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SM320C30GBM28

Texas Instruments

SM320C30GBM28 by Texas Instruments

Texas Instruments SM320C30GBM28 is a 32-bit DSP with max clock freq of 28MHz, 24-bit address bus width, and 2048 RAM words. Ideal for military applications due to its ceramic-metal package and -55 to 125 °C operating temp range.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,546 parts In-Stock

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Digiode

USA . 2,641 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 489 parts In-Stock

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$6.939

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489

$6.939

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One Stop Electronics

USA . 1,204 parts In-Stock

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$13.000

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Corohmni

South Africa . 5,014 parts In-Stock

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$38.122

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Parana Technologies

USA . 1,263 parts In-Stock

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$49.773

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DigiPath Technology Company

USA . 584 parts In-Stock

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$54.806

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$50.422

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584

$54.806

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ChromeModa Solutions

Germany . 6,302 parts In-Stock

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$55.925

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$45.858

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$55.925

$45.858

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IDEA Electronic Components Group

UK . 2,116 parts In-Stock

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$55.925

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$53.129

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$50.332

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Corphita

USA . 2,477 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the SM320C30GBM28 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and reliability. This DSP is perfect for a wide range of applications, providing customers with superior performance and flexibility. With advanced features and a wide temperature range, this product offers exceptional value and benefits. Experience the advantages of Texas Instruments' innovation with the SM320C30GBM28.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides excellent thermal conductivity and durability, making this DSP suitable for harsh operating conditions.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in the power supply design and operation of the DSP.

Address Bus Width: 24

The 24-bit address bus width enables the DSP to access a large memory space efficiently, enhancing its processing capability.

Bit Size: 32

The 32-bit bit size allows for high-precision calculations and processing, making this DSP suitable for complex signal processing tasks.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard power sources, simplifying integration into existing systems.

No. of Terminals: 181

With 181 terminals, this DSP offers a high level of connectivity for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style provides reliable connectivity and mechanical stability, ensuring robust performance in various applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C allows this DSP to operate in demanding environments without compromising performance.

RAM Words: 2048

With 2048 RAM words, the DSP can efficiently store and access data, enabling fast and efficient signal processing.

External Data Bus Width: 32

The 32-bit external data bus width enables high-speed data transfer between the DSP and external devices, enhancing overall system performance.

Maximum Clock Frequency: 28 MHz

The high maximum clock frequency of 28 MHz allows for fast data processing and real-time operation, making this DSP ideal for time-critical applications.

Technology: CMOS

Being CMOS technology, this DSP offers low power consumption, high noise immunity, and reliable operation, contributing to energy-efficient and stable performance.

Format: FLOATING POINT

The floating-point format allows for high-precision arithmetic operations, particularly beneficial for applications requiring advanced mathematical calculations.

Barrel Shifter: YES

The presence of a barrel shifter in the DSP architecture enhances data processing efficiency by enabling fast and flexible data shifting operations.

Technical Specifications

Digital Signal Processors (DSPs) SM320C30GBM28 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

28 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P181

Low Power Mode:

NO

No. of Terminals:

181

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA181,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2048

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

500 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SM320C30GBM28 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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