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CY14B116L-ZS25XI

Infineon Technologies

CY14B116L-ZS25XI by Infineon Technologies

Infineon's CY14B116L-ZS25XI is a 2MX8 NON-VOLATILE SRAM with 16777216 bit memory density. Operating at 3V, it offers a fast access time of 25ns for industrial applications. With a compact size of 18.415mm x 10.16mm and GULL WING terminals, it is ideal for space-constrained designs requiring reliable data storage.

Median Price

$82.412

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 197 parts In-Stock

1+ parts

$87.510

100+ parts

$67.790

1k+ parts

-

10k+ parts

-

197

$87.510

$67.790

-

-

DigiKey

USA . 115 parts In-Stock

1+ parts

$105.160

100+ parts

$91.440

1k+ parts

-

10k+ parts

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115

$105.160

$91.440

-

-

Rochester

USA . 8,129 parts In-Stock

1+ parts

-

100+ parts

$61.850

1k+ parts

$55.340

10k+ parts

$52.090

8,129

-

$61.850

$55.340

$52.090

Verical

USA . 3,780 parts In-Stock

1+ parts

-

100+ parts

$77.313

1k+ parts

$69.175

10k+ parts

$65.112

3,780

-

$77.313

$69.175

$65.112

Flip Electronics (Authorized)

USA . 2,095 parts In-Stock

1+ parts

-

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2,095

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$83.099

100+ parts

-

1k+ parts

-

10k+ parts

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10

$83.099

-

-

-

Digiode

USA . 179 parts In-Stock

1+ parts

$83.134

100+ parts

-

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-

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179

$83.134

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Flip Electronics

USA . 2,700 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,700

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Chip Stock

USA . 995 parts In-Stock

1+ parts

-

100+ parts

-

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995

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Vyrian

USA . 583 parts In-Stock

1+ parts

-

100+ parts

-

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583

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 74 parts In-Stock

1+ parts

$3.960

100+ parts

-

1k+ parts

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74

$3.960

-

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Modulus Dynamics

Lithuania . 1,260 parts In-Stock

1+ parts

$4.590

100+ parts

$4.406

1k+ parts

$4.223

10k+ parts

-

1,260

$4.590

$4.406

$4.223

-

Aztec Data Supply Inc.

USA . 68 parts In-Stock

1+ parts

$4.622

100+ parts

-

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68

$4.622

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Semicontronic

India . 443 parts In-Stock

1+ parts

$58.570

100+ parts

$57.106

1k+ parts

$56.813

10k+ parts

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443

$58.570

$57.106

$56.813

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Ampacity Inc.

Singapore . 549 parts In-Stock

1+ parts

$74.380

100+ parts

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549

$74.380

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Corphita

USA . 764 parts In-Stock

1+ parts

$78.759

100+ parts

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764

$78.759

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Continental Prestige Electronics

USA . 1,301 parts In-Stock

1+ parts

$83.099

100+ parts

-

1k+ parts

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10k+ parts

$81.437

1,301

$83.099

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-

$81.437

Netroflash

USA . 50 parts In-Stock

1+ parts

$83.099

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50

$83.099

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Microchip USA

USA . 1,336 parts In-Stock

1+ parts

$139.780

100+ parts

$137.350

1k+ parts

$136.130

10k+ parts

$134.910

1,336

$139.780

$137.350

$136.130

$134.910

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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7,000

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Futuretech Components

Singapore . 2,700 parts In-Stock

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2,700

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GreenTree Electronics

Israel . 2,500 parts In-Stock

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2,500

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iodParts Technologies Inc.

India . 1,350 parts In-Stock

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1,350

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Epart123

USA . 1,350 parts In-Stock

1+ parts

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100+ parts

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$124.050

1,350

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$124.050

Argo Parts USA

USA . 41 parts In-Stock

1+ parts

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41

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Overview

Unlock the power of cutting-edge technology with the CY14B116L-ZS25XI by Infineon Technologies. This high-quality SRAM memory device offers unparalleled reliability and performance, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product delivers fast access times, low power consumption, and robust design. Trust in the expertise of Infineon Technologies to bring you top-of-the-line memory solutions that provide value and efficiency for your projects. Experience the advantages of advanced memory technology with the CY14B116L-ZS25XI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Easy to integrate onto circuit boards, saving space and providing ease of assembly.

Operating Mode: ASYNCHRONOUS

Allows for independent and flexible operations, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 3

Operates at a standard voltage, ensuring compatibility with a wide range of systems.

No. of Terminals: 44

Provides versatile connectivity options for various configurations and applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, suitable for industrial environments.

Organization: 2MX8

Organized as 2 million by 8 memory configuration, offering ample storage capacity.

Width: 10.16 mm

Compact size allows for easy integration into tight spaces.

Minimum Supply Voltage (Vsup): 2.7 V

Works efficiently at low voltages, saving energy and reducing power consumption.

Temperature Grade: INDUSTRIAL

Designed to meet industrial-grade requirements, ensuring reliability in harsh conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Parallel or Serial: PARALLEL

Parallel interface allows for faster data transfer compared to serial communication.

Memory IC Type: NON-VOLATILE SRAM

Combines the speed of SRAM with non-volatile memory capabilities for data retention.

Maximum Access Time: 25 ns

Provides quick access to data, enhancing the overall performance of the product.

Technical Specifications

SRAM CY14B116L-ZS25XI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

25 ns

JESD-30 Code:

R-PDSO-G44

Length:

18.415 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.194 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

CY14B116L-ZS25XI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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