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SM320C6727BGDHMEP

Texas Instruments

SM320C6727BGDHMEP by Texas Instruments

Texas Instruments SM320C6727BGDHMEP is a 32-bit DSP with integrated cache, operating at max 250 MHz. Ideal for military applications, it features 32-bit external data bus width and operates b/w -55 to 125 °C. It has a package style of GRID ARRAY and terminal pitch of 1 mm.

Median Price

$48.945

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 47 parts In-Stock

1+ parts

$33.380

100+ parts

-

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47

$33.380

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Verical

USA . 47 parts In-Stock

1+ parts

$33.380

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-

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-

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47

$33.380

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Mouser Electronics

USA . 70 parts In-Stock

1+ parts

$64.510

100+ parts

$54.350

1k+ parts

$48.880

10k+ parts

-

70

$64.510

$54.350

$48.880

-

DigiKey

USA . 270 parts In-Stock

1+ parts

$73.420

100+ parts

$54.633

1k+ parts

$53.323

10k+ parts

-

270

$73.420

$54.633

$53.323

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,817 parts In-Stock

1+ parts

$31.711

100+ parts

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3,817

$31.711

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$49.590

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10

$49.590

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Vyrian

USA . 6,373 parts In-Stock

1+ parts

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6,373

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Semtec, LLC

USA . 115 parts In-Stock

1+ parts

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115

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Distributors (Availability)

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AZTECH Wire

Italy . 266 parts In-Stock

1+ parts

$8.425

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266

$8.425

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Ampacity Inc.

Singapore . 109 parts In-Stock

1+ parts

$28.370

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109

$28.370

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Corphita

USA . 3,235 parts In-Stock

1+ parts

$30.042

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3,235

$30.042

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Continental Prestige Electronics

USA . 2,384 parts In-Stock

1+ parts

$49.590

100+ parts

-

1k+ parts

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$48.598

2,384

$49.590

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-

$48.598

Netroflash

USA . 100 parts In-Stock

1+ parts

$49.590

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100

$49.590

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Parana Technologies

USA . 1,835 parts In-Stock

1+ parts

$54.788

100+ parts

$5,087.934

1k+ parts

$49.310

10k+ parts

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1,835

$54.788

$5,087.934

$49.310

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DigiPath Technology Company

USA . 1,252 parts In-Stock

1+ parts

$60.329

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1,252

$60.329

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ChromeModa Solutions

Germany . 5,874 parts In-Stock

1+ parts

$61.560

100+ parts

$50.479

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5,874

$61.560

$50.479

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IDEA Electronic Components Group

UK . 1,878 parts In-Stock

1+ parts

$61.560

100+ parts

$58.482

1k+ parts

$55.404

10k+ parts

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1,878

$61.560

$58.482

$55.404

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Corohmni

South Africa . 70 parts In-Stock

1+ parts

$85.331

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70

$85.331

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Lixinc

USA . 16,683 parts In-Stock

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16,683

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Epart123

USA . 1,250 parts In-Stock

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$69.000

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1,250

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$69.000

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Argo Parts USA

USA . 810 parts In-Stock

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810

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Perfect Parts

USA . 296 parts In-Stock

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296

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Overview

Experience unparalleled performance and reliability with the SM320C6727BGDHMEP by Texas Instruments, a top-of-the-line Digital Signal Processor offering cutting-edge technology and seamless integration. Whether you're designing high-quality audio systems, industrial automation solutions, or advanced communication devices, this DSP delivers exceptional speed and efficiency to meet your needs. Trust in Texas Instruments' reputation for excellence and unlock a world of possibilities with the SM320C6727BGDHMEP. Elevate your projects with unmatched quality and innovation today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for various applications

Integrated Cache: YES

Improved performance and efficiency by reducing memory access time

Maximum Supply Voltage: 1.32 V

Optimal voltage level for stable operation

Address Bus Width: 32

Allows for efficient data transfer and processing

Package Shape: SQUARE

A compact and space-saving design for installation flexibility

Bit Size: 32

Supports processing of 32-bit data for higher performance

Power Supplies (V): 1.2,3.3

Versatile power options for different voltage requirements

No. of Terminals: 256

Sufficient connectivity options for external devices

Package Style (Meter): GRID ARRAY

Provides a robust and reliable package format

Minimum Supply Voltage: 1.14 V

Ensures operation even at low voltage levels

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures for extended use

Minimum Operating Temperature: -55 °C

Suitable for use in various environments including extreme cold conditions

Terminal Finish: TIN LEAD

Enhanced durability and solderability for terminal connections

Terminal Position: BOTTOM

Easy accessibility for terminal connections

Maximum Seated Height: 2.02 mm

Low profile design for space-constrained applications

RAM Words: 65536

Sufficient memory capacity for data storage and retrieval

Width: 17 mm

Compact size for easy integration into various systems

External Data Bus Width: 32

Efficient data transfer between external devices

Maximum Clock Frequency: 250 MHz

High processing speed for quick data processing

Peak Reflow Temperature °C: 220

Can withstand high-temperature reflow processes during assembly

Technology: CMOS

Advanced technology for power-efficient operation

Technical Specifications

Digital Signal Processors (DSPs) SM320C6727BGDHMEP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

250 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e0

Length:

17 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

No. of Timers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,3.3

RAM Words:

65536

Maximum Seated Height:

2.02 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

17 mm

Peripheral IC Type:

Trade Compliance

SM320C6727BGDHMEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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