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CY62167EV30LL-45ZXIT

Infineon Technologies

CY62167EV30LL-45ZXIT by Infineon Technologies

CY62167EV30LL-45ZXIT by Infineon: 1MX16 SRAM with 3.6V max supply, 45ns access time, and 1M word code. Ideal for industrial applications requiring fast, high-density memory in a small outline package.

Median Price

$9.620

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 9 parts In-Stock

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$5.165

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Chip1Stop

Japan . 2,779 parts In-Stock

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$13.100

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Flip Electronics (Authorized)

USA . 4,935 parts In-Stock

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4,935

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Rochester

USA . 1,321 parts In-Stock

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$9.020

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$8.070

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$7.590

1,321

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$8.070

$7.590

Future Electronics

Canada . 1,000 parts In-Stock

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$9.620

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Verical

USA . 714 parts In-Stock

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$11.275

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$10.088

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$9.488

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Distributors (In-Stock)

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Digiode

USA . 366 parts In-Stock

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$13.167

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Nova Conductors

Japan . 500 parts In-Stock

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$17.420

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Chip Stock

USA . 14,640 parts In-Stock

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Vyrian

USA . 2,378 parts In-Stock

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Flip Electronics

USA . 1,535 parts In-Stock

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IBS Electronics

USA . 1,000 parts In-Stock

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$13.492

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Cyclops Electronics Ltd

UK . 373 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 4,546 parts In-Stock

1+ parts

$3.443

100+ parts

$3.305

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$3.168

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4,546

$3.443

$3.305

$3.168

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Corohmni

South Africa . 85 parts In-Stock

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$4.729

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$4.729

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Aztec Data Supply Inc.

USA . 308 parts In-Stock

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$5.776

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$5.900

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$5.605

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$5.605

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500

$5.900

$5.605

$5.605

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Ampacity Inc.

Singapore . 2,692 parts In-Stock

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$11.690

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Corphita

USA . 883 parts In-Stock

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$12.474

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883

$12.474

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Continental Prestige Electronics

USA . 5,400 parts In-Stock

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$17.420

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$17.072

5,400

$17.420

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$17.072

Component Stockers USA

USA . 22,725 parts In-Stock

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$17.720

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$14.080

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$13.080

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$14.080

$13.080

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Semicontronic

India . 2,266 parts In-Stock

1+ parts

$25.440

100+ parts

$24.804

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$24.677

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$25.440

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iodParts Technologies Inc.

India . 22,600 parts In-Stock

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Lixinc

USA . 6,620 parts In-Stock

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Perfect Parts

USA . 6,458 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,514 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,009 parts In-Stock

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Authorized Procurement Solutions

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Netroflash

USA . 2,000 parts In-Stock

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RC Electronics

USA . 1,511 parts In-Stock

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Futuretech Components

Singapore . 1,500 parts In-Stock

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Argo Parts USA

USA . 1,223 parts In-Stock

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Robosynatics

Brazil . 1,199 parts In-Stock

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$0.155

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$0.155

$0.155

$0.155

Lucentia Tech

USA . 1,199 parts In-Stock

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$0.155

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$0.155

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Kepictronics

USA . 736 parts In-Stock

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Overview

Upgrade your devices with the CY62167EV30LL-45ZXIT from Infineon Technologies, a high-quality SRAM module that offers unparalleled performance and reliability. With its advanced technology and industrial-grade design, this memory module is perfect for applications requiring fast and efficient data storage. Experience seamless operation and enhanced functionality with Infineon's cutting-edge memory solutions. Trust in the reliability and innovation of Infineon Technologies to take your products to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable, this product is easy to integrate onto circuit boards, saving space and reducing assembly time.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for faster access times and more flexible control over data transfer, improving overall performance.

Nominal Supply Voltage / Vsup (V): 3

With a nominal supply voltage of 3V, this product offers a balance between power efficiency and performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation in various environmental conditions.

Memory IC Type: STANDARD SRAM

Being a standard SRAM memory IC, this product offers high-speed data access and low power consumption, making it suitable for a wide range of applications.

Technical Specifications

SRAM CY62167EV30LL-45ZXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Alternate Memory Width:

8

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e3

Length:

18.4 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.8,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Minimum Standby Voltage:

1.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Trade Compliance

CY62167EV30LL-45ZXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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