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DSPIC33EP512MC806T-I/MR

Microchip Technology

DSPIC33EP512MC806T-I/MR by Microchip Technology

DSPIC33EP512MC806T-I/MR by Microchip Technology is a 16-bit digital signal processor with a max clock frequency of 60 MHz. It has 64 terminals and a package shape of square, making it suitable for industrial applications requiring high-speed processing. With its low power mode and on-chip program ROM width of 8, it offers efficient performance in various electronic systems.

Median Price

$12.606

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

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$12.606

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$12.606

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Vyrian

USA . 6,873 parts In-Stock

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6,873

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,224 parts In-Stock

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$7.000

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$7.000

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AZTECH Wire

Italy . 542 parts In-Stock

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$12.553

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Continental Prestige Electronics

USA . 634 parts In-Stock

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$12.606

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$12.354

634

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Semicontronic

India . 201 parts In-Stock

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$33.000

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$32.175

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$32.010

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201

$33.000

$32.175

$32.010

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Corohmni

South Africa . 1,216 parts In-Stock

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$36.660

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Aztec Data Supply Inc.

USA . 305 parts In-Stock

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$70.140

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Argo Parts USA

USA . 2,885 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$12.354

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$11.976

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$11.724

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$12.354

$11.976

$11.724

Marpe Global Electronics

Taiwan . 66 parts In-Stock

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QualityLine Systems

Poland . 66 parts In-Stock

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XL Components Corporation

Australia . 66 parts In-Stock

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Overview

Experience the power of digital signal processing with the DSPIC33EP512MC806T-I/MR from Microchip Technology. As a trusted manufacturer, Microchip Technology delivers high-quality products that are designed to meet your needs. The DSPIC33EP512MC806T-I/MR is a versatile digital signal processor that offers exceptional performance and reliability. With a maximum clock frequency of 60 MHz and a wide range of features, this product is perfect for a variety of applications. Whether you're working on audio processing, motor control, or communication systems, the DSPIC33EP512MC806T-I/MR has got you covered. Get ready to take your projects to the next level with this outstanding digital signal processor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the DSP, making it suitable for various applications without adding unnecessary weight.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while ensuring the DSP operates within safe voltage limits.

Bit Size: 16

With a 16-bit architecture, the DSP can handle complex calculations and processing tasks efficiently, leading to improved performance.

No. of Terminals: 64

Having a sufficient number of terminals allows for easy connectivity and integration of the DSP with other components in a system.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the DSP can function effectively in various environments without overheating or performance degradation.

Technology: CMOS

The CMOS technology used in the DSP enables low power consumption and high-speed operation, making it efficient for energy-sensitive applications.

Maximum Clock Frequency: 60 MHz

The high clock frequency allows for quick data processing and execution of instructions, enhancing the overall performance of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP512MC806T-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Words:

53248

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP512MC806T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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