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TMS320C6455BCTZ

Texas Instruments

TMS320C6455BCTZ by Texas Instruments

TMS320C6455BCTZ by Texas Instruments is a 32-bit DSP with integrated cache, 64 DMA channels, and 66.6 MHz clock frequency. Ideal for digital signal processing applications requiring low power mode, it features a package style of grid array with heat sink/slug and operates b/w 0-90°C temperature range.

Median Price

$192.927

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2 parts In-Stock

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$175.000

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2

$175.000

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Texas Instruments

USA . 10,625 parts In-Stock

1+ parts

$192.927

100+ parts

$174.632

1k+ parts

$166.316

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-

10,625

$192.927

$174.632

$166.316

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DigiKey

USA . 38 parts In-Stock

1+ parts

$286.730

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38

$286.730

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Distributors (In-Stock)

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DF Sales Co.

USA . 18 parts In-Stock

1+ parts

$130.000

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18

$130.000

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DF Sales Co.

USA . 18 parts In-Stock

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$130.000

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18

$130.000

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Digiode

USA . 324 parts In-Stock

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$166.250

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324

$166.250

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Vyrian

USA . 2,492 parts In-Stock

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2,492

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Cyclops Electronics Ltd

UK . 30 parts In-Stock

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30

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Distributors (Availability)

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Parana Technologies

USA . 669 parts In-Stock

1+ parts

$16.205

100+ parts

-

1k+ parts

$16.520

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669

$16.205

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$16.520

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DigiPath Technology Company

USA . 277 parts In-Stock

1+ parts

$17.844

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277

$17.844

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ChromeModa Solutions

Germany . 6,965 parts In-Stock

1+ parts

$18.208

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$14.931

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6,965

$18.208

$14.931

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IDEA Electronic Components Group

UK . 161 parts In-Stock

1+ parts

$18.208

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$17.298

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$16.387

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161

$18.208

$17.298

$16.387

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Corohmni

South Africa . 324 parts In-Stock

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$19.232

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324

$19.232

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Semicontronic

India . 2,626 parts In-Stock

1+ parts

$148.750

100+ parts

$145.031

1k+ parts

$144.288

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2,626

$148.750

$145.031

$144.288

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Ampacity Inc.

Singapore . 2,261 parts In-Stock

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$148.750

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2,261

$148.750

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Corphita

USA . 2,634 parts In-Stock

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$157.500

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2,634

$157.500

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Lixinc

USA . 13,391 parts In-Stock

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Continental Prestige Electronics

USA . 6,889 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,679 parts In-Stock

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4,679

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Argo Parts USA

USA . 1,187 parts In-Stock

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Perfect Parts

USA . 869 parts In-Stock

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869

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Experience unparalleled performance and reliability with the TMS320C6455BCTZ by Texas Instruments, a top-of-the-line Digital Signal Processor that sets the standard in its category. With integrated cache and advanced technology, this processor offers lightning-fast speeds and exceptional efficiency for a wide range of applications. From communications to industrial automation, this powerhouse delivers unmatched value, benefits, and advantages to customers seeking the best in cutting-edge technology. Trust Texas Instruments for quality you can rely on and performance that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for portable devices.

Integrated Cache: YES

The integrated cache helps in improving the processing speed by storing frequently used instructions and data, enhancing overall performance.

Maximum Supply Voltage: 1.2875 V

The maximum supply voltage of 1.2875 V ensures efficient power consumption and prevents overheating, contributing to the product's reliability.

Address Bus Width: 20

Having a wider address bus width allows the processor to access a larger memory space, enabling it to handle complex computational tasks effectively.

Bit Size: 32

The 32-bit architecture provides high processing power and precision, making it suitable for demanding signal processing applications.

Width: 24 mm

The compact width of 24 mm allows for space-efficient integration into various electronic systems, making it versatile for different applications.

Maximum Clock Frequency: 66.6 MHz

The high maximum clock frequency of 66.6 MHz enables fast data processing and response times, ideal for real-time and high-performance computing tasks.

Technology: CMOS

Being based on CMOS technology ensures low power consumption and high-speed operation, making the processor energy-efficient and reliable for continuous use.

Low Power Mode: YES

The presence of low power mode helps in reducing power consumption during idle or low processing periods, improving energy efficiency and extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6455BCTZ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of Terminals:

697

No. of Timers:

4

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.25

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.2875 V

Minimum Supply Voltage:

1.2125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6455BCTZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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