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VC55GPSPGE

Texas Instruments

VC55GPSPGE by Texas Instruments

Texas Instruments VC55GPSPGE is a 144-terminal DSP with 128K RAM, 16-bit data bus, and 20 MHz clock frequency. Ideal for industrial applications, it operates b/w -40 to 85°C with low power mode and flash ROM programmability.

Median Price

$29.931

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$29.931

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300

$29.931

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Vyrian

USA . 5,195 parts In-Stock

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Digiode

USA . 4,080 parts In-Stock

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4,080

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Distributors (Availability)

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One Stop Electronics

USA . 1,424 parts In-Stock

1+ parts

$2.000

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$2.000

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AZTECH Wire

Italy . 373 parts In-Stock

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$17.474

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373

$17.474

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Semicontronic

India . 1,033 parts In-Stock

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$18.000

100+ parts

$17.550

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$17.460

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-

1,033

$18.000

$17.550

$17.460

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Parana Technologies

USA . 726 parts In-Stock

1+ parts

$21.695

100+ parts

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$22.124

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726

$21.695

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$22.124

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ChromeModa Solutions

Germany . 5,097 parts In-Stock

1+ parts

$24.376

100+ parts

$19.988

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5,097

$24.376

$19.988

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IDEA Electronic Components Group

UK . 716 parts In-Stock

1+ parts

$24.376

100+ parts

$23.157

1k+ parts

$21.938

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-

716

$24.376

$23.157

$21.938

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$24.697

100+ parts

$23.462

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$23.462

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600

$24.697

$23.462

$23.462

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Ampacity Inc.

Singapore . 609 parts In-Stock

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$29.000

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$29.000

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Continental Prestige Electronics

USA . 6,866 parts In-Stock

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$29.931

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$29.332

6,866

$29.931

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$29.332

Corohmni

South Africa . 14 parts In-Stock

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$30.797

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14

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QUARKTWIN TECHNOLOGY LTD

USA . 13,429 parts In-Stock

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Corphita

USA . 4,018 parts In-Stock

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Argo Parts USA

USA . 3,802 parts In-Stock

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Robosynatics

Brazil . 953 parts In-Stock

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953

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Lucentia Tech

USA . 953 parts In-Stock

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$23.309

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$23.309

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$23.309

953

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$23.309

$23.309

$23.309

DigiPath Technology Company

USA . 728 parts In-Stock

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$21.977

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728

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$21.977

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Overview

Experience the power of cutting-edge technology with the Texas Instruments VC55GPSPGE, a top-tier Digital Signal Processor that delivers unmatched performance and precision. Manufactured with the highest quality standards, this processor is designed for a wide range of applications, providing customers with superior reliability and efficiency. Unlock endless possibilities with its advanced features and innovative design, offering unparalleled value and benefits to elevate your projects to new heights. Choose Texas Instruments for excellence in technology and unleash the potential of the VC55GPSPGE in your next venture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is cost-effective and lightweight, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for easy assembly and compact design, saving space on the PCB.

Maximum Supply Voltage: 1.65 V

High maximum supply voltage allows for versatile power options and compatibility with different systems.

On Chip Data RAM Width: 16

Wide data RAM width enables fast data processing and efficient storage of information.

Address Bus Width: 14

A wide address bus width allows for efficient memory addressing and access to a large memory space.

Package Shape: SQUARE

Square package shape provides a balanced placement on the PCB, maximizing space utilization.

No. of Terminals: 144

Abundance of terminals allows for versatile connectivity options and integration with various peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack style with low profile and fine pitch enhances the product's thermal performance and ease of soldering.

Minimum Supply Voltage: 1.55 V

Low minimum supply voltage helps in reducing power consumption and improving overall energy efficiency.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the product to function in extreme cold conditions without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal position simplifies PCB layout and allows for efficient signal routing.

Maximum Seated Height: 1.6 mm

Low seated height enables the product to be used in space-constrained applications without compromising performance.

RAM Words: 128K

Large RAM capacity of 128K words allows for extensive data storage and efficient data processing.

Width: 20 mm

Compact width of 20 mm facilitates easy integration into various electronic devices and systems.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the product during development and production.

External Data Bus Width: 16

Wide external data bus width enhances data transfer speed and efficiency, improving overall performance.

Maximum Clock Frequency: 20 MHz

High clock frequency of 20 MHz enables fast data processing and real-time operation, suitable for time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature of 260°C allows for reliable soldering and robust assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder joint formation and increased product durability.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow efficiency and allows for parallel processing of instructions.

Length: 20 mm

Compact length of 20 mm complements the product's width, providing a square form factor ideal for space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the product's reliability and performance in harsh operating conditions found in industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports various signal processing applications and enhances the product's functionality.

No. of Timers: 2

Having 2 timers allows for precise time measurement and synchronization in different tasks and operations.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance, making the product energy-efficient and durable.

Terminal Form: GULL WING

Gull wing terminal form simplifies soldering and assembly process, ensuring secure connections and high reliability.

Nominal Supply Voltage: 1.6 V

Stable nominal supply voltage of 1.6V ensures consistent and reliable operation of the product under different load conditions.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and customization, enhancing the product's flexibility and adaptability.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5 mm improves signal integrity and allows for high-density PCB designs with efficient space utilization.

Format: FIXED POINT

Fixed-point format simplifies mathematical operations and enhances computation speed, suitable for real-time signal processing applications.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates the product can withstand multiple reflows and has a low moisture absorption rate, ensuring long-term reliability in manufacturing.

Low Power Mode: YES

Inclusion of low power mode enhances energy efficiency and prolongs battery life in portable devices, making the product suitable for power-sensitive applications.

On Chip Program ROM Width: 16

Wide on-chip program ROM width of 16 bits allows for storing a large number of instructions, improving program execution speed and efficiency.

Technical Specifications

Digital Signal Processors (DSPs) VC55GPSPGE attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

144

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

128K

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

VC55GPSPGE Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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