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POMAP5910GGZG2

Texas Instruments

POMAP5910GGZG2 by Texas Instruments

POMAP5910GGZG2 by Texas Instruments is a 16-bit DSP with 25-bit address bus, operating at max 13 MHz clock frequency. Ideal for industrial applications, it features low power mode, boundary scan support, and CMOS technology for efficient digital signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,787 parts In-Stock

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2,787

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Vyrian

USA . 2,509 parts In-Stock

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2,509

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,578 parts In-Stock

1+ parts

$11.000

100+ parts

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1,578

$11.000

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AZTECH Wire

Italy . 512 parts In-Stock

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$11.105

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512

$11.105

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Corohmni

South Africa . 148 parts In-Stock

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$45.234

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148

$45.234

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Parana Technologies

USA . 1,482 parts In-Stock

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$50.780

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1,482

$50.780

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DigiPath Technology Company

USA . 257 parts In-Stock

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$55.915

100+ parts

$51.442

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257

$55.915

$51.442

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ChromeModa Solutions

Germany . 1,067 parts In-Stock

1+ parts

$57.056

100+ parts

$46.786

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1,067

$57.056

$46.786

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IDEA Electronic Components Group

UK . 712 parts In-Stock

1+ parts

$57.056

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$54.203

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$51.350

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712

$57.056

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$51.350

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Corphita

USA . 2,204 parts In-Stock

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Overview

Experience the power and precision of the POMAP5910GGZG2 by Texas Instruments, a top-of-the-line Digital Signal Processor (DSP) that delivers unparalleled performance in a compact package. With cutting-edge technology and a commitment to excellence, Texas Instruments sets the standard for quality in the industry. Ideal for a wide range of applications, this DSP offers customers unmatched value, efficiency, and reliability. Unlock the potential of your projects with the POMAP5910GGZG2 and elevate your work to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards, saving time and effort during production.

Maximum Supply Voltage: 1.675 V

This higher supply voltage allows for better performance and efficiency in handling power requirements.

Address Bus Width: 25

The wide address bus width enables the processor to access a large memory space, enhancing its data processing capabilities.

Package Shape: SQUARE

The square shape of the package helps in efficient PCB layout and component placement, optimizing space usage.

Bit Size: 16

With a 16-bit architecture, the processor can handle data in larger chunks, improving efficiency in signal processing tasks.

Power Supplies (V): 1.6,1.8/2.75/3.3

Support for multiple power supply options enhances flexibility in design and compatibility with various system requirements.

No. of Terminals: 289

The high number of terminals allows for a wide range of connections, enabling the processor to interface with multiple peripherals efficiently.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers high-density mounting, reducing overall PCB footprint and enabling compact and space-saving designs.

Minimum Supply Voltage: 1.525 V

The low minimum supply voltage ensures energy efficiency and extends battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes the product suitable for industrial applications where harsh environmental conditions are common.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the processor to function reliably in extreme cold environments, ensuring consistent performance.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB layout and assembly, improving overall system reliability and ease of maintenance.

Maximum Seated Height: 1.2 mm

The low seated height enhances airflow and heat dissipation in the system, preventing overheating and ensuring stable performance.

RAM Words: 163840

The large RAM capacity enables the processor to store and manipulate a significant amount of data, enhancing its processing capabilities.

Width: 12 mm

The compact width of the processor allows for space-efficient designs, making it suitable for size-constrained applications.

Boundary Scan: YES

Boundary scan capability facilitates easy testing and debugging of the processor during production and maintenance, improving overall reliability.

External Data Bus Width: 16

The wide external data bus width enables high-speed data transfer between the processor and peripherals, enhancing overall system performance.

Maximum Clock Frequency: 13 MHz

The high maximum clock frequency allows for fast processing and real-time data handling, making the product suitable for time-sensitive applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and multitasking capabilities, enabling efficient processing of complex algorithms.

Length: 12 mm

The compact length of the processor complements its width, enabling space-efficient designs without compromising performance.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding environments, making the processor suitable for rugged applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The mixed peripheral IC type combines digital signal processing capabilities with versatile peripheral interfaces, enabling diverse application possibilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing energy efficiency and reliability in the processor.

Terminal Form: BALL

Ball terminal form simplifies soldering and enhances connection reliability, ensuring robust electrical connections in the system.

Nominal Supply Voltage: 1.6 V

The nominal supply voltage ensures stable and consistent operation of the processor, improving overall system performance and reliability.

Terminal Pitch: 0.5 mm

The tight terminal pitch enables high-density mounting and compact PCB designs, making the processor ideal for space-constrained applications.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and data manipulation, enhancing computational efficiency and accuracy in signal processing tasks.

Low Power Mode: YES

The low power mode allows the processor to optimize energy usage and extend battery life, making the product ideal for portable and battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) POMAP5910GGZG2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

25

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

13 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B289

Length:

12 mm

Low Power Mode:

YES

No. of Terminals:

289

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.6,1.8/2.75/3.3

Qualification:

Not Qualified

RAM Words:

163840

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.675 V

Minimum Supply Voltage:

1.525 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

POMAP5910GGZG2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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