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TMS320VC5416ZGU160

Texas Instruments

TMS320VC5416ZGU160 by Texas Instruments

TMS320VC5416ZGU160 by Texas Instruments is a 16-bit DSP with 131072 RAM words, 20 MHz clock frequency, and 23-bit address bus width. Ideal for industrial applications requiring fixed-point format processing, it features low power mode and barrel shifter for efficient signal processing tasks.

Median Price

$4.560

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Bristol Electronics

USA . 2 parts In-Stock

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$4.560

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Digiode

USA . 2,760 parts In-Stock

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Vyrian

USA . 584 parts In-Stock

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Nova Conductors

Japan . 58 parts In-Stock

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ComSIT Distribution GmbH

Germany . 12 parts In-Stock

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Holdelec - ElecDif-Pro

France . 11 parts In-Stock

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Microfarads

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One Stop Electronics

USA . 1,070 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 235 parts In-Stock

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$6.127

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Corohmni

South Africa . 40 parts In-Stock

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$19.982

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Ampacity Inc.

Singapore . 414 parts In-Stock

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$27.000

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Parana Technologies

USA . 20 parts In-Stock

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Semicontronic

India . 201 parts In-Stock

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$28.000

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$27.300

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DigiPath Technology Company

USA . 1,334 parts In-Stock

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$29.858

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$27.469

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IDEA Electronic Components Group

UK . 205 parts In-Stock

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$30.467

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$28.944

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$27.420

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$30.467

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ChromeModa Solutions

Germany . 51 parts In-Stock

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$30.467

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$24.983

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Continental Prestige Electronics

USA . 3,451 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Kepictronics

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Assy Fe

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Corphita

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Bastille Electronics

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A-Z Elektronik GmbH

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Legend Electronics Inc. (Excess)

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Overview

Unlock the power of cutting-edge technology with the TMS320VC5416ZGU160 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality digital signal processors for a wide range of applications. The TMS320VC5416ZGU160 offers unparalleled performance and reliability, making it the perfect choice for your next project. Experience the value of seamless integration, high-speed processing, and low power consumption with this innovative DSP. Elevate your designs and exceed expectations with the TMS320VC5416ZGU160.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is cost-effective and durable, making the product ideal for various applications.

Surface Mount:

YES - This feature allows for easy and secure mounting on a circuit board, simplifying the assembly process.

Maximum Supply Voltage:

1.65 V - Ensures safe operation within the specified voltage range, enhancing reliability.

On Chip Data RAM Width:

16 - Provides sufficient memory for processing data efficiently, improving overall performance.

Address Bus Width:

23 - Allows for high-speed communication between components, facilitating quick data exchange.

Package Shape:

SQUARE - Compact design saves space on the board, making it suitable for applications with limited area.

Bit Size:

16 - Offers a good balance between processing power and efficiency, meeting a wide range of requirements.

Power Supplies (V):

1.6,3.3 - Compatible with common voltage standards, ensuring seamless integration into existing systems.

No. of Terminals:

144 - Sufficient terminals for connecting to other components, enabling versatile functionality.

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH - Enhances thermal performance and electrical connectivity, suitable for demanding environments.

Minimum Supply Voltage:

1.55 V - Provides flexibility in power options while maintaining stable operation, improving overall reliability.

Maximum Operating Temperature:

85 °C - Allows for operation in high-temperature environments, increasing the product's versatility.

No. of External Interrupts:

4 - Enables efficient handling of external events, enhancing the product's responsiveness.

Minimum Operating Temperature:

40 °C - Ensures reliable operation in low-temperature conditions, making it suitable for a wide range of applications.

Terminal Finish:

TIN SILVER COPPER - Provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position:

BOTTOM - Simplifies board layout and connection, streamlining the manufacturing process.

Maximum Seated Height:

1.4 mm - Low profile design for space-constrained applications, enhancing flexibility in installation.

RAM Words:

131072 - Offers ample memory capacity for storing and processing data, improving performance in complex tasks.

Width:

12 mm - Compact form factor for applications with space limitations, enabling versatile use.

Boundary Scan:

YES - Facilitates testing and debugging during production, ensuring product quality and reliability.

External Data Bus Width:

16 - Allows for the efficient transfer of data between components, improving overall system performance.

Maximum Clock Frequency:

20 MHz - Provides high-speed processing capabilities, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures safe and reliable assembly during the manufacturing process, reducing the risk of damage.

Peak Reflow Temperature °C:

260 - Withstands high-temperature soldering processes, ensuring robust construction.

Internal Bus Architecture:

MULTIPLE - Enables efficient data transfer within the processor, enhancing overall performance.

Length:

12 mm - Compact size for space-saving installations, ideal for applications with size constraints.

Temperature Grade:

INDUSTRIAL - Designed for industrial environments, ensuring reliable operation in harsh conditions.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, OTHER - Versatile functionality for a wide range of signal processing applications, enhancing adaptability.

Technology:

CMOS - Low power consumption and high noise immunity, ensuring efficient operation and reliability.

Terminal Form:

BALL - Facilitates secure and reliable connections, ensuring proper functionality in various environments.

Nominal Supply Voltage:

1.6 V - Standard voltage rating for compatibility with common power sources, making it a versatile choice.

No. of DMA Channels:

6 - Provides multiple channels for efficient data transfer, enhancing processing speed and performance.

ROM Programmability:

MROM - Offers non-volatile memory storage with high reliability and data retention, suitable for critical applications.

Terminal Pitch:

0.8 mm - Optimized spacing for easy connection with other components, enhancing ease of integration.

Format:

FIXED POINT - Streamlined processing of numerical data with fixed precision, improving accuracy and efficiency.

Moisture Sensitivity Level (MSL):

3 - Designed to withstand moderate exposure to moisture, ensuring long-term reliability in various environments.

Low Power Mode:

YES - Enables energy-efficient operation, extending battery life and reducing overall power consumption.

Barrel Shifter:

YES - Offers efficient shifting and rotation operations, improving processing speed and data manipulation capabilities.

On Chip Program ROM Width:

16 - Provides ample storage space for program instructions, enhancing flexibility and performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5416ZGU160 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

131072

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5416ZGU160 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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