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DSPB56371AF150

NXP Semiconductors

DSPB56371AF150 by NXP Semiconductors

Digital Signal Processors; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: QFP; Package Shape: SQUARE; Package Equivalence Code: QFP80,.64SQ;

Median Price

$20.950

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 270 parts In-Stock

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$18.230

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-

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$18.050

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270

$18.230

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$18.050

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DigiKey

USA . 509 parts In-Stock

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-

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$23.670

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509

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Flip Electronics (Authorized)

USA . 509 parts In-Stock

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509

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Vyrian

USA . 3,597 parts In-Stock

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$21.520

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Cyclops Electronics Ltd

UK . 3,436 parts In-Stock

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3,436

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Chip Stock

USA . 2,790 parts In-Stock

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Digiode

USA . 2,487 parts In-Stock

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509

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Anansix

USA . 494 parts In-Stock

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Sensible Micro Corp

USA . 75 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 5,054 parts In-Stock

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$71.919

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$71.919

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Authorized Procurement Solutions

USA . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 16,373 parts In-Stock

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Microchip USA

USA . 12,236 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,983 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,655 parts In-Stock

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Corphita

USA . 3,430 parts In-Stock

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Northwest PG Solutions

USA . 1,773 parts In-Stock

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Kepictronics

USA . 1,635 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Metaverse IC Inc.

Canada . 317 parts In-Stock

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Component Stockers USA

USA . 291 parts In-Stock

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$32.100

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UNI Independent Distributors

Spain . 276 parts In-Stock

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ChipstoGo Electronic ltd

UK . 217 parts In-Stock

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Glotronic Ltd.

UK . 216 parts In-Stock

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Native Components

USA . 95 parts In-Stock

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Technical Specifications

Digital Signal Processors (DSPs) DSPB56371AF150 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Bit Size:

24

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.25,3.3

Qualification:

Not Qualified

RAM Words:

86016

Sub-Category:

Digital Signal Processors

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

DSPB56371AF150 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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