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SM320C30HTM25

Texas Instruments

SM320C30HTM25 by Texas Instruments

Texas Instruments' SM320C30HTM25 is a 32-bit DSP with 24-bit address bus, operating at 25 MHz. Ideal for military applications, it features a max supply voltage of 5.5V and operates in temperatures ranging from -55°C to 125°C. With a ceramic-metal sealed co-fired package, this DSP offers high performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,523 parts In-Stock

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4,523

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Digiode

USA . 2,614 parts In-Stock

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2,614

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Distributors (Availability)

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One Stop Electronics

USA . 1,547 parts In-Stock

1+ parts

$3.000

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1,547

$3.000

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AZTECH Wire

Italy . 539 parts In-Stock

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$11.832

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539

$11.832

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Parana Technologies

USA . 260 parts In-Stock

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$17.581

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$17.776

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260

$17.581

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$17.776

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DigiPath Technology Company

USA . 1,639 parts In-Stock

1+ parts

$19.359

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$17.810

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1,639

$19.359

$17.810

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ChromeModa Solutions

Germany . 5,219 parts In-Stock

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$19.754

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$16.198

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5,219

$19.754

$16.198

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IDEA Electronic Components Group

UK . 1,084 parts In-Stock

1+ parts

$19.754

100+ parts

$18.766

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$17.779

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1,084

$19.754

$18.766

$17.779

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Corphita

USA . 4,973 parts In-Stock

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4,973

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments SM320C30HTM25 digital signal processor. Designed with precision and reliability, this DSP offers unparalleled performance in a wide range of applications. From telecommunications to industrial automation, this high-quality product delivers unmatched value and benefits to customers seeking top-tier processing capabilities. Trust Texas Instruments for superior craftsmanship and innovation in the field of digital signal processors.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides durability and heat resistance, making the product suitable for demanding environments.

Maximum Supply Voltage: 5.5 V

This allows for a wide range of voltage inputs, increasing the flexibility of the product in different applications.

Address Bus Width: 24

The wide address bus width allows for efficient handling of memory addresses, improving the overall performance of the digital signal processor.

Bit Size: 32

With a 32-bit architecture, the processor can handle larger chunks of data at once, leading to faster processing speeds.

No. of Terminals: 196

Having a high number of terminals allows for a greater connectivity options, enabling integration with various external devices.

Maximum Clock Frequency: 25 MHz

The high clock frequency enables fast data processing and efficient task execution, making the product suitable for real-time applications.

Temperature Grade: MILITARY

Being military-grade means that the product is designed to operate reliably in harsh conditions, making it suitable for defense and aerospace applications.

Technical Specifications

Digital Signal Processors (DSPs) SM320C30HTM25 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CQFP-F196

Low Power Mode:

NO

No. of Terminals:

196

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

QFF

Package Equivalence Code:

QFL196,1.4SQ,25

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

2048

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

500 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SM320C30HTM25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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