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M68AF031AL55N1T

STMicroelectronics

M68AF031AL55N1T by STMicroelectronics

M68AF031AL55N1T by STMicroelectronics is a 32Kx8 asynchronous SRAM with a 5V supply, ideal for high-speed applications. It features a max access time of 55 ns and operates within -40 °C to 70 °C. Its compact SOIC package makes it suitable for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,815 parts In-Stock

1+ parts

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4,815

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Digiode

USA . 2,811 parts In-Stock

1+ parts

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2,811

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Anansix

USA . 2,625 parts In-Stock

1+ parts

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2,625

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 160 parts In-Stock

1+ parts

$4.211

100+ parts

-

1k+ parts

$3.790

10k+ parts

-

160

$4.211

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$3.790

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MKK Technologies

India . 153 parts In-Stock

1+ parts

$7.918

100+ parts

-

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153

$7.918

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DigiPath Technology Company

USA . 153 parts In-Stock

1+ parts

$7.918

100+ parts

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153

$7.918

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Corphita

USA . 3,892 parts In-Stock

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3,892

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Parana Technologies

USA . 2,101 parts In-Stock

1+ parts

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100+ parts

$5.035

1k+ parts

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2,101

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$5.035

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Overview

Unlock unparalleled performance with the M68AF031AL55N1T SRAM from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for versatility and efficiency, this high-quality memory chip is perfect for consumer electronics, automotive systems, and industrial applications. With its low power consumption and robust design, it delivers swift data access and reliability you can trust, enhancing your projects’ performance and longevity. Elevate your designs with STMicroelectronics—where excellence meets innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material enhances reliability in various applications.

Surface Mount: YES

Facilitates compact designs and efficient space utilization on PCBs.

Package Shape: RECTANGULAR

Standard shape that simplifies integration into existing designs.

Operating Mode: ASYNCHRONOUS

Provides flexibility in timing requirements, allowing for faster system responsiveness.

Input/Output Type: COMMON

Supports standard interfacing, making integration with other components easier.

Nominal Supply Voltage / Vsup (V): 5

Common voltage level ensures compatibility with a wide range of electronic systems.

Power Supplies (V): 5

Single-supply operation simplifies power management in designs.

No. of Terminals: 28

Offers sufficient connectivity options for various applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Ideal for space-constrained applications, allowing for denser designs.

Maximum Operating Temperature: 70 °C

Suitable for a variety of commercial applications without overheating.

Organization: 32KX8

Offers a balance of memory density and access speed, optimal for general use.

Output Characteristics: 3-STATE

Provides flexibility in bus configurations, enabling efficient data handling.

Minimum Standby Voltage: 2 V

Allows for operation in lower voltage environments, increasing design versatility.

Minimum Operating Temperature: 0 °C

Ensures reliable operation in a wide range of environmental conditions.

Terminal Finish: TIN LEAD

Provides excellent solderability for reliable connectivity.

Terminal Position: DUAL

Facilitates easier mounting on PCBs, enhancing design flexibility.

Maximum Seated Height: 1.2 mm

Low profile design is ideal for compact electronic devices.

Width: 8 mm

Compact width allows for more efficient use of PCB space.

Minimum Supply Voltage (Vsup): 4.5 V

Allows for operation in varied conditions while maintaining stability.

Length: 11.8 mm

Compact length further aids in space-saving designs.

Temperature Grade: COMMERCIAL

Suitable for a wide range of commercial applications with good performance.

Technology: CMOS

Ensures low power consumption and high speed, ideal for portable applications.

Parallel or Serial: PARALLEL

Offers higher data throughput, suitable for performance-critical applications.

Terminal Form: GULL WING

Provides a reliable and robust connection for surface mount applications.

Maximum Supply Current: 50 mA

Low current requirement helps in energy-efficient designs.

No. of Words: 32768 words

Generous memory capability meets the demands of a variety of applications.

Memory Width: 8

Supports standard 8-bit data paths, enhancing compatibility with most systems.

Terminal Pitch: 0.55 mm

Allows for denser arrangements of components on PCBs, optimizing space.

No. of Words Code: 32K

Provides a robust memory solution for a range of memory-intensive applications.

Maximum Supply Voltage (Vsup): 5.5 V

Offers some flexibility in power supply configurations.

Memory Density: 262144 bit

High density allows for more data storage in a compact form factor.

Memory IC Type: STANDARD SRAM

Trusted technology with established reliability for everyday applications.

Maximum Standby Current: 0.000006 Amp

Extremely low standby current enhances battery life in portable applications.

Maximum Access Time: 55 ns

Fast access time improves system performance and responsiveness.

Technical Specifications

SRAM M68AF031AL55N1T attributes and parameters. Explore more SRAM devices from STMicroelectronics

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e0

Length:

11.8 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.53,22

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.000006 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.55 mm

Terminal Position:

DUAL

Width:

8 mm

Trade Compliance

M68AF031AL55N1T Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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