 135MHZ

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

176

No. of Timers:

8

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SM320F2812PGFMEPG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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