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CY62148GN-45SXI

Infineon Technologies

CY62148GN-45SXI by Infineon Technologies

CY62148GN-45SXI by Infineon Technologies is a 512Kx8 SRAM with 45ns access time, operating at 5V. It features a small outline package, GULL WING terminals, and industrial temperature grade. Ideal for applications requiring fast and reliable parallel memory storage in harsh environments.

Median Price

$3.636

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 466 parts In-Stock

1+ parts

$5.350

100+ parts

-

1k+ parts

$3.740

10k+ parts

-

466

$5.350

-

$3.740

-

Flip Electronics (Authorized)

USA . 12,086 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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12,086

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-

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DigiKey

USA . 6,886 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.380

10k+ parts

-

6,886

-

-

$3.380

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Verical

USA . 6,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.892

10k+ parts

-

6,240

-

-

$3.892

-

Rochester

USA . 5,813 parts In-Stock

1+ parts

-

100+ parts

$3.290

1k+ parts

$2.940

10k+ parts

$2.770

5,813

-

$3.290

$2.940

$2.770

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 822 parts In-Stock

1+ parts

$3.486

100+ parts

-

1k+ parts

-

10k+ parts

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822

$3.486

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.220

100+ parts

-

1k+ parts

-

10k+ parts

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50

$4.220

-

-

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Flip Electronics

USA . 6,686 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,686

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-

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Vyrian

USA . 4,934 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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4,934

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,600 parts In-Stock

1+ parts

$2.870

100+ parts

-

1k+ parts

-

10k+ parts

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3,600

$2.870

-

-

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Modulus Dynamics

Lithuania . 3,511 parts In-Stock

1+ parts

$3.159

100+ parts

$3.033

1k+ parts

$2.906

10k+ parts

-

3,511

$3.159

$3.033

$2.906

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Corphita

USA . 909 parts In-Stock

1+ parts

$3.303

100+ parts

-

1k+ parts

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10k+ parts

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909

$3.303

-

-

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Component Stockers USA

USA . 544 parts In-Stock

1+ parts

$3.780

100+ parts

$4.180

1k+ parts

-

10k+ parts

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544

$3.780

$4.180

-

-

Continental Prestige Electronics

USA . 2,966 parts In-Stock

1+ parts

$3.925

100+ parts

-

1k+ parts

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10k+ parts

$3.846

2,966

$3.925

-

-

$3.846

Argo Parts USA

USA . 80 parts In-Stock

1+ parts

$3.925

100+ parts

-

1k+ parts

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10k+ parts

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80

$3.925

-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$4.220

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$4.220

-

-

-

Overview

Unlock the power of reliable data storage with the CY62148GN-45SXI by Infineon Technologies. Known for their superior quality and cutting-edge technology, Infineon offers a wide range of applications for their SRAM products, making them a trusted choice for customers seeking high-performance memory solutions. With a focus on value and efficiency, this product provides fast access times and a wide supply voltage range, making it ideal for industrial-grade applications where reliable data storage is essential. Trust in Infineon to deliver top-notch performance and unparalleled reliability with the CY62148GN-45SXI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

With surface mount capability, this product is easy to install on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the circuit board, making it suitable for compact electronic devices.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode ensures fast and independent access to each memory location, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this product is compatible with a wide range of electronic systems.

No. of Terminals: 32

The 32 terminals provide ample connectivity options, allowing for versatile integration into various electronic applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for devices with limited real estate.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions.

Organization: 512KX8

The 512KX8 organization offers a large memory capacity and efficient data retrieval, making it ideal for high-performance applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation in cold environments.

Terminal Finish: PURE TIN

The pure tin terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position design improves signal integrity and reduces electromagnetic interference, enhancing overall system performance.

Maximum Seated Height: 2.997 mm

The low maximum seated height allows for a slim and compact design, ideal for space-constrained electronic devices.

Width: 11.303 mm

The compact width of 11.303 mm saves space on the circuit board, making it suitable for small form factor applications.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, this product can operate efficiently even with low power sources.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable soldering during assembly, reducing the risk of defects.

Length: 20.446 mm

The length of 20.446 mm provides ample space for integration into various electronic devices, offering flexibility in design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making this product suitable for industrial applications.

Technology: CMOS

The CMOS technology offers low power consumption and high speed operation, making this product energy-efficient and fast.

Parallel or Serial: PARALLEL

The parallel data transfer mode allows for high-speed communication between the memory and the controller, improving overall system performance.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure solder joints, ensuring long-term durability in various operating conditions.

No. of Words: 524288 words

With 524288 words of memory capacity, this product offers ample storage for data-intensive applications, enhancing functionality.

Memory Width: 8

The memory width of 8 bits allows for efficient data processing and storage, making this product suitable for a wide range of applications.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm enables high-density mounting, saving space on the circuit board and enhancing design flexibility.

No. of Words Code: 512K

The 512K words code indicates a large memory capacity, suitable for applications requiring extensive data storage and processing.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures proper handling and storage procedures, reducing the risk of damage during production and assembly.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this product offers a wide voltage range tolerance, enhancing compatibility with different systems.

Memory Density: 4194304 bit

The high memory density of 4194304 bits provides ample storage capacity for data-intensive applications, making this product highly versatile.

Memory IC Type: STANDARD SRAM

The standard SRAM memory IC type ensures compatibility with a wide range of systems, offering reliability and performance.

Maximum Access Time: 45 ns

The fast maximum access time of 45 nanoseconds ensures quick data retrieval and processing, making this product ideal for high-speed applications.

Technical Specifications

SRAM CY62148GN-45SXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

JESD-30 Code:

R-PDSO-G32

Length:

20.446 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.997 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

11.303 mm

Trade Compliance

CY62148GN-45SXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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