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CY7C1059DV33-10ZSXI

Infineon Technologies

CY7C1059DV33-10ZSXI by Infineon Technologies

CY7C1059DV33-10ZSXI by Infineon Technologies is a 1MX8 SRAM with 3.3V supply voltage, operating in industrial temperature range. It features asynchronous mode, 10ns access time, and 3-STATE output characteristics. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.

Median Price

$17.225

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 21,550 parts In-Stock

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-

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$17.225

1k+ parts

$15.412

10k+ parts

$14.512

21,550

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$17.225

$15.412

$14.512

Rochester

USA . 19,990 parts In-Stock

1+ parts

-

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$13.780

1k+ parts

$12.330

10k+ parts

$11.610

19,990

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$13.780

$12.330

$11.610

Flip Electronics (Authorized)

USA . 3,013 parts In-Stock

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DigiKey

USA . 1,663 parts In-Stock

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$22.100

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$22.100

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Distributors (In-Stock)

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Bristol Electronics

USA . 302 parts In-Stock

1+ parts

$6.720

100+ parts

$2.912

1k+ parts

$2.755

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302

$6.720

$2.912

$2.755

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Digiode

USA . 762 parts In-Stock

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$14.592

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762

$14.592

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Nova Conductors

Japan . 36 parts In-Stock

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$16.590

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36

$16.590

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Chip Stock

USA . 3,500 parts In-Stock

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Flip Electronics

USA . 2,473 parts In-Stock

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Vyrian

USA . 979 parts In-Stock

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979

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Dan-Mar Components

USA . 302 parts In-Stock

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DigiKey Marketplace

USA . 47 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 38 parts In-Stock

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Odi Ramu Company

Canada . 24 parts In-Stock

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Prism Electronics

USA . 21 parts In-Stock

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Standard Data Resources

USA . 15 parts In-Stock

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Connect4Technologies Inc.

Canada . 14 parts In-Stock

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Connector Distribution Corp

USA . 6 parts In-Stock

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Right Parts Inc.

USA . 6 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 3,180 parts In-Stock

1+ parts

$5.228

100+ parts

$5.019

1k+ parts

$4.810

10k+ parts

-

3,180

$5.228

$5.019

$4.810

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Semicontronic

India . 1,302 parts In-Stock

1+ parts

$13.060

100+ parts

$12.734

1k+ parts

$12.668

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1,302

$13.060

$12.734

$12.668

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Ampacity Inc.

Singapore . 1,000 parts In-Stock

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$13.060

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$13.060

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Corphita

USA . 252 parts In-Stock

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$13.824

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Component Stockers USA

USA . 64 parts In-Stock

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$15.880

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Continental Prestige Electronics

USA . 6,034 parts In-Stock

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$16.590

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$16.258

6,034

$16.590

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Netroflash

USA . 500 parts In-Stock

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$16.590

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$16.590

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Microchip USA

USA . 1,776 parts In-Stock

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$50.485

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Perfect Parts

USA . 1,989 parts In-Stock

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Argo Parts USA

USA . 1,400 parts In-Stock

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Kepictronics

USA . 135 parts In-Stock

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135

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Overview

Unlock the power of high-quality SRAM technology with the CY7C1059DV33-10ZSXI from Infineon Technologies. Designed for industrial applications, this memory IC offers a reliable performance at an affordable price point. With a memory density of 8388608 bits and a fast access time of 10 ns, this product is perfect for high-speed data processing tasks. Trust Infineon Technologies to deliver top-notch products that exceed your expectations. Choose the CY7C1059DV33-10ZSXI for unparalleled quality and performance in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for the package body, ensuring protection for the internal components.

Operating Mode: ASYNCHRONOUS

Allows for independent control of data flow and access, enhancing flexibility and efficiency.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal voltage supply for reliable and stable performance of the SRAM.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

Compact and space-saving design for easy integration into electronic devices.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Maximum Access Time: 10 ns

Quick access time ensures fast data retrieval and processing, making it suitable for high-speed applications.

Technical Specifications

SRAM CY7C1059DV33-10ZSXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e3

Length:

18.415 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

44

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Output Characteristics:

3-STATE

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.194 mm

Maximum Standby Current:

.02 Amp

Minimum Standby Voltage:

2 V

Sub-Category:

SRAMs

Maximum Supply Current:

110 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10.16 mm

Trade Compliance

CY7C1059DV33-10ZSXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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