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ADSP-2181BSTZ-133

Analog Devices

ADSP-2181BSTZ-133 by Analog Devices

ADSP-2181BSTZ-133 by Analog Devices is a 16-bit DSP with 5V supply, 16.67MHz clock frequency, and 8192 RAM words. Ideal for industrial applications, it features low power mode, barrel shifter, and supports fixed-point format for digital signal processing tasks.

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Vyrian

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Digiode

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Nova Conductors

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Connector Distribution Corp

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Right Parts Inc.

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Martec Srl

Italy . 13 parts In-Stock

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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One Stop Electronics

USA . 772 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 718 parts In-Stock

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Semicontronic

India . 978 parts In-Stock

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Ampacity Inc.

Singapore . 1,223 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 1,103 parts In-Stock

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Vigor

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Parana Technologies

USA . 4,792 parts In-Stock

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IDEA Electronic Components Group

UK . 1,158 parts In-Stock

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DigiPath Technology Company

USA . 4,792 parts In-Stock

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$135.040

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$129.638

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Authorized Procurement Solutions

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Lixinc

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Continental Prestige Electronics

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Argo Parts USA

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RC Electronics

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A-Z Elektronik GmbH

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Microchip USA

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Overview

Elevate your digital signal processing capabilities with the ADSP-2181BSTZ-133 by Analog Devices. Known for their superior quality and innovative technology, Analog Devices is a trusted manufacturer in the industry. This DSP offers unmatched performance and efficiency, making it ideal for a wide range of applications. Unlock the full potential of your projects with this versatile and reliable component. Upgrade to Analog Devices and experience the difference in quality and precision.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package provides durability and allows for easy handling during assembly and installation.

Surface Mount: YES

Surface mount technology makes it easier to integrate the DSP into circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Allows for flexibility in power supply options while ensuring stable operation within specified voltage range.

On Chip Data RAM Width: 16

Wide data RAM width enables efficient data processing and storage for complex algorithms and calculations.

Address Bus Width: 14

Wide address bus width supports larger memory addressing capabilities, allowing for more efficient data access.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy placement on circuit boards and ensures compatibility with standard mounting techniques.

Bit Size: 16

16-bit processing capability provides high precision and accuracy for signal processing applications.

Power Supplies (V): 5

Operating at 5V ensures compatibility with common power sources and reduces the need for additional voltage regulation circuitry.

No. of Terminals: 128

Ample number of terminals allow for versatile connectivity options and interface configurations with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style offers space-saving design, optimal heat dissipation, and precise component placement.

Minimum Supply Voltage: 4.5 V

Wide operating voltage range ensures stable performance even under varying supply conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable operation in industrial environments with elevated temperatures.

No. of External Interrupts: 4

Multiple external interrupts enable efficient handling of asynchronous events and real-time signal processing tasks.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range ensures reliable performance in harsh environmental conditions with low temperatures.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish provides good solderability and long-term reliability in electronic assemblies.

Terminal Position: QUAD

Quad terminal position offers stable and secure connection with other components, reducing the risk of signal interference or disconnection.

Maximum Seated Height: 1.6 mm

Low seated height allows for compact device design and efficient utilization of available space on the circuit board.

RAM Words: 8192

Large RAM word capacity enables efficient data storage and retrieval, supporting complex signal processing algorithms and operations.

Width: 14 mm

Compact width dimension facilitates easy integration into various electronic devices and circuit board layouts.

External Data Bus Width: 24

Wide external data bus width enhances data transfer speed and efficiency for handling large volumes of data in signal processing tasks.

Maximum Clock Frequency: 16.67 MHz

High maximum clock frequency ensures fast processing speeds and real-time performance for demanding signal processing applications.

Maximum Time At Peak Reflow Temperature (s): 40

Long reflow time allowance at peak temperature ensures optimal solder joint formation and component reliability during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures component durability and reliability during soldering processes.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer efficiency and parallel processing capabilities for faster signal processing tasks.

Length: 20 mm

Compact length dimension enables versatile placement options and efficient use of space in electronic device designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in rugged environments with wide temperature variations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated digital signal processor peripheral IC type supports high-performance signal processing operations with additional features for versatile applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed operation, and compatibility with various digital systems for efficient signal processing.

Terminal Form: GULL WING

Gull wing terminal form provides robust mechanical strength and secure solder connections for reliable performance in demanding applications.

Maximum Supply Current: 100 mA

Low maximum supply current requirement reduces power consumption and heat generation, improving overall energy efficiency of the device.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the DSP in diverse operating conditions.

No. of DMA Channels: 2

Multiple DMA channels allow for efficient data transfer between peripherals and memory, enhancing overall system performance and responsiveness.

No. of Serial I/Os: 2

Serial I/O options enable versatile data communication and interface connectivity with external devices for enhanced functionality.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for compact layout design and efficient signal routing on circuit boards, saving space and improving signal integrity.

Format: FIXED POINT

Fixed point format offers efficient arithmetic operations and faster processing speeds for numerical calculations in signal processing applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures to prevent damage during assembly and storage.

Low Power Mode: YES

Low power mode capability allows for energy-efficient operation and extended battery life in portable electronic devices.

Barrel Shifter: YES

Barrel shifter feature enhances data manipulation and binary arithmetic operations for efficient signal processing and algorithm implementation.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-2181BSTZ-133 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

33 MIPS SUSTAINED; SINGLE CYCLE INSTRUCTION EXECUTION

Address Bus Width:

14

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

16.67 MHz

External Data Bus Width:

24

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PQFP-G128

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

2

No. of External Interrupts:

4

No. of Serial I/Os:

2

No. of Terminals:

128

No. of Timers:

1

On Chip Data RAM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.63X.87,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ADSP-2181BSTZ-133 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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