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CY14B104NA-BA25XIT

Infineon Technologies

CY14B104NA-BA25XIT by Infineon Technologies

Infineon's CY14B104NA-BA25XIT is a 256Kx16 SRAM with 3V nominal voltage. Operating asynchronously, it offers fast access time of 25ns and low standby current of 0.005Amp. Ideal for industrial applications requiring high-speed memory with non-volatile storage capabilities.

Median Price

$27.780

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$26.570

2,000

-

-

-

$26.570

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$27.190

2,000

-

-

-

$27.190

Verical

USA . 1,135 parts In-Stock

1+ parts

-

100+ parts

$35.462

1k+ parts

$31.725

10k+ parts

$29.863

1,135

-

$35.462

$31.725

$29.863

Rochester

USA . 1,135 parts In-Stock

1+ parts

-

100+ parts

$28.370

1k+ parts

$25.380

10k+ parts

$23.890

1,135

-

$28.370

$25.380

$23.890

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,626

-

-

-

-

Digiode

USA . 306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

306

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 881 parts In-Stock

1+ parts

$3.387

100+ parts

$3.252

1k+ parts

$3.116

10k+ parts

-

881

$3.387

$3.252

$3.116

-

Aztec Data Supply Inc.

USA . 3,668 parts In-Stock

1+ parts

$3.431

100+ parts

-

1k+ parts

-

10k+ parts

-

3,668

$3.431

-

-

-

Corohmni

South Africa . 448 parts In-Stock

1+ parts

$4.474

100+ parts

-

1k+ parts

-

10k+ parts

-

448

$4.474

-

-

-

Semicontronic

India . 1,599 parts In-Stock

1+ parts

$22.580

100+ parts

$22.016

1k+ parts

$21.903

10k+ parts

-

1,599

$22.580

$22.016

$21.903

-

Ampacity Inc.

Singapore . 1,555 parts In-Stock

1+ parts

$22.580

100+ parts

-

1k+ parts

-

10k+ parts

-

1,555

$22.580

-

-

-

Continental Prestige Electronics

USA . 5,976 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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5,976

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-

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Component Stockers USA

USA . 5,274 parts In-Stock

1+ parts

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100+ parts

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5,274

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-

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Argo Parts USA

USA . 1,335 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,335

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-

-

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Corphita

USA . 736 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

736

-

-

-

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Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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100

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-

-

Overview

Unlock unparalleled performance and reliability with the CY14B104NA-BA25XIT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers exceptional quality and cutting-edge technology that sets their products apart. This SRAM device offers high-speed access, low power consumption, and wide operating temperature range, making it ideal for industrial applications where performance and durability are crucial. Elevate your projects with the CY14B104NA-BA25XIT and experience the value and benefits that only Infineon Technologies can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for long-lasting performance.

Surface Mount: YES

Easy to install and saves space on the PCB.

Nominal Supply Voltage / Vsup (V): 3

Optimal voltage for efficient operation.

Maximum Operating Temperature: 85 °C

Can function in a wide range of temperature conditions.

Technology: CMOS

Low power consumption and high noise immunity.

Memory IC Type: NON-VOLATILE SRAM

Retains data even when power is turned off, ensuring data integrity.

Maximum Access Time: 25 ns

Fast access time for quick data retrieval.

Technical Specifications

SRAM CY14B104NA-BA25XIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

25 ns

JESD-30 Code:

R-PBGA-B48

JESD-609 Code:

e1

Length:

10 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,6X8,30

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.005 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

70 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

6 mm

Trade Compliance

CY14B104NA-BA25XIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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