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SM320C25-50FJM

Texas Instruments

SM320C25-50FJM by Texas Instruments

Texas Instruments' SM320C25-50FJM is a 16-bit DSP with 50 MHz clock frequency, ideal for military applications. With a supply voltage range of 4.75V to 5.25V, it features a ceramic-metal package and operates b/w -55°C to 125°C. This chip carrier has a quad terminal position and supports an external data bus width of 16 bits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,722 parts In-Stock

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Digiode

USA . 1,396 parts In-Stock

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1,396

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Distributors (Availability)

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One Stop Electronics

USA . 1,480 parts In-Stock

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$3.000

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$3.000

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AZTECH Wire

Italy . 764 parts In-Stock

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$11.289

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764

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Parana Technologies

USA . 349 parts In-Stock

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$36.615

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DigiPath Technology Company

USA . 1,367 parts In-Stock

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$40.317

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$40.317

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ChromeModa Solutions

Germany . 3,364 parts In-Stock

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$41.140

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$33.735

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$41.140

$33.735

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IDEA Electronic Components Group

UK . 1,894 parts In-Stock

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$41.140

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$39.083

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$37.026

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Corphita

USA . 2,047 parts In-Stock

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Overview

Experience the power and precision of Texas Instruments with the SM320C25-50FJM Digital Signal Processor. Designed for military-grade applications, this chip carrier package offers unmatched performance with a maximum clock frequency of 50 MHz. Whether you're working on radar systems, communication equipment, or industrial controls, this DSP provides the reliability and efficiency you need. Trust in Texas Instruments to deliver cutting-edge technology that helps you stay ahead in your field. Choose the SM320C25-50FJM for unparalleled quality and value.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides durability and reliability for the DSP, making it suitable for long-term use in various environments.

Surface Mount: YES

The surface-mount feature allows for easier and more efficient assembly of the DSP onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 5.25 V

With a higher maximum supply voltage, this DSP can handle larger input voltages and provide stable performance under varying power conditions.

Address Bus Width: 16

A wider address bus width allows the DSP to access larger memory spaces more efficiently, enabling faster data processing and manipulation.

Package Shape: SQUARE

The square package shape is compact and space-saving, making it easy to integrate the DSP into different electronic devices with limited space available.

No. of Terminals: 68

Having a higher number of terminals allows for more connectivity options and flexibility in designing circuits that require multiple connections to other components.

Minimum Supply Voltage: 4.75 V

The lower minimum supply voltage ensures that the DSP can operate efficiently even with lower power input, making it energy-efficient and versatile in different power setups.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures the DSP's reliability and performance in harsh environmental conditions where temperatures can fluctuate or exceed normal operating limits.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature range means the DSP can function effectively in cold environments without compromising its performance.

Terminal Position: QUAD

The quad terminal position allows for easy and secure soldering onto circuit boards, ensuring a strong and stable connection for reliable performance.

Maximum Seated Height: 3.68 mm

The low maximum seated height makes the DSP suitable for applications where space constraints are a concern, allowing for compact and slim designs.

Width: 24.13 mm

The specific width measurement ensures that the DSP can fit seamlessly into standard electronics equipment or PCB layouts without any compatibility issues.

External Data Bus Width: 16

The 16-bit external data bus width enables high-speed data transfer between the DSP and external memory devices or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 50 MHz

With a high maximum clock frequency, the DSP can process data at fast speeds and handle complex tasks efficiently, making it suitable for real-time processing and high-speed applications.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows the DSP to manage data flow more effectively within the processor, improving overall efficiency and performance.

Length: 24.13 mm

The specific length measurement ensures that the DSP fits properly within its intended application or circuit board layout, minimizing installation errors and ensuring proper functionality.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that the DSP can operate reliably in extreme temperature conditions often encountered in military or industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type indicates that the DSP can interact with other digital signal processors or components efficiently, enabling seamless integration and communication within complex electronic systems.

Technology: CMOS

The CMOS technology used in the DSP offers low power consumption, high noise immunity, and fast switching speeds, making it an energy-efficient and high-performance choice for various applications.

Terminal Form: J BEND

The J bend terminal form facilitates easier and more secure soldering of the DSP onto PCBs, ensuring a reliable electrical connection and reducing the risk of solder joint failure.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources and electronic devices, simplifying integration and operation within existing systems.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch provides ample spacing between terminals for easy soldering and prevents short circuits, enhancing the reliability and durability of the DSP in various applications.

Format: FIXED POINT

The fixed-point format allows for efficient and accurate mathematical calculations within the DSP, making it suitable for applications that require precise computation and data processing.

Barrel Shifter: YES

The presence of a barrel shifter in the DSP enables efficient shifting and rotation operations on data, improving computational performance and flexibility in handling complex algorithms or data manipulation tasks.

Technical Specifications

Digital Signal Processors (DSPs) SM320C25-50FJM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CQCC-J68

Length:

24.13 mm

Low Power Mode:

NO

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

3.68 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

SM320C25-50FJM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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