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OMAP3503EZCBCS

Texas Instruments

OMAP3503EZCBCS by Texas Instruments

OMAP3503EZCBCS by Texas Instruments is a DSP with integrated cache and 32 DMA channels. It features a max clock frequency of 19.2 MHz and operates in low power mode, making it ideal for applications requiring high-speed processing with low energy consumption. The package style is grid array, very thin profile, fine pitch, suitable for compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,375 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,375

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-

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Digiode

USA . 2,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,022

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,258 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,258

$6.000

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-

-

AZTECH Wire

Italy . 236 parts In-Stock

1+ parts

$11.426

100+ parts

-

1k+ parts

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10k+ parts

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236

$11.426

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Parana Technologies

USA . 1,307 parts In-Stock

1+ parts

$27.209

100+ parts

-

1k+ parts

$33.279

10k+ parts

-

1,307

$27.209

-

$33.279

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DigiPath Technology Company

USA . 2,075 parts In-Stock

1+ parts

$29.961

100+ parts

$27.564

1k+ parts

-

10k+ parts

-

2,075

$29.961

$27.564

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ChromeModa Solutions

Germany . 6,163 parts In-Stock

1+ parts

$30.572

100+ parts

$25.069

1k+ parts

-

10k+ parts

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6,163

$30.572

$25.069

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IDEA Electronic Components Group

UK . 541 parts In-Stock

1+ parts

$30.572

100+ parts

$29.043

1k+ parts

$27.515

10k+ parts

-

541

$30.572

$29.043

$27.515

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Corohmni

South Africa . 3,109 parts In-Stock

1+ parts

$57.307

100+ parts

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3,109

$57.307

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Corphita

USA . 3,294 parts In-Stock

1+ parts

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3,294

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Microchip USA

USA . 395 parts In-Stock

1+ parts

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100+ parts

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395

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Overview

Unlock the power of cutting-edge technology with the OMAP3503EZCBCS by Texas Instruments, a top-tier manufacturer known for delivering high-quality digital signal processors. Perfect for a wide range of applications, this DSP offers unparalleled value and benefits to customers. With integrated cache, low power mode, and multiple timers, this product ensures optimal performance and efficiency. Embrace innovation and elevate your projects with the OMAP3503EZCBCS - the ultimate solution for all your processing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and cost-effective, making the product easy to handle and affordable.

Integrated Cache: YES

Integrated cache improves processing speed and efficiency by storing frequently accessed data, enhancing overall performance.

Surface Mount: YES

Surface mount technology saves space and allows for easier assembly, making the product suitable for compact electronic devices.

no. of Terminals: 515

A higher number of terminals offer more connectivity options and flexibility in designing complex circuitry.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the product can withstand demanding conditions and maintain optimal performance.

ROM Programmability: MROM

MROM (Mask ROM) provides secure and reliable storage of permanent program instructions, ensuring data integrity and system stability.

Technical Specifications

Digital Signal Processors (DSPs) OMAP3503EZCBCS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

19.2 MHz

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B515

JESD-609 Code:

e1

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of Terminals:

515

No. of Timers:

15

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,26X26,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3

Qualification:

Not Qualified

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

.95 mm

Sub-Category:

Graphics Processors

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

OMAP3503EZCBCS Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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