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DSPB56362AG120R2

NXP Semiconductors

DSPB56362AG120R2 by NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 41,974 parts In-Stock

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Digiode

USA . 4,528 parts In-Stock

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Flip Electronics

USA . 4,519 parts In-Stock

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Vyrian

USA . 3,946 parts In-Stock

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Anansix

USA . 2,768 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 781 parts In-Stock

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$0.113

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Northwest PG Solutions

USA . 1,403 parts In-Stock

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$0.124

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Ampacity Inc.

Singapore . 41,803 parts In-Stock

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$6.000

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Corohmni

South Africa . 1,244 parts In-Stock

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AZTECH Wire

Italy . 247 parts In-Stock

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$21.230

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Microchip USA

USA . 365 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 24,084 parts In-Stock

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Corphita

USA . 1,915 parts In-Stock

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UNI Independent Distributors

Spain . 1,905 parts In-Stock

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Technical Specifications

Digital Signal Processors (DSPs) DSPB56362AG120R2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

DSPB56362AG120R2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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