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CY14E256LA-SZ45XIT

Infineon Technologies

CY14E256LA-SZ45XIT by Infineon Technologies

Infineon's CY14E256LA-SZ45XIT is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a small outline package, GULL WING terminals, and industrial temperature grade. Ideal for applications requiring fast access times and non-volatile memory solutions.

Median Price

$17.340

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$17.340

100+ parts

-

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300

$17.340

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Chip Stock

USA . 2,750 parts In-Stock

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2,750

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Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Vyrian

USA . 826 parts In-Stock

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826

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-

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Digiode

USA . 424 parts In-Stock

1+ parts

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424

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NexGen Digital

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,201 parts In-Stock

1+ parts

$2.703

100+ parts

-

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1,201

$2.703

-

-

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Modulus Dynamics

Lithuania . 3,326 parts In-Stock

1+ parts

$3.848

100+ parts

$3.694

1k+ parts

$3.540

10k+ parts

-

3,326

$3.848

$3.694

$3.540

-

Aztec Data Supply Inc.

USA . 1,995 parts In-Stock

1+ parts

$5.877

100+ parts

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1,995

$5.877

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AZTECH Wire

Italy . 689 parts In-Stock

1+ parts

$6.067

100+ parts

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689

$6.067

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Ampacity Inc.

Singapore . 195 parts In-Stock

1+ parts

$12.000

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195

$12.000

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Semicontronic

India . 1,260 parts In-Stock

1+ parts

$16.000

100+ parts

$15.600

1k+ parts

$15.520

10k+ parts

-

1,260

$16.000

$15.600

$15.520

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Continental Prestige Electronics

USA . 2,501 parts In-Stock

1+ parts

$17.340

100+ parts

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1k+ parts

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10k+ parts

$16.993

2,501

$17.340

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-

$16.993

Netroflash

USA . 500 parts In-Stock

1+ parts

$17.340

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500

$17.340

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Component Stockers USA

USA . 428 parts In-Stock

1+ parts

$99.990

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428

$99.990

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Lixinc

USA . 7,926 parts In-Stock

1+ parts

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7,926

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RC Electronics

USA . 5,159 parts In-Stock

1+ parts

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100+ parts

$6.540

1k+ parts

$5.970

10k+ parts

$5.790

5,159

-

$6.540

$5.970

$5.790

Argo Parts USA

USA . 4,508 parts In-Stock

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4,508

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Futuretech Components

Singapore . 1,850 parts In-Stock

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1,850

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Microchip USA

USA . 1,112 parts In-Stock

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1,112

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Corphita

USA . 651 parts In-Stock

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651

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Authorized Procurement Solutions

USA . 600 parts In-Stock

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600

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Perfect Parts

USA . 243 parts In-Stock

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243

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Advanced Electronics

New Zealand . 15 parts In-Stock

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15

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Overview

Elevate your electronic designs with the CY14E256LA-SZ45XIT by Infineon Technologies. As a leading manufacturer in the industry, Infineon guarantees top-notch quality and reliability. This SRAM device offers seamless integration into various applications with its asynchronous operating mode and 32Kx8 organization. Enjoy the benefits of fast access times, low standby current, and 3-state output characteristics. Trust in Infineon to deliver cutting-edge technology that exceeds expectations. Choose the CY14E256LA-SZ45XIT for unmatched performance and value in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for electronic components.

Surface Mount: YES

Easy to install and offers space-saving benefits on PCBs.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage requirement for common electronic applications.

No. of Terminals: 32

Sufficient number of terminals for connecting with other components.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with varying temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Memory Density: 262144 bit

High memory density for storing large amounts of data.

Output Enable: YES

Allows for control over the output data, enhancing flexibility.

Technical Specifications

SRAM CY14E256LA-SZ45XIT attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

20.726 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

32

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP32,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.54 mm

Maximum Standby Current:

.008 Amp

Minimum Standby Voltage:

4.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

52 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

7.505 mm

Trade Compliance

CY14E256LA-SZ45XIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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