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CY7C1051DV33-10ZSXI

Infineon Technologies

CY7C1051DV33-10ZSXI by Infineon Technologies

Infineon's CY7C1051DV33-10ZSXI is a 512Kx16 SRAM with 3.3V supply, operating at -40 to 85°C. It features asynchronous mode, 10ns access time, and 44 terminals in a small outline package. Ideal for industrial applications requiring fast and reliable memory storage.

Median Price

$32.265

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 111,278 parts In-Stock

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Rochester

USA . 86,548 parts In-Stock

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$28.680

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$25.660

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$24.150

86,548

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$25.660

$24.150

Verical

USA . 79,441 parts In-Stock

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$35.850

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$32.075

10k+ parts

$30.188

79,441

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$35.850

$32.075

$30.188

Distributors (In-Stock)

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Nova Conductors

Japan . 15 parts In-Stock

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$12.197

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15

$12.197

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Digiode

USA . 342 parts In-Stock

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$30.352

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342

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Vyrian

USA . 37,208 parts In-Stock

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Flip Electronics

USA . 16,854 parts In-Stock

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Chip Stock

USA . 10,150 parts In-Stock

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DigiKey Marketplace

USA . 2,481 parts In-Stock

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J2 Sourcing AB

Sweden . 142 parts In-Stock

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Cyclops Electronics Ltd

UK . 80 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 63 parts In-Stock

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Atlantic Semiconductor

USA . 11 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 2,674 parts In-Stock

1+ parts

$2.506

100+ parts

$2.406

1k+ parts

$2.306

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2,674

$2.506

$2.406

$2.306

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Aztec Data Supply Inc.

USA . 119 parts In-Stock

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$2.975

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$2.975

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Corohmni

South Africa . 4 parts In-Stock

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$4.373

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$4.373

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Continental Prestige Electronics

USA . 1,932 parts In-Stock

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$12.197

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$11.953

1,932

$12.197

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$11.953

Netroflash

USA . 100 parts In-Stock

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$12.197

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100

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Ampacity Inc.

Singapore . 37,641 parts In-Stock

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$13.260

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Semicontronic

India . 37,171 parts In-Stock

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$13.260

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$12.928

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$12.862

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$13.260

$12.928

$12.862

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Corphita

USA . 690 parts In-Stock

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$28.755

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Lixinc

USA . 9,458 parts In-Stock

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Futuretech Components

Singapore . 6,080 parts In-Stock

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Perfect Parts

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A-Z Elektronik GmbH

Germany . 4,874 parts In-Stock

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Argo Parts USA

USA . 3,959 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,249 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 1,352 parts In-Stock

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Microchip USA

USA . 281 parts In-Stock

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EMSNET (Excess)

USA . 41 parts In-Stock

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Overview

Unlock the power of reliable and efficient memory with the CY7C1051DV33-10ZSXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and performance in all their products. This SRAM device is perfect for a wide range of applications, offering customers unparalleled value and benefits. Experience seamless operation and optimal functionality with this innovative memory solution. Trust Infineon to deliver excellence in every product they create.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

This material provides durability and protection to the internal components of the SRAM, ensuring a longer lifespan.

Nominal Supply Voltage / Vsup (V) - 3.3

Operating at a standard voltage of 3.3V allows for compatibility with a wide range of systems and devices.

Maximum Operating Temperature - 85 °C

With a high maximum operating temperature, this SRAM can function reliably in a variety of environments without overheating.

No. of Terminals - 44

The ample number of terminals provide flexibility for connecting to other components or devices, making integration easier.

Memory Width - 16

A wider memory width of 16 bits allows for faster data transfer and processing, improving overall performance.

Technology - CMOS

Using CMOS technology provides low power consumption and high speed operation, making this SRAM energy-efficient and fast.

Technical Specifications

SRAM CY7C1051DV33-10ZSXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.415 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX16

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.194 mm

Maximum Standby Current:

.02 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

110 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

CY7C1051DV33-10ZSXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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