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CY62187EV30LL-55BAXIT

Infineon Technologies

CY62187EV30LL-55BAXIT by Infineon Technologies

Infineon's CY62187EV30LL-55BAXIT is a 3.3V SRAM with 4MX16 organization, operating at -40 to 85°C. It features a low profile grid array package, 0.75mm terminal pitch, and 55ns access time. Ideal for industrial applications requiring fast parallel memory with common I/O type.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 13,588 parts In-Stock

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Vyrian

USA . 13,305 parts In-Stock

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Chip Stock

USA . 9,000 parts In-Stock

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Component Sense

UK . 2,477 parts In-Stock

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USA . 2,365 parts In-Stock

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Digiode

USA . 322 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 121 parts In-Stock

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$2.011

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Corohmni

South Africa . 901 parts In-Stock

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$2.862

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Modulus Dynamics

Lithuania . 4,811 parts In-Stock

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$3.112

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$2.988

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$2.863

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4,811

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$4.733

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$4.496

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$4.496

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Semicontronic

India . 13,348 parts In-Stock

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$6.825

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$6.790

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Ampacity Inc.

Singapore . 13,578 parts In-Stock

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Component Stockers USA

USA . 118 parts In-Stock

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Lixinc

USA . 10,805 parts In-Stock

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Argo Parts USA

USA . 4,295 parts In-Stock

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Continental Prestige Electronics

USA . 4,221 parts In-Stock

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Authorized Procurement Solutions

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RC Electronics

USA . 859 parts In-Stock

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Corphita

USA . 395 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Unlock the power of reliable and high-performance memory with the CY62187EV30LL-55BAXIT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-notch quality and cutting-edge technology in their SRAM products. This versatile memory solution is perfect for a wide range of applications, offering customers seamless operation and efficient data processing. Experience the value and advantages of Infineon Technologies' CY62187EV30LL-55BAXIT, where quality meets innovation for your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 3

Compatible with common voltage levels used in electronic devices, ensuring compatibility with a wide range of systems.

No. of Terminals: 48

Provides sufficient connectivity options for interfacing with other components, enhancing the flexibility of the product.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications where heat resistance is crucial.

Memory Width: 16

Offers a wide memory width, allowing for faster data transfer and processing speeds.

Technology: CMOS

Utilizes CMOS technology, known for its low power consumption and high speed operation, making it energy-efficient and effective.

Technical Specifications

SRAM CY62187EV30LL-55BAXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

9.5 mm

Memory Density:

67108864 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

4194304 words

No. of Words Code:

4M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

4MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Maximum Standby Current:

.000048 Amp

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

55 mA

Maximum Supply Voltage (Vsup):

3.7 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

CY62187EV30LL-55BAXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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