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CY7C1041GN30-10BVXIT

Infineon Technologies

CY7C1041GN30-10BVXIT by Infineon Technologies

CY7C1041GN30-10BVXIT by Infineon: 256Kx16 SRAM with 10ns access time, operates at -40 to 85°C. Ideal for industrial applications requiring fast and reliable parallel memory storage. Package style: grid array, very thin profile, fine pitch.

Median Price

$4.223

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,835 parts In-Stock

1+ parts

$4.116

100+ parts

$3.658

1k+ parts

$2.782

10k+ parts

-

1,835

$4.116

$3.658

$2.782

-

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

$4.330

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$4.330

-

-

-

Mouser Electronics

USA . 201 parts In-Stock

1+ parts

$5.560

100+ parts

$4.790

1k+ parts

$4.410

10k+ parts

$4.030

201

$5.560

$4.790

$4.410

$4.030

DigiKey

USA . 1,830 parts In-Stock

1+ parts

$6.090

100+ parts

$5.247

1k+ parts

$4.828

10k+ parts

$4.706

1,830

$6.090

$5.247

$4.828

$4.706

Flip Electronics (Authorized)

USA . 60,740 parts In-Stock

1+ parts

-

100+ parts

-

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60,740

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-

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Future Electronics

Canada . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.670

2,000

-

-

-

$2.670

Verical

USA . 1,835 parts In-Stock

1+ parts

-

100+ parts

$3.658

1k+ parts

$2.782

10k+ parts

-

1,835

-

$3.658

$2.782

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 999 parts In-Stock

1+ parts

$4.011

100+ parts

-

1k+ parts

-

10k+ parts

-

999

$4.011

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$6.352

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$6.352

-

-

-

Flip Electronics

USA . 56,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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56,740

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-

-

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Vyrian

USA . 11,931 parts In-Stock

1+ parts

-

100+ parts

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11,931

-

-

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Chip Stock

USA . 6,500 parts In-Stock

1+ parts

-

100+ parts

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6,500

-

-

-

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IBS Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$3.745

2,000

-

-

-

$3.745

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 499 parts In-Stock

1+ parts

$2.659

100+ parts

-

1k+ parts

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499

$2.659

-

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Semicontronic

India . 11,123 parts In-Stock

1+ parts

$3.220

100+ parts

$3.140

1k+ parts

$3.123

10k+ parts

-

11,123

$3.220

$3.140

$3.123

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Ampacity Inc.

Singapore . 11,012 parts In-Stock

1+ parts

$3.220

100+ parts

-

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11,012

$3.220

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Advanced Electronics

New Zealand . 31 parts In-Stock

1+ parts

$3.497

100+ parts

$3.322

1k+ parts

$3.322

10k+ parts

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31

$3.497

$3.322

$3.322

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Corphita

USA . 913 parts In-Stock

1+ parts

$3.800

100+ parts

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913

$3.800

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Modulus Dynamics

Lithuania . 1,380 parts In-Stock

1+ parts

$4.466

100+ parts

$4.287

1k+ parts

$4.109

10k+ parts

-

1,380

$4.466

$4.287

$4.109

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Aztec Data Supply Inc.

USA . 1,854 parts In-Stock

1+ parts

$5.354

100+ parts

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1,854

$5.354

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Continental Prestige Electronics

USA . 6,716 parts In-Stock

1+ parts

$6.352

100+ parts

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10k+ parts

$6.225

6,716

$6.352

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-

$6.225

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.352

100+ parts

$6.225

1k+ parts

-

10k+ parts

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1,000

$6.352

$6.225

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Argo Parts USA

USA . 2,133 parts In-Stock

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2,133

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Infinite Electronics LLP (Excess)

. 657 parts In-Stock

1+ parts

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100+ parts

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657

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Overview

Unlock the power of reliable and high-performance memory solutions with the CY7C1041GN30-10BVXIT from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality SRAM products that are perfect for a wide range of applications. Whether you need fast data access, low standby voltage, or industrial-grade temperature stability, this product has you covered. Say goodbye to slow performance and hello to efficient memory management with the CY7C1041GN30-10BVXIT. Experience seamless operation, exceptional reliability, and unmatched value with this cutting-edge memory solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the SRAM, making it suitable for a variety of applications.

Operating Mode: ASYNCHRONOUS

Allows for independent operation of the SRAM, providing flexibility in system design.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard supply voltage, ensuring compatibility with common power sources.

Maximum Operating Temperature: 85 °C

Can operate effectively in high temperature environments, making it suitable for industrial use.

Memory IC Type: STANDARD SRAM

Utilizes a standard SRAM design, ensuring reliability and compatibility with existing systems.

Technical Specifications

SRAM CY7C1041GN30-10BVXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

Length:

8 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

48

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Maximum Seated Height:

1 mm

Maximum Standby Current:

.008 Amp

Minimum Standby Voltage:

1 V

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

CY7C1041GN30-10BVXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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