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DSPB56362AG120

NXP Semiconductors

DSPB56362AG120 by NXP Semiconductors

NXP Semiconductors' DSPB56362AG120 is a 120 MHz DSP with 18-bit address bus and 24-bit external data bus. Ideal for digital signal processing applications, it features low power mode, barrel shifter, and boundary scan support. The flatpack package has 144 terminals in a square shape with a low profile of 1.6 mm height.

Median Price

$64.512

Lifecycle Status

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DSPB56362AG120 by NXP Semiconductors
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Verical

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Digiode

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Chip Stock

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TME

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Corohmni

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Overview

Discover the powerful DSPB56362AG120 by NXP Semiconductors, a top-tier digital signal processor designed to elevate your projects to new heights. With a focus on quality and innovation, NXP Semiconductors delivers cutting-edge technology that pushes the boundaries of what is possible. Ideal for a wide range of applications, this DSP offers unparalleled value, benefits, and advantages to customers seeking high-performance solutions. Embrace the future with the DSPB56362AG120 and experience the difference that NXP Semiconductors brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components because it is lightweight, durable, and cost-effective.

Surface Mount: YES

Surface mounting allows for easy and efficient assembly onto circuit boards, reducing production time and costs.

Maximum Supply Voltage: 3.46 V

This high maximum supply voltage provides flexibility in powering the DSP and allows for compatibility with a variety of systems.

Address Bus Width: 18

A wider address bus allows for a larger memory address space, enabling the DSP to handle more complex tasks and data processing.

Package Shape: SQUARE

The square package shape is space-efficient and makes it easy to integrate the DSP into compact electronic devices.

No. of Terminals: 144

Having a high number of terminals allows for a greater number of connections, enabling the DSP to interface with multiple components and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style is ideal for applications where space is limited, as it provides a low profile and fine pitch for compact design.

Minimum Supply Voltage: 3.14 V

The minimum supply voltage ensures stable operation of the DSP, even under lower voltage conditions, improving reliability.

Terminal Finish: TIN

A tin terminal finish provides good solderability and conductivity, ensuring reliable connections during assembly.

Terminal Position: QUAD

Quad terminal positioning allows for efficient heat dissipation and electrical connectivity, improving overall performance.

Maximum Seated Height: 1.6 mm

The low seated height allows for slim and compact electronic designs, making the DSP suitable for space-constrained applications.

Width: 20 mm

The moderate width of the DSP makes it versatile for various board sizes and configurations, offering flexibility in design.

Boundary Scan: YES

Boundary scan capability enables easier testing and debugging of the DSP during manufacturing, simplifying quality control processes.

External Data Bus Width: 24

A wider external data bus facilitates faster data transfer rates and processing speeds, enhancing the performance of the DSP.

Maximum Clock Frequency: 120 MHz

A high maximum clock frequency allows for rapid data processing and real-time computation, making the DSP suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 40

This spec indicates the duration the DSP can withstand peak reflow temperatures during soldering, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of the DSP allows for lead-free soldering processes, meeting industry standards.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances the DSP's parallel processing capabilities, enabling efficient data handling and computation tasks.

Length: 20 mm

The compact length of the DSP contributes to its overall small form factor, making it suitable for space-constrained applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type indicates the DSP's ability to interface with various digital signal processing components and peripherals, expanding its functionality.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and noise immunity, making the DSP energy-efficient and reliable for continuous operation.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering, ensuring secure connections and reliable performance of the DSP.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage indicates the standard operating voltage, ensuring compatibility with various power sources and systems.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for closer spacing of terminals, enabling high-density integration and miniaturization of electronic components.

Format: FIXED POINT

The fixed-point format simplifies mathematical calculations, reduces processing overhead, and improves computational efficiency of the DSP.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring proper handling and storage practices to ensure the reliability and longevity of the DSP.

Low Power Mode: YES

The low power mode feature allows the DSP to operate with reduced power consumption, extending battery life and enhancing energy efficiency.

Barrel Shifter: YES

A barrel shifter circuit enables efficient shifting and rotation operations, enhancing the DSP's computational capabilities and algorithm processing.

Technical Specifications

Digital Signal Processors (DSPs) DSPB56362AG120 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Address Bus Width:

18

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

120 MHz

External Data Bus Width:

24

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.46 V

Minimum Supply Voltage:

3.14 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

DSPB56362AG120 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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