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SM320C2550GBM

Texas Instruments

SM320C2550GBM by Texas Instruments

Texas Instruments' SM320C2550GBM is a 16-bit DSP with max clock freq of 50MHz. Ideal for military applications, it operates b/w -55 to 125°C and supports a 16-bit external data bus width. With a ceramic-metal package, it has a terminal pitch of 2.54mm and requires supply voltage b/w 4.75-5.25V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,526 parts In-Stock

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Digiode

USA . 1,111 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 482 parts In-Stock

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$8.039

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482

$8.039

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One Stop Electronics

USA . 472 parts In-Stock

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$17.000

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Parana Technologies

USA . 2,172 parts In-Stock

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$46.058

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ChromeModa Solutions

Germany . 2,746 parts In-Stock

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$51.750

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$42.435

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$51.750

$42.435

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IDEA Electronic Components Group

UK . 181 parts In-Stock

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$51.750

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$49.162

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$46.575

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181

$51.750

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$46.575

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Corohmni

South Africa . 3,091 parts In-Stock

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$52.050

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DigiPath Technology Company

USA . 397 parts In-Stock

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$46.658

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Corphita

USA . 136 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the SM320C2550GBM by Texas Instruments. As a leader in digital signal processors, Texas Instruments guarantees top-notch quality and reliability. This versatile product is perfect for a wide range of applications in industries such as telecommunications, automotive, and industrial automation. Enjoy seamless performance and efficiency with this innovative DSP, designed to exceed your expectations. Upgrade your systems with the SM320C2550GBM and experience unparalleled value and benefits like never before.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package material ensures high durability and robustness, making the product suitable for demanding environments.

Maximum Supply Voltage: 5.25 V

Allows for a wide range of input voltages, increasing flexibility in power supply options.

Address Bus Width: 16

Provides a high address bus width, enabling efficient data processing and handling of large memory addresses.

Package Shape: SQUARE

Square package shape allows for easy and compact integration into various electronic systems.

No. of Terminals: 68

With a high number of terminals, the product can support multiple connections and interfaces for versatile applications.

Package Style (Meter): GRID ARRAY

Grid array package style offers enhanced thermal performance and reliability in operation.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures efficient power consumption and compatibility with various power sources.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -55 °C

Withstands extremely low temperatures, ensuring reliability in harsh environmental conditions.

Terminal Position: PERPENDICULAR

Perpendicular terminal position allows for easy mounting and connectivity with other components in the system.

Maximum Seated Height: 2.23 mm

Low seated height enables a compact and space-saving design in electronic assemblies.

Width: 24.38 mm

Compact width dimensions facilitate easy integration and layout in circuit board designs.

External Data Bus Width: 16

Matched external data bus width ensures seamless data transfer and efficient communication with peripherals.

Maximum Clock Frequency: 50 MHz

High clock frequency capability allows for fast data processing and real-time signal processing tasks.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and parallel processing capabilities of the DSP.

Length: 24.38 mm

Optimal length dimensions for accommodating the required circuitry and components in a compact form factor.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in extreme environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed specifically for digital signal processing tasks and supports various peripheral integration for comprehensive functionality.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of applications.

Terminal Form: PIN/PEG

Pin and peg terminal form ensures robust connections and easy assembly in circuit board designs.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the DSP.

Terminal Pitch: 2.54 mm

Standard terminal pitch spacing for easy soldering and mounting on circuit boards.

Format: FIXED POINT

Fixed-point format is suitable for applications requiring precise numerical calculations and efficient data processing.

Barrel Shifter: YES

Barrel shifter feature offers enhanced shifting operations for data processing tasks, improving overall performance.

Technical Specifications

Digital Signal Processors (DSPs) SM320C2550GBM attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P68

Length:

24.38 mm

Low Power Mode:

NO

No. of Terminals:

68

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2.23 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Width:

24.38 mm

Peripheral IC Type:

Trade Compliance

SM320C2550GBM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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