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CY7C1041GN30-10BVXI

Infineon Technologies

CY7C1041GN30-10BVXI by Infineon Technologies

Infineon Technologies' CY7C1041GN30-10BVXI is a 256KX16 SRAM with a package style of GRID ARRAY, VERY THIN PROFILE, FINE PITCH. It operates asynchronously at a nominal voltage of 3V and has a max access time of 10ns. This memory IC is commonly used in industrial applications requiring high-speed data storage.

Median Price

$4.290

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 40 parts In-Stock

1+ parts

$2.040

100+ parts

$2.040

1k+ parts

$2.040

10k+ parts

-

40

$2.040

$2.040

$2.040

-

Avnet

USA . 357 parts In-Stock

1+ parts

$3.388

100+ parts

$2.937

1k+ parts

-

10k+ parts

-

357

$3.388

$2.937

-

-

Farnell

UK . 11 parts In-Stock

1+ parts

$4.290

100+ parts

$2.750

1k+ parts

$2.500

10k+ parts

-

11

$4.290

$2.750

$2.500

-

Arrow

USA . 2,338 parts In-Stock

1+ parts

$4.502

100+ parts

$3.595

1k+ parts

$2.930

10k+ parts

-

2,338

$4.502

$3.595

$2.930

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Element14

Singapore . 11 parts In-Stock

1+ parts

$4.670

100+ parts

-

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-

10k+ parts

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11

$4.670

-

-

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DigiKey

USA . 3,913 parts In-Stock

1+ parts

$6.090

100+ parts

$5.247

1k+ parts

$4.836

10k+ parts

$4.764

3,913

$6.090

$5.247

$4.836

$4.764

Mouser Electronics

USA . 2,960 parts In-Stock

1+ parts

$6.090

100+ parts

$5.250

1k+ parts

$4.830

10k+ parts

-

2,960

$6.090

$5.250

$4.830

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Chip1Stop

Japan . 190 parts In-Stock

1+ parts

$6.310

100+ parts

-

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-

10k+ parts

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190

$6.310

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-

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Flip Electronics (Authorized)

USA . 60,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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60,740

-

-

-

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Verical

USA . 53,892 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.472

10k+ parts

-

53,892

-

-

$3.472

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Rochester

USA . 7,083 parts In-Stock

1+ parts

-

100+ parts

$3.230

1k+ parts

$2.890

10k+ parts

$2.720

7,083

-

$3.230

$2.890

$2.720

Future Electronics

Canada . 2,110 parts In-Stock

1+ parts

-

100+ parts

$2.730

1k+ parts

$2.670

10k+ parts

-

2,110

-

$2.730

$2.670

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 118 parts In-Stock

1+ parts

$2.232

100+ parts

-

1k+ parts

-

10k+ parts

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118

$2.232

-

-

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Nova Conductors

Japan . 74 parts In-Stock

1+ parts

$8.840

100+ parts

-

1k+ parts

-

10k+ parts

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74

$8.840

-

-

-

DigiKey Marketplace

USA . 57,040 parts In-Stock

1+ parts

-

100+ parts

$3.000

1k+ parts

-

10k+ parts

-

57,040

-

$3.000

-

-

Flip Electronics

USA . 56,740 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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56,740

-

-

-

-

Chip Stock

USA . 16,500 parts In-Stock

1+ parts

-

100+ parts

-

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16,500

-

-

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Vyrian

USA . 7,948 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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7,948

-

-

-

-

IBS Electronics

USA . 5,950 parts In-Stock

1+ parts

-

100+ parts

$3.871

1k+ parts

$2.468

10k+ parts

$2.454

5,950

-

$3.871

$2.468

$2.454

Ashlea Components Ltd

UK . 14 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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14

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,293 parts In-Stock

1+ parts

$1.990

100+ parts

-

1k+ parts

-

10k+ parts

-

8,293

$1.990

-

-

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Semicontronic

India . 8,269 parts In-Stock

1+ parts

$1.990

100+ parts

$1.940

1k+ parts

$1.930

10k+ parts

-

8,269

$1.990

$1.940

$1.930

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Corphita

USA . 378 parts In-Stock

1+ parts

$2.114

100+ parts

-

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378

$2.114

-

-

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Corohmni

South Africa . 57 parts In-Stock

1+ parts

$2.650

100+ parts

-

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-

10k+ parts

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57

$2.650

-

-

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Aztec Data Supply Inc.

USA . 11,396 parts In-Stock

1+ parts

$3.016

100+ parts

-

1k+ parts

-

10k+ parts

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11,396

$3.016

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$3.536

100+ parts

$3.359

1k+ parts

$3.359

10k+ parts

-

5,000

$3.536

$3.359

$3.359

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Component Stockers USA

USA . 19,200 parts In-Stock

1+ parts

$4.490

100+ parts

$3.440

1k+ parts

$4.490

10k+ parts

-

19,200

$4.490

$3.440

$4.490

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Modulus Dynamics

Lithuania . 77 parts In-Stock

1+ parts

$5.317

100+ parts

$5.104

1k+ parts

$4.892

10k+ parts

-

77

$5.317

$5.104

$4.892

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Continental Prestige Electronics

USA . 4,800 parts In-Stock

1+ parts

$7.100

100+ parts

$5.260

1k+ parts

-

10k+ parts

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4,800

$7.100

$5.260

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Netroflash

USA . 50 parts In-Stock

1+ parts

$8.840

100+ parts

$8.663

1k+ parts

-

10k+ parts

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50

$8.840

$8.663

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-

QUARKTWIN TECHNOLOGY LTD

USA . 5,773 parts In-Stock

1+ parts

-

100+ parts

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5,773

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

-

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Argo Parts USA

USA . 2,924 parts In-Stock

1+ parts

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100+ parts

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2,924

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-

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Glotronic Ltd.

UK . 172 parts In-Stock

1+ parts

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100+ parts

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172

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Overview

Experience cutting-edge technology with the CY7C1041GN30-10BVXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality products that meet the highest standards. The CY7C1041GN30-10BVXI is a versatile SRAM device that offers fast and reliable performance in various applications. With its common input/output type and asynchronous operating mode, this product provides seamless integration and flexibility. Its compact design and high memory density make it ideal for space-constrained projects. Trust Infineon Technologies to deliver exceptional value, benefits, and advantages to enhance your projects and drive innovation forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and facilitating assembly.

Operating Mode: ASYNCHRONOUS

Enables independent operation without the need for a synchronized clock signal, increasing flexibility in design.

Nominal Supply Voltage / Vsup (V): 3

Standard voltage level compatible with many electronic systems for easy integration.

No. of Terminals: 48

Sufficient number of terminals for efficient data transfer and connectivity.

Maximum Operating Temperature: 85 °C

High operating temperature range suitable for industrial applications, ensuring reliable performance in harsh environments.

Organization: 256KX16

Optimal organization for handling and storing data efficiently in a parallel configuration.

Output Characteristics: 3-STATE

Supports tri-state output functionality, allowing for multiple devices to share the same bus efficiently.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high noise immunity.

Maximum Access Time: 10 ns

Quick access time ensures fast data retrieval and processing, enhancing overall system performance.

Technical Specifications

SRAM CY7C1041GN30-10BVXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

8 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

48

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Standby Current:

.008 Amp

Minimum Standby Voltage:

1 V

Maximum Supply Current:

45 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

CY7C1041GN30-10BVXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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