Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Infineon's CY14B256LA-SZ45XI is a 32Kx8 SRAM with 262144-bit memory density. Operating at 3V, it offers fast access time of 45ns in industrial temperatures. Ideal for applications requiring non-volatile parallel memory with low standby current and high reliability.
Median Price
$17.431
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21
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Rochester
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100+ parts
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10k+ parts
$12.710
Flip Electronics (Authorized)
Verical
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Digiode
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Nova Conductors
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EXC GmbH
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Component Electronics Inc.
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Chip Stock
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Flip Electronics
Semtec, LLC
Martec Srl
Component Sense
DigiKey Marketplace
Ack Elektronik San.Tic.Ltd.Sti
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Modulus Dynamics
$2.956
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Corohmni
$3.025
Aztec Data Supply Inc.
$5.076
AZTECH Wire
$10.027
Ampacity Inc.
$14.300
Corphita
$15.138
Continental Prestige Electronics
$20.012
Semicontronic
$31.120
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$30.186
Lixinc
A-Z Elektronik GmbH
Glotronic Ltd.
Alle Elektronik GmbH
S.R.D Solutions
Perfect Parts
Authorized Procurement Solutions
Netroflash
$19.399
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RC Electronics
$18.530
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$16.400
Microchip USA
Assy Fe
Kepictronics
iodParts Technologies Inc.
Argo Parts USA
Durable and cost-effective material for packaging, ensuring long-term reliability of the product.
SMT technology allows for compact and efficient PCB design, saving space and reducing assembly time.
Provides flexibility in data transfer and ensures efficient communication within the system.
Optimal supply voltage for reliable performance and low power consumption.
Sufficient number of terminals for connectivity and interfacing with other components.
Suitable for industrial applications with high temperature requirements.
Organized in a 32Kx8 configuration, providing sufficient memory capacity for data storage.
CMOS technology offers low power consumption and high speed performance.
Non-volatile memory ensures data retention even during power loss or system shutdown.
Fast access time for quick retrieval of data, enhancing system performance.
SRAM CY14B256LA-SZ45XI attributes and parameters. Explore more SRAM devices from Infineon Technologies
Maximum Access Time:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
CY14B256LA-SZ45XI Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
CRG0805F10K
TE Connectivity
TE Connectivity's CRG0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in various electronic circuits due to its compact size and high temperature rating.
SS14
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
MBRS130LT3G
Onsemi
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
1N4148WS
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317AEMP/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: SOP; Terminal Form: GULL WING; Qualification Status: Not Qualified; Width: 3.56 mm;
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148
Shenzhen Yixinsemi Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NE555D
STMicroelectronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Hy Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; No. of Phases: 1; Config: SINGLE; Maximum Operating Temperature: 125 Cel;
LL4148
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358N
Fairchild Semiconductor
ROHM
EU2B-YS3203F
Idec
ROTARY SWITCH;
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Excel (Suzhou) Semiconductor
FDN5618P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
7008L20JI
Integrated Device Technology
7008L20JI by Integrated Device Technology is a 64Kx8 MULTI-PORT SRAM with 20ns access time, operating at 5V. It features a 3-STATE output and operates in ASYNCHRONOUS mode. Ideal for industrial applications requiring fast and reliable memory storage with common I/O type.
AS7C256A-10TIN
Alliance Memory
Alliance Memory's AS7C256A-10TIN is a 32Kx8 SRAM with 10ns access time, operating at 5V. Ideal for industrial applications, it features a small outline package and common I/O type. With a max supply current of 75mA, this CMOS technology memory IC offers reliable performance in various systems.
CY62147EV30LL-45B2XAT
Cypress Semiconductor
CY62147EV30LL-45B2XAT by Cypress Semiconductor is a 256Kx16 SRAM with 45 ns access time, operating at 2.5/3.3V. It features a grid array package style, suitable for industrial temperature grades. Ideal for applications requiring fast and reliable memory storage in electronic devices.
IDT7007L20JGI
Renesas Electronics
The Renesas Electronics IDT7007L20JGI is a 32Kx8 CMOS SRAM with 3-STATE output, operating at 5V. It features asynchronous mode, common I/O type, and quad terminal position. With a memory density of 262144 bits, it is ideal for industrial applications requiring fast access times of up to 20ns.
CY14B116L-ZS25XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.194 mm;
71321LA55PPGI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE; Memory Density: 16384 bit;
CY62147EV30LL-45ZSXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
CY7C1470V33-167AXI
ZBT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 167 MHz;
71V124SA12TYGI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOJ; Package Shape: RECTANGULAR; Surface Mount: YES;
5962-8685909LA
Performance Semiconductor
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Memory Density: 65536 bit;
CY14B101PA-SFXIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
70V24L15PFGI8
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: QFP; Package Shape: SQUARE; Organization: 4KX16;
AS7C34098A-12TCN
Alliance Semiconductor
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
IDT71V424S10PHGI
The Renesas Electronics IDT71V424S10PHGI is a 512Kx8 SRAM with 3.3V supply, operating at -40 to 85°C. It features asynchronous operation, 10ns access time, and 44 terminals in a small outline package. Ideal for industrial applications requiring fast and reliable memory storage.
70V08L20PFGI
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Minimum Standby Voltage: 3 V;
CY62167EV18LL-55BVXIT
Infineon Technologies
CY62167EV18LL-55BVXIT by Infineon Technologies is a 1MX16 SRAM with 55ns access time and operates at 1.8V. It features a very thin profile, fine pitch grid array package style suitable for industrial applications. This CMOS memory IC offers common I/O type and 3-state output characteristics in a compact form factor ideal for high-speed parallel data processing.
MT58L64L18FT-8.5
Micron Technology
CACHE SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 100; Package Code: LQFP; Package Shape: RECTANGULAR; Organization: 64KX18;
IS61C256AL-12TLI
Integrated Silicon Solution
IS61C256AL-12TLI by Integrated Silicon Solution is a 32KX8 SRAM with 12 ns access time, operating at 5V. It features a small outline package and industrial temperature grade, suitable for applications requiring fast and reliable memory storage in harsh environments.
CY62157ESL-45ZSXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
IS66WVE4M16EBLL-70BLI
IS66WVE4M16EBLL-70BLI by Integrated Silicon Solution is a 4MX16 Pseudo Static RAM with a memory density of 67108864 bit. It operates in an asynchronous mode and has a max access time of 70 ns. This SRAM is commonly used in industrial applications due to its temperature grade and thin profile package style.
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CY14B256LA-SP45XI
Infineon
Infineon Technologies' CY14B256LA-SP45XI is a non-volatile SRAM with 32Kx8 organization and 262144-bit memory density. It operates at a voltage of 3V and has a max access time of 45ns. This SRAM is suitable for industrial applications requiring reliable and fast non-volatile memory storage.
CY14B116L-ZS25XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Technology: CMOS;
Infineon's CY14B116L-ZS25XIT is a 2MX8 SRAM with 16777216-bit memory density, operating at 3V. It features an access time of 25ns and is ideal for industrial applications requiring non-volatile memory storage in a small outline package.
CY14B256LA-SZ45XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Access Time: 45 ns;
Infineon's CY14B256LA-SZ45XIT is a 32Kx8 non-volatile SRAM with 262144-bit memory density. Operating at 3V, it offers fast access time of 45ns and low standby current of 0.005A. Ideal for industrial applications requiring reliable data storage in a compact package.
CY14E256LA-SZ25XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Output Enable: YES;
Infineon's CY14E256LA-SZ25XI is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a small outline package and industrial temperature grade, suitable for applications requiring fast access times like industrial automation and automotive systems.
CY14B256LA-SZ45XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8;
CY14B104NA-BA25XI
Infineon's CY14B104NA-BA25XI is a 256Kx16 SRAM with 3V nominal voltage, operating in industrial temperature range. It features asynchronous mode, 25ns access time, and non-volatile memory IC type. Ideal for applications requiring fast parallel memory access in compact electronic devices.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 70 mA;
CY14B104NA-BA25XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
Infineon's CY14B104NA-BA25XIT is a 256Kx16 SRAM with 3V nominal voltage. Operating asynchronously, it offers fast access time of 25ns and low standby current of 0.005Amp. Ideal for industrial applications requiring high-speed memory with non-volatile storage capabilities.
CY14E256LA-SZ25XIT
Infineon's CY14E256LA-SZ25XIT is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features an industrial temperature grade, parallel interface, and non-volatile memory technology. Ideal for applications requiring fast access times of up to 25ns in harsh environments.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
CY14E256LA-SZ45XIT
Infineon's CY14E256LA-SZ45XIT is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a small outline package, GULL WING terminals, and industrial temperature grade. Ideal for applications requiring fast access times and non-volatile memory solutions.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
CY14B108M-ZSP45XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Equivalence Code: TSOP54,.46,32;
Infineon's CY14B108M-ZSP45XIT is a 512Kx16 SRAM with 3V nominal voltage. Operating asynchronously, it offers fast access time of 45ns and low standby current of 0.01Amp. Ideal for industrial applications requiring high-speed memory with non-volatile storage capabilities.
CY14B256LA-SZ25XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;
Supply Digital Components
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