Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Infineon's CY14B108L-ZS45XIT is a 1MX8 SRAM with 8388608 bit memory density. Operating at 3V, it offers a max access time of 45ns and consumes up to 57mA supply current. Ideal for industrial applications requiring fast and reliable non-volatile memory solutions in compact form factors.
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Verical
Vyrian
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Flip Electronics
Digiode
Bristol Electronics
Nova Conductors
Ampacity Inc.
$2.000
Corohmni
$2.900
Modulus Dynamics
$4.078
$3.915
$3.752
Aztec Data Supply Inc.
$4.420
Semicontronic
$6.000
$5.850
$5.820
Continental Prestige Electronics
Component Stockers USA
$35.310
Argo Parts USA
Corphita
Bastille Electronics
The use of plastic/epoxy as the package body material makes this SRAM product lightweight and durable.
With surface mount capability, this SRAM can be easily installed on PCBs, making it suitable for compact electronic devices.
The asynchronous operating mode allows for fast and independent access to memory locations, enhancing overall system performance.
The nominal supply voltage of 3V ensures compatibility with a wide range of electronic systems, offering flexibility in design.
This SRAM supports dual power supplies at 3V and 3.3V, providing options for different power configurations in the system.
With 44 terminals, this SRAM offers a high level of connectivity for seamless integration into complex electronic setups.
The rectangular package shape allows for efficient use of space on the PCB, making it suitable for compact designs.
The high maximum operating temperature of 85°C ensures reliability in demanding environmental conditions.
The organization of 1MX8 (1 Megabit x 8) provides ample memory capacity for storing and retrieving data efficiently.
With a minimum operating temperature of -40°C, this SRAM can function reliably in extreme cold environments.
The matte tin terminal finish offers excellent solderability, ensuring a secure electrical connection during installation.
Dual terminal positions provide flexibility in PCB layout and ease of connectivity with other components in the system.
The low maximum seated height allows for slim and compact device designs, ideal for space-constrained applications.
The width of 10.16mm makes this SRAM suitable for small form factor devices where space is limited.
The minimum supply voltage requirement of 2.7V ensures reliable operation even at lower voltage levels, enhancing versatility.
The maximum time at peak reflow temperature of 40 seconds ensures proper soldering and assembly of the SRAM on the PCB.
With a peak reflow temperature of 260°C, this SRAM can withstand the rigors of the soldering process without degradation.
The length of 18.415mm allows for efficient placement on the PCB, maximizing available space for other components.
The industrial temperature grade specification ensures reliable performance in harsh industrial environments.
The CMOS technology used in this SRAM offers low power consumption and high speed operation, making it energy efficient.
The parallel interface design provides fast data transfer rates, making this SRAM ideal for applications requiring high-speed memory access.
The gull wing terminal form factor provides mechanical strength and ease of soldering, ensuring a secure connection in the system.
With a maximum supply current of 57mA, this SRAM consumes minimal power, contributing to overall energy efficiency.
With a capacity of 1048576 words, this SRAM offers ample memory storage for storing large amounts of data.
The memory width of 8 bits allows for efficient handling of data, enabling high-speed read and write operations.
The small terminal pitch of 0.8mm provides high density connectivity, making this SRAM suitable for compact PCB designs.
The code for 1M (1 million) words indicates the high memory capacity of this SRAM, making it suitable for data-intensive applications.
With a moisture sensitivity level of 3, this SRAM is suitable for use in environments with moderate humidity levels.
The maximum supply voltage of 3.6V ensures reliable operation without risk of overvoltage, enhancing component longevity.
The high memory density of 8388608 bits allows for efficient storage of large amounts of data in a compact space.
The non-volatile SRAM technology retains data even when power is removed, ensuring data integrity and reliability.
With a maximum standby current of 0.01A, this SRAM consumes very low power during idle periods, conserving energy.
The maximum access time of 45 nanoseconds ensures quick retrieval of data, enhancing system performance.
SRAM CY14B108L-ZS45XIT attributes and parameters. Explore more SRAM devices from Infineon Technologies
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CY14B108L-ZS45XIT Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
2N2222A
Loras Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Onsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Semicoa
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Positronic Industries
CONNECTOR ACCESSORY; MIL-Connector Accessory Name: CONTACT; DIN Conformity: NO; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354; Contact Type: CRIMP REAR RELEASE;
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Intersil
1N4148
Itt Components
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .15 A;
ERJ6ENF10R0V
Panasonic
Panasonic ERJ6ENF10R0V is a 10 ohm fixed resistor with 1% tolerance, suitable for surface mount applications. With a rated power dissipation of 0.125W and operating voltage of 150V, it operates b/w -55°C to 155°C. Its metal glaze/thick film technology ensures stable performance in various electronic circuits.
LL4148
Taitron Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Molex
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
RC0805FR-0710RL
Yageo
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
Eic Semiconductor
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
BAV99
MICRODIODE ELECTRONICS SHENZHEN CO LTD
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123-7-F
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
2N7002
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; JESD-30 Code: R-PDSO-G3;
IDT7028L20PFGI
Integrated Device Technology
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 5;
CY7C1399BN-12VXI
Infineon Technologies
CY7C1399BN-12VXI by Infineon Technologies is a 32Kx8 SRAM with 3.3V supply, operating in asynchronous mode with 12ns access time. It features a small outline package and is ideal for industrial applications requiring fast and reliable memory storage.
IDT71016S15PHGI8
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
71024S12TYGI8
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOJ; Package Shape: RECTANGULAR; Terminal Position: DUAL;
AS6C1008-55SINTR
Alliance Memory
Alliance Memory's AS6C1008-55SINTR is a 128Kx8 SRAM with 55ns access time. Operating at 3V, it features asynchronous mode and common I/O type. Ideal for industrial applications requiring fast and reliable memory storage.
5962-8685910LA
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
5962-8866204NA
Paradigm Technology
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 45 ns;
CY62187EV30LL-55BAXIT
Infineon's CY62187EV30LL-55BAXIT is a 3.3V SRAM with 4MX16 organization, operating at -40 to 85°C. It features a low profile grid array package, 0.75mm terminal pitch, and 55ns access time. Ideal for industrial applications requiring fast parallel memory with common I/O type.
CY7C1059DV33-10ZSXI
CY7C1059DV33-10ZSXI by Infineon Technologies is a 1MX8 SRAM with 3.3V supply voltage, operating in industrial temperature range. It features asynchronous mode, 10ns access time, and 3-STATE output characteristics. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.
23K256-I/SN
Microchip Technology
23K256-I/SN by Microchip Technology is a 32Kx8 SRAM with 20MHz clock frequency, 3.9mm width, and 1.27mm terminal pitch. Ideal for industrial applications, it operates at -40 to 85°C with a max supply voltage of 3.6V. Its synchronous operation and separate I/O type make it suitable for various memory-intensive tasks.
M5M51008DVP-70H
Mitsubishi Electric
STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TSOP1; Package Shape: RECTANGULAR; Qualification: Not Qualified;
CY62177EV30LL-55BAXI
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
CY7C1062G30-10BGXI
Infineon Technologies' CY7C1062G30-10BGXI is a 512KX32 SRAM with a 10 ns max access time. It operates asynchronously at a nominal voltage of 3V and has a temperature range of -40 to 85°C. This memory IC is commonly used in industrial applications requiring high-speed data storage.
23A256-I/SN
23A256-I/SN by Microchip Technology is a 32Kx8 SRAM with 16 MHz clock frequency, operating at 1.8V. It features separate I/O, synchronous operation, and 3-STATE output. Ideal for industrial applications requiring high-speed memory access in a small outline package.
70V261L25PFGI8
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Maximum Standby Current: .003 Amp;
DS1220Y-200+
Maxim Integrated
DS1220Y-200+ by Maxim Integrated is a 2Kx8 SRAM with 5V supply, operating in asynchronous mode. It has a memory density of 16384 bit and max access time of 200ns. Ideal for commercial applications requiring non-volatile memory storage.
IDT71024S20YGI8
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOJ; Package Shape: RECTANGULAR; Width: 10.16 mm;
IDT71V016SA20PHGI8
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Output Characteristics: 3-STATE;
AS6C4008-55SIN
Alliance Memory's AS6C4008-55SIN is a 512Kx8 SRAM with 55ns access time, operating at 3V. Ideal for industrial applications, it features a small outline package, common I/O type, and 3-state output characteristics.
CY62167G30-45BVXA
Infineon's CY62167G30-45BVXA is a 1MX16 SRAM with 45ns access time, operating at 3.6V. It features a very thin profile grid array package suitable for industrial applications requiring fast and reliable memory storage. With common I/O type and output enable function, it offers high-speed parallel data processing capabilities in harsh environments.
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CY14B116L-ZS25XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Technology: CMOS;
Infineon's CY14B116L-ZS25XIT is a 2MX8 SRAM with 16777216-bit memory density, operating at 3V. It features an access time of 25ns and is ideal for industrial applications requiring non-volatile memory storage in a small outline package.
CY14B256LA-SZ45XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Access Time: 45 ns;
Infineon's CY14B256LA-SZ45XIT is a 32Kx8 non-volatile SRAM with 262144-bit memory density. Operating at 3V, it offers fast access time of 45ns and low standby current of 0.005A. Ideal for industrial applications requiring reliable data storage in a compact package.
CY14E256LA-SZ25XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Output Enable: YES;
Infineon's CY14E256LA-SZ25XI is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a small outline package and industrial temperature grade, suitable for applications requiring fast access times like industrial automation and automotive systems.
CY14B256LA-SZ45XI
Infineon's CY14B256LA-SZ45XI is a 32Kx8 SRAM with 262144-bit memory density. Operating at 3V, it offers fast access time of 45ns in industrial temperatures. Ideal for applications requiring non-volatile parallel memory with low standby current and high reliability.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8;
CY14B104NA-BA25XI
Infineon's CY14B104NA-BA25XI is a 256Kx16 SRAM with 3V nominal voltage, operating in industrial temperature range. It features asynchronous mode, 25ns access time, and non-volatile memory IC type. Ideal for applications requiring fast parallel memory access in compact electronic devices.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 70 mA;
CY14B104NA-BA25XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Memory Density: 4194304 bit;
Infineon's CY14B104NA-BA25XIT is a 256Kx16 SRAM with 3V nominal voltage. Operating asynchronously, it offers fast access time of 25ns and low standby current of 0.005Amp. Ideal for industrial applications requiring high-speed memory with non-volatile storage capabilities.
CY14E256LA-SZ25XIT
Infineon's CY14E256LA-SZ25XIT is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features an industrial temperature grade, parallel interface, and non-volatile memory technology. Ideal for applications requiring fast access times of up to 25ns in harsh environments.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 4.5 V;
CY14B116L-ZS25XI
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Seated Height: 1.194 mm;
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
CY14E256LA-SZ45XIT
Infineon's CY14E256LA-SZ45XIT is a 32Kx8 SRAM with 3-STATE output, operating at 5V. It features a small outline package, GULL WING terminals, and industrial temperature grade. Ideal for applications requiring fast access times and non-volatile memory solutions.
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
CY14B108M-ZSP45XIT
NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 54; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Equivalence Code: TSOP54,.46,32;
Infineon's CY14B108M-ZSP45XIT is a 512Kx16 SRAM with 3V nominal voltage. Operating asynchronously, it offers fast access time of 45ns and low standby current of 0.01Amp. Ideal for industrial applications requiring high-speed memory with non-volatile storage capabilities.
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