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CY7C1049G30-10ZSXIT

Infineon Technologies

CY7C1049G30-10ZSXIT by Infineon Technologies

CY7C1049G30-10ZSXIT by Infineon: 512KX8 SRAM, operates at 3V, with 10ns access time. Ideal for industrial applications requiring fast and reliable parallel memory storage.

Median Price

$5.380

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 702 parts In-Stock

1+ parts

$7.160

100+ parts

$6.161

1k+ parts

$5.667

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702

$7.160

$6.161

$5.667

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Future Electronics

Canada . 5,000 parts In-Stock

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$3.600

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$3.600

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Distributors (In-Stock)

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Digiode

USA . 620 parts In-Stock

1+ parts

$9.186

100+ parts

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620

$9.186

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IBS Electronics

USA . 5,000 parts In-Stock

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$4.670

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$4.670

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Flip Electronics

USA . 4,000 parts In-Stock

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4,000

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Vyrian

USA . 3,575 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 5,201 parts In-Stock

1+ parts

$3.731

100+ parts

$3.582

1k+ parts

$3.433

10k+ parts

-

5,201

$3.731

$3.582

$3.433

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Aztec Data Supply Inc.

USA . 2,756 parts In-Stock

1+ parts

$4.365

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2,756

$4.365

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Corohmni

South Africa . 68 parts In-Stock

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$5.317

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68

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Ampacity Inc.

Singapore . 3,371 parts In-Stock

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$5.500

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$5.500

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Semicontronic

India . 3,320 parts In-Stock

1+ parts

$5.500

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$5.362

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$5.335

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3,320

$5.500

$5.362

$5.335

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Corphita

USA . 743 parts In-Stock

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$8.703

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743

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QUARKTWIN TECHNOLOGY LTD

USA . 11,762 parts In-Stock

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Continental Prestige Electronics

USA . 5,801 parts In-Stock

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Argo Parts USA

USA . 773 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Experience superior performance and reliability with the Infineon Technologies CY7C1049G30-10ZSXIT SRAM. Infineon is a trusted manufacturer known for its cutting-edge technology and high-quality products. This SRAM, with a capacity of 512KX8 and operating at a nominal supply voltage of 3V, is ideal for industrial applications where speed and efficiency are crucial. The small outline, thin profile package design makes it easy to integrate into your system. Trust Infineon for top-of-the-line memory solutions that deliver unparalleled value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Surface Mount: YES

With surface mount capability, this product is easy to install and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement on the circuit board, maximizing space utilization.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode provides flexibility and faster access times, improving overall performance.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of systems.

No. of Terminals: 44

The 44 terminals allow for multiple connections, enabling seamless integration with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile package style saves space and is suitable for compact designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in harsh environmental conditions.

Organization: 512KX8

The 512KX8 organization provides a balance between storage capacity and data access speed.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold environments.

Terminal Position: DUAL

With dual terminal positions, this product offers flexibility in installation and PCB layout.

Maximum Seated Height: 1.194 mm

The maximum seated height of 1.194 mm makes this product suitable for slim designs and compact spaces.

Width: 10.16 mm

The width of 10.16 mm ensures compatibility with standard PCB layouts and spacing requirements.

Minimum Supply Voltage (Vsup): 2.2 V

Operating at a minimum supply voltage of 2.2V provides power efficiency and compatibility with low-power systems.

Length: 18.415 mm

The length of 18.415 mm offers a balanced form factor for easy integration into various applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in demanding industrial environments.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high-speed performance.

Parallel or Serial: PARALLEL

Operating in parallel mode allows for simultaneous data access, improving overall efficiency.

Terminal Form: GULL WING

The gull-wing terminal form provides secure connections and ease of PCB mounting.

No. of Words: 524288 words

The large number of words allows for extensive data storage and processing capabilities.

Memory Width: 8

The memory width of 8 bits offers compatibility with various data formats and processing requirements.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm ensures easy installation and compatibility with standard PCB design practices.

No. of Words Code: 512K

The 512K words code offers a balance between memory capacity and data access efficiency.

Maximum Supply Voltage (Vsup): 3.6 V

Operating at a maximum supply voltage of 3.6V ensures stability and compatibility with higher voltage systems.

Memory Density: 4194304 bit

The high memory density of 4194304 bits allows for extensive data storage and processing capabilities.

Memory IC Type: STANDARD SRAM

The use of standard SRAM technology provides reliability and compatibility with a wide range of systems.

Maximum Access Time: 10 ns

The maximum access time of 10 ns ensures fast data retrieval and processing speeds.

Technical Specifications

SRAM CY7C1049G30-10ZSXIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

JESD-30 Code:

R-PDSO-G44

Length:

18.415 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

44

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Maximum Seated Height:

1.194 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

CY7C1049G30-10ZSXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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