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TMS320VC5402PGE100

Texas Instruments

TMS320VC5402PGE100 by Texas Instruments

TMS320VC5402PGE100 by Texas Instruments is a 16-bit DSP with 20mm width, operating at max 20MHz. It features 16384 RAM words, 1.71-1.98V supply voltage range, and quad terminal position. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$13.486

Lifecycle Status

Suppliers In-Stock

46

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

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Texas Instruments

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Chip1Stop

Japan . 10 parts In-Stock

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Arrow

USA . 52 parts In-Stock

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Mouser Electronics

USA . 1,109 parts In-Stock

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DigiKey

USA . 171 parts In-Stock

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RS (Exports)

UK . 10 parts In-Stock

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$13.486

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Distributors (In-Stock)

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Digiode

USA . 3,646 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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TME

Poland . 111 parts In-Stock

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Ampacity Inc.

Singapore . 2,812 parts In-Stock

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$8.620

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Semicontronic

India . 2,697 parts In-Stock

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$8.620

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$8.404

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$8.361

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Corphita

USA . 3,338 parts In-Stock

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Continental Prestige Electronics

USA . 5,124 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$11.330

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$10.537

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Component Stockers USA

USA . 4,735 parts In-Stock

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$13.400

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$11.810

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$8.660

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Corohmni

South Africa . 2,220 parts In-Stock

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Microchip USA

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Parana Technologies

USA . 1,857 parts In-Stock

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$61.792

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DigiPath Technology Company

USA . 1,041 parts In-Stock

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$68.040

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$62.597

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ChromeModa Solutions

Germany . 1,540 parts In-Stock

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$69.429

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$56.932

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IDEA Electronic Components Group

UK . 1,298 parts In-Stock

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$69.429

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$65.958

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$62.486

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Advanced Electronics

New Zealand . 300 parts In-Stock

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$82.178

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$78.069

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$78.069

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GreenTree Electronics

Israel . 27,539 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 286 parts In-Stock

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Overview

Experience the power of cutting-edge technology with the TMS320VC5402PGE100 by Texas Instruments, a top-tier manufacturer known for delivering high-quality digital signal processors. Ideal for various applications in industries such as telecommunications, audio processing, and industrial automation, this product offers unparalleled value to customers seeking superior performance and reliability. With features like low power mode, multiple internal bus architecture, and a wide range of supply voltages, the TMS320VC5402PGE100 exceeds expectations and ensures seamless operation in any environment. Trust Texas Instruments to provide innovative solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Durable and cost-effective material.

Surface Mount:

YES - Easy to assemble and saves board space.

Maximum Supply Voltage:

1.98 V - Supports a wide range of supply voltages.

On Chip Data RAM Width:

16 - Efficient data processing capability.

Address Bus Width:

20 - Allows for a larger addressable memory space.

Package Shape:

SQUARE - Simplifies PCB layout and design.

Bit Size:

16 - Suitable for handling complex digital signals.

Power Supplies (V):

1.8,3.3 - Flexible power options for various applications.

No. of Terminals:

144 - Sufficient I/O connectivity for peripherals.

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH - Offers versatile packaging options.

Minimum Supply Voltage:

1.71 V - Ensures reliable operation at low voltages.

Maximum Operating Temperature:

100 °C - Suitable for industrial environments.

No. of External Interrupts:

4 - Allows for efficient handling of external events.

Minimum Operating Temperature:

40 °C - Performs reliably in extreme temperatures.

Terminal Finish:

NICKEL PALLADIUM GOLD - Ensures good electrical conductivity.

Terminal Position:

QUAD - Facilitates easy PCB mounting.

Maximum Seated Height:

1.6 mm - Ideal for space-constrained applications.

RAM Words:

16384 - Sufficient memory for data storage and processing.

Width:

20 mm - Compact size for easy integration.

Boundary Scan:

YES - Simplifies debugging and testing procedures.

External Data Bus Width:

16 - Efficient data transfer between components.

Maximum Clock Frequency:

20 MHz - Supports high-speed processing requirements.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper solder reflow during assembly.

Peak Reflow Temperature °C:

260 - Withstands high-temperature manufacturing processes.

Internal Bus Architecture:

MULTIPLE - Enhances data throughput within the chip.

Length:

20 mm - Compact form factor for space-constrained designs.

Temperature Grade:

INDUSTRIAL - Suitable for rugged industrial applications.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, OTHER - Offers versatile peripheral options.

No. of Timers:

2 - Allows for efficient timekeeping and scheduling tasks.

Technology:

CMOS - Low power consumption and high noise immunity.

Terminal Form:

GULL WING - Facilitates easy soldering and rework.

Nominal Supply Voltage:

1.8 V - Standard voltage level for compatibility.

No. of DMA Channels:

6 - Enables efficient data transfer with peripherals.

ROM Programmability:

MROM - Secure and non-volatile program storage.

Terminal Pitch:

0.5 mm - Provides compact interconnect spacing.

Format:

FIXED POINT - Precise arithmetic calculations for DSP applications.

Moisture Sensitivity Level (MSL):

2 - Resistant to moisture-induced damage.

Low Power Mode:

YES - Energy-efficient operation for battery-powered devices.

Barrel Shifter:

YES - Enables efficient data shifting operations.

On Chip Program ROM Width:

16 - Sufficient storage for program instructions.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5402PGE100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5402PGE100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-606-9748, 5962016069748

NIIN

016069748

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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