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CY14B256LA-SZ45XI

Infineon Technologies

CY14B256LA-SZ45XI by Infineon Technologies

Infineon's CY14B256LA-SZ45XI is a 32Kx8 SRAM with 262144-bit memory density. Operating at 3V, it offers fast access time of 45ns in industrial temperatures. Ideal for applications requiring non-volatile parallel memory with low standby current and high reliability.

Median Price

$17.431

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 414 parts In-Stock

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-

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$15.100

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$13.510

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$12.710

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$13.510

$12.710

Flip Electronics (Authorized)

USA . 120 parts In-Stock

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Verical

USA . 35 parts In-Stock

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$19.762

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$17.875

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$19.762

$17.875

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Distributors (In-Stock)

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Digiode

USA . 351 parts In-Stock

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$15.979

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Nova Conductors

Japan . 150 parts In-Stock

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$20.420

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$20.420

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EXC GmbH

Germany . 22 parts In-Stock

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$41.638

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22

$41.638

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Component Electronics Inc.

Canada . 2 parts In-Stock

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$52.310

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$39.230

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$34.000

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$52.310

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$34.000

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 330 parts In-Stock

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ComSIT USA

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Vyrian

USA . 63 parts In-Stock

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Flip Electronics

USA . 60 parts In-Stock

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Semtec, LLC

USA . 50 parts In-Stock

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Martec Srl

Italy . 43 parts In-Stock

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Component Sense

UK . 37 parts In-Stock

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DigiKey Marketplace

USA . 16 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

. 10 parts In-Stock

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EPE Components Inc.

USA . 2 parts In-Stock

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Bristol Electronics

USA . 2 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 5,131 parts In-Stock

1+ parts

$2.956

100+ parts

$2.838

1k+ parts

$2.720

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5,131

$2.956

$2.838

$2.720

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Corohmni

South Africa . 217 parts In-Stock

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$3.025

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217

$3.025

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Aztec Data Supply Inc.

USA . 133 parts In-Stock

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$5.076

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$5.076

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AZTECH Wire

Italy . 359 parts In-Stock

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$10.027

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$10.027

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Ampacity Inc.

Singapore . 11 parts In-Stock

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$14.300

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$14.300

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Corphita

USA . 157 parts In-Stock

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$15.138

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$15.138

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Continental Prestige Electronics

USA . 3,535 parts In-Stock

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$20.420

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$20.012

3,535

$20.420

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$20.012

Semicontronic

India . 63 parts In-Stock

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$31.120

100+ parts

$30.342

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$30.186

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$31.120

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$30.186

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Lixinc

USA . 8,814 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,550 parts In-Stock

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,700 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Perfect Parts

USA . 2,501 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$20.012

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$19.399

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$18.991

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$20.012

$19.399

$18.991

RC Electronics

USA . 1,317 parts In-Stock

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$18.530

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$16.910

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$16.400

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$16.910

$16.400

Microchip USA

USA . 1,217 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 384 parts In-Stock

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iodParts Technologies Inc.

India . 350 parts In-Stock

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Argo Parts USA

USA . 129 parts In-Stock

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Overview

Looking for reliable SRAM memory solutions? Look no further than the CY14B256LA-SZ45XI by Infineon Technologies. Known for their top-notch manufacturing quality, Infineon delivers exceptional products that meet the demands of various applications. This versatile SRAM module offers customers a high-value solution with fast access times and low power consumption, making it ideal for industrial settings where performance and efficiency are key. Upgrade your systems with the CY14B256LA-SZ45XI and experience the difference in quality and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring long-term reliability of the product.

Surface Mount: YES

SMT technology allows for compact and efficient PCB design, saving space and reducing assembly time.

Operating Mode: ASYNCHRONOUS

Provides flexibility in data transfer and ensures efficient communication within the system.

Nominal Supply Voltage / Vsup (V): 3

Optimal supply voltage for reliable performance and low power consumption.

No. of Terminals: 32

Sufficient number of terminals for connectivity and interfacing with other components.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with high temperature requirements.

Organization: 32KX8

Organized in a 32Kx8 configuration, providing sufficient memory capacity for data storage.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance.

Memory IC Type: NON-VOLATILE SRAM

Non-volatile memory ensures data retention even during power loss or system shutdown.

Maximum Access Time: 45 ns

Fast access time for quick retrieval of data, enhancing system performance.

Technical Specifications

SRAM CY14B256LA-SZ45XI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

20.726 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Standby Current:

.005 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

52 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.505 mm

Trade Compliance

CY14B256LA-SZ45XI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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