Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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NXP Semiconductors' DSPB56362AG120 is a 120 MHz DSP with 18-bit address bus and 24-bit external data bus. Ideal for digital signal processing applications, it features low power mode, barrel shifter, and boundary scan support. The flatpack package has 144 terminals in a square shape with a low profile of 1.6 mm height.
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$5.000
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$24.469
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$25.000
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$25.548
QUARKTWIN TECHNOLOGY LTD
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Metaverse IC Inc.
Alle Elektronik GmbH
UNI Independent Distributors
Corphita
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Kepictronics
This material is commonly used for electronic components because it is lightweight, durable, and cost-effective.
Surface mounting allows for easy and efficient assembly onto circuit boards, reducing production time and costs.
This high maximum supply voltage provides flexibility in powering the DSP and allows for compatibility with a variety of systems.
A wider address bus allows for a larger memory address space, enabling the DSP to handle more complex tasks and data processing.
The square package shape is space-efficient and makes it easy to integrate the DSP into compact electronic devices.
Having a high number of terminals allows for a greater number of connections, enabling the DSP to interface with multiple components and peripherals.
This package style is ideal for applications where space is limited, as it provides a low profile and fine pitch for compact design.
The minimum supply voltage ensures stable operation of the DSP, even under lower voltage conditions, improving reliability.
A tin terminal finish provides good solderability and conductivity, ensuring reliable connections during assembly.
Quad terminal positioning allows for efficient heat dissipation and electrical connectivity, improving overall performance.
The low seated height allows for slim and compact electronic designs, making the DSP suitable for space-constrained applications.
The moderate width of the DSP makes it versatile for various board sizes and configurations, offering flexibility in design.
Boundary scan capability enables easier testing and debugging of the DSP during manufacturing, simplifying quality control processes.
A wider external data bus facilitates faster data transfer rates and processing speeds, enhancing the performance of the DSP.
A high maximum clock frequency allows for rapid data processing and real-time computation, making the DSP suitable for demanding applications.
This spec indicates the duration the DSP can withstand peak reflow temperatures during soldering, ensuring reliable assembly.
The high peak reflow temperature tolerance of the DSP allows for lead-free soldering processes, meeting industry standards.
Multiple internal bus architecture enhances the DSP's parallel processing capabilities, enabling efficient data handling and computation tasks.
The compact length of the DSP contributes to its overall small form factor, making it suitable for space-constrained applications.
The peripheral IC type indicates the DSP's ability to interface with various digital signal processing components and peripherals, expanding its functionality.
CMOS technology offers low power consumption, high speed, and noise immunity, making the DSP energy-efficient and reliable for continuous operation.
Gull wing terminal form provides mechanical strength and ease of soldering, ensuring secure connections and reliable performance of the DSP.
The nominal supply voltage indicates the standard operating voltage, ensuring compatibility with various power sources and systems.
The small terminal pitch allows for closer spacing of terminals, enabling high-density integration and miniaturization of electronic components.
The fixed-point format simplifies mathematical calculations, reduces processing overhead, and improves computational efficiency of the DSP.
MSL 3 indicates moderate sensitivity to moisture, requiring proper handling and storage practices to ensure the reliability and longevity of the DSP.
The low power mode feature allows the DSP to operate with reduced power consumption, extending battery life and enhancing energy efficiency.
A barrel shifter circuit enables efficient shifting and rotation operations, enhancing the DSP's computational capabilities and algorithm processing.
Digital Signal Processors (DSPs) DSPB56362AG120 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors
Address Bus Width:
Barrel Shifter:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Internal Bus Architecture:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
DSPB56362AG120 Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
ULN2803ADWR
Texas Instruments
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
1N4148
Onsemi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
M39029/58-360
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Infineon Technologies
ULN2003ADR
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRS340T3G
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
Rochester Electronics
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
Panjit International
DSPIC33FJ128MC204-I/PT
Microchip Technology
DSPIC33FJ128MC204-I/PT by Microchip Technology is a 16-bit DSP with 3.6V max supply voltage, 40MHz clock frequency, and 9-Ch 12-Bit ADCs. Ideal for industrial applications requiring high-speed processing, it features multiple peripherals like PWM(6), UART(2), and I2C connectivity in a compact flatpack package.
DSPIC33FJ64GS610-I/PT
DSPIC33FJ64GS610-I/PT by Microchip is a 16-bit DSP with 40 MHz clock frequency, 3.3V supply, and 85°C operating temp. Ideal for industrial applications, it features DAC and ADC channels, 9216 RAM words, and FLASH ROM programmability for digital signal processing tasks.
DSPIC33EP512MC806T-E/PT
DSPIC33EP512MC806T-E/PT by Microchip Technology is a 16-bit digital signal processor with 53248 RAM words, operating at up to 60 MHz. Ideal for automotive applications, it features 9 timers, 15 DMA channels, and low power mode for efficient performance in various control systems.
DSPIC33EP128GS804-E/MLVAO
DSPIC33EP128GS804-E/MLVAO by Microchip Technology is a 16-bit DSP with 8192 RAM words, operating at up to 60 MHz. Ideal for automotive applications due to AEC-Q100 screening, it features 4 external interrupts and low power mode support. With a max supply voltage of 3.6V and flash ROM programmability, this chip offers versatile digital signal processing capabilities in a compact square package.
DSP56F803BU80E
Freescale Semiconductor
DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;
88LX5153A0-BUU2C000
Maxlinear
Digital Signal Processors;
DSPIC33CH256MP208-I/PT
DSPIC33CH256MP208-I/PT by Microchip Technology is a 16-bit digital signal processor with 64 MHz clock frequency, 32768 RAM words, and 3.6V max supply voltage. Ideal for industrial applications requiring high-speed processing, it features 8 DMA channels, FLASH ROM programmability, and low power mode for efficient operation.
DSPIC33FJ64MC506A-I/PT
DSPIC33FJ64MC506A-I/PT by Microchip is a 16-bit DSP with 3.3V supply, 40MHz clock speed, and 8192 RAM words. Ideal for industrial applications, it features 11 timers, ADC channels, and PWM channels for precise digital signal processing tasks. With low power mode and barrel shifter capabilities, it offers efficient performance in a compact square package.
TMS320C30GEL40
TMS320C30GEL40 by Texas Instruments is a 32-bit DSP with 5V supply, 40MHz clock frequency, and 1024 RAM words. Ideal for digital signal processing applications due to its 32-bit data RAM width, 24-bit address bus width, and floating-point format support.
DSPIC33FJ128GP706A-I/PT
The Microchip Technology DSPIC33FJ128GP706A-I/PT is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 85°C. Ideal for industrial applications requiring FLASH ROM programmability, it features a supply voltage of 3.3V and terminal pitch of 0.5mm.
DSPIC33CH512MP508-E/PTVAO
DSPIC33CH512MP508-E/PTVAO by Microchip Technology is a 16-bit digital signal processor with 64 MHz clock frequency, suitable for automotive applications. It features 49152 RAM words, 8 DMA channels, and operates at temperatures ranging from -40 to 125°C. Ideal for high-performance embedded systems requiring low power consumption.
PIC24EP256GU810-I/PT
PIC24EP256GU810-I/PT by Microchip is a 16-bit DSP with 28672 RAM words, operating at up to 60 MHz. Ideal for industrial applications, it features 9 timers, 15 DMA channels, and low power mode support. With a max supply voltage of 3.6V and temperature range of -40 to 85°C, it offers high performance in a compact square package.
DSPIC33EV64GM102-I/MM
DSPIC33EV64GM102-I/MM by Microchip Technology is a 16-bit DSP with 40 MHz clock frequency, 11-Ch ADC, and 4 DMA channels. Ideal for industrial applications requiring high-speed processing, low power mode, and connectivity via CAN, I2C, SPI, UART interfaces.
DSPIC33CK512MP606-E/MR
DSPIC33CK512MP606-E/MR by Microchip Technology is a 16-bit DSP with 64 MHz clock frequency, 65536 RAM words, and 8 DMA channels. Ideal for digital signal processing applications in automotive electronics due to AEC-Q100 screening, low power mode, and flash ROM programmability.
DSPIC33CK32MP505-I/PT
DSPIC33CK32MP505-I/PT by Microchip Technology is a 16-bit digital signal processor with 64 MHz clock frequency, 8192 RAM words, and 3.6V max supply voltage. Ideal for industrial applications requiring high-speed processing, it features multiple internal bus architecture and low power mode for efficient operation.
DSPIC33EP512GP506T-I/PT
DSPIC33EP512GP506T-I/PT by Microchip Technology is a 16-bit digital signal processor with 49152 RAM words, operating at up to 60 MHz. It features 3.3V power supplies, industrial temperature grade, and boundary scan capability. Ideal for applications requiring high-speed processing in industrial environments.
DSPIC33EV128GM102-E/SO
DSPIC33EV128GM102-E/SO by Microchip is a 16-bit DSP with 131072 ROM words, 8192 RAM words, and 11-Ch 12-Bit ADC channels. Ideal for automotive applications, it offers CAN, I2C, LIN connectivity and operates at a max frequency of 40 MHz.
ADSP-21562BSWZ4
Analog Devices' ADSP-21562BSWZ4 is a 32-bit DSP with integrated cache, 163840 RAM words, and 16-bit external data bus width. Ideal for automotive applications, it operates b/w -40 to 125 °C with low power mode and floating point format for efficient processing.
TMS320F2808ZGMA
TMS320F2808ZGMA by Texas Instruments is a 32-bit DSP with 100MHz clock frequency, 18432 RAM words, and flash ROM. Widely used in industrial applications for digital signal processing tasks due to its low power mode, multiple internal bus architecture, and 10 timers for precise control.
DSPIC33EP512MC202-E/SP
DSPIC33EP512MC202-E/SP by Microchip Technology is a 16-bit digital signal processor with 49152 RAM words and a max clock frequency of 60 MHz. Ideal for automotive applications, it features 3.3V power supplies, AEC-Q100 screening level, and flash ROM programmability.
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DSPB56725AF
NXP Semiconductors
DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE;
DSPB56374AEC
DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: GULL WING; No. of Terminals: 52; Package Code: LQFP; Package Shape: SQUARE; Maximum Supply Voltage: 1.3 V;
DSPB56367AG150
DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH;
DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Qualification: Not Qualified;
DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
DSPB56724AG
DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
DSPB56725CAF
DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LQFP; Package Shape: SQUARE;
DSPB56362PV100
DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Bit Size: 24;
DSPB56367PV150
DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; JESD-609 Code: e0;
DSPB56362AG120
DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES;
DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Address Bus Width: 18;
DSPB56362AG120R2
DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
DSPB56012BU95
Digital Signal Processors; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE; Terminal Position: QUAD;
DSPB56371AF150
Digital Signal Processors; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: QFP; Package Shape: SQUARE; Package Equivalence Code: QFP80,.64SQ;
DSPB56362PV120
DIGITAL SIGNAL PROCESSOR, OTHER; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; Terminal Position: QUAD;
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