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CY7C1041G30-10VXIT

Infineon Technologies

CY7C1041G30-10VXIT by Infineon Technologies

CY7C1041G30-10VXIT by Infineon Technologies is a 256Kx16 SRAM with a max clock frequency of 100 MHz. Operating at 3V, it offers an access time of 10ns and features a common I/O type. This memory IC is suitable for applications requiring fast and reliable data storage in electronic devices.

Median Price

$5.562

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 500 parts In-Stock

1+ parts

$6.090

100+ parts

$5.247

1k+ parts

$4.828

10k+ parts

$4.756

500

$6.090

$5.247

$4.828

$4.756

Mouser Electronics

USA . 104 parts In-Stock

1+ parts

$6.100

100+ parts

$5.260

1k+ parts

$4.340

10k+ parts

-

104

$6.100

$5.260

$4.340

-

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.034

10k+ parts

-

2,000

-

-

$5.034

-

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.034

10k+ parts

-

2,000

-

-

$5.034

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 45 parts In-Stock

1+ parts

$5.510

100+ parts

-

1k+ parts

-

10k+ parts

-

45

$5.510

-

-

-

Digiode

USA . 634 parts In-Stock

1+ parts

$6.926

100+ parts

-

1k+ parts

-

10k+ parts

-

634

$6.926

-

-

-

Vyrian

USA . 2,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,169

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 62 parts In-Stock

1+ parts

$3.927

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$3.927

-

-

-

Semicontronic

India . 1,203 parts In-Stock

1+ parts

$4.280

100+ parts

$4.173

1k+ parts

$4.152

10k+ parts

-

1,203

$4.280

$4.173

$4.152

-

Ampacity Inc.

Singapore . 1,037 parts In-Stock

1+ parts

$4.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1,037

$4.280

-

-

-

Modulus Dynamics

Lithuania . 5,880 parts In-Stock

1+ parts

$4.711

100+ parts

$4.523

1k+ parts

$4.334

10k+ parts

-

5,880

$4.711

$4.523

$4.334

-

Aztec Data Supply Inc.

USA . 202 parts In-Stock

1+ parts

$4.907

100+ parts

-

1k+ parts

-

10k+ parts

-

202

$4.907

-

-

-

Continental Prestige Electronics

USA . 6,924 parts In-Stock

1+ parts

$5.510

100+ parts

-

1k+ parts

-

10k+ parts

$5.400

6,924

$5.510

-

-

$5.400

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$5.510

100+ parts

$5.400

1k+ parts

-

10k+ parts

-

2,000

$5.510

$5.400

-

-

Corphita

USA . 659 parts In-Stock

1+ parts

$6.561

100+ parts

-

1k+ parts

-

10k+ parts

-

659

$6.561

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,705 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,705

-

-

-

-

Argo Parts USA

USA . 4,809 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,809

-

-

-

-

Glotronic Ltd.

UK . 1,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,600

-

-

-

-

Overview

Elevate your electronic devices with the CY7C1041G30-10VXIT by Infineon Technologies, a top-tier manufacturer of cutting-edge SRAM technology. Boasting a plethora of applications in various industries, this quality product offers unmatched reliability and performance. With features like common input/output type and 3-state output characteristics, customers can trust in the value and benefits that this product provides. Experience seamless operation and high-speed data processing with the CY7C1041G30-10VXIT, setting new standards for memory ICs in the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design for easy handling and installation.

Surface Mount: YES

Being surface mountable, this product can be easily integrated into various electronic circuit designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible data transfer without the need for strict timing requirements.

Nominal Supply Voltage / Vsup (V): 3

Operating at a standard supply voltage of 3V ensures compatibility with many electronic systems.

Memory Density: 4194304 bit

High memory density enables storing a large amount of data in a small footprint, making it suitable for data-intensive applications.

Technical Specifications

SRAM CY7C1041G30-10VXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

Maximum Clock Frequency (fCLK):

100 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-J44

Length:

28.575 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOJ

Package Equivalence Code:

SOJ44,.44

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Maximum Seated Height:

3.7592 mm

Maximum Standby Current:

.008 Amp

Minimum Standby Voltage:

1 V

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

J BEND

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

CY7C1041G30-10VXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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