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CY7C1520KV18-250BZXI

Infineon Technologies

CY7C1520KV18-250BZXI by Infineon Technologies

Infineon's CY7C1520KV18-250BZXI is a 2MX36 DDR SRAM with 250 MHz clock frequency, operating at 1.8V. It features synchronous operation, 3-STATE output, and low profile grid array package. Ideal for industrial applications requiring fast access times and high memory density.

Median Price

$144.500

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Master Electronics

USA . 87 parts In-Stock

1+ parts

$182.050

100+ parts

$154.620

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87

$182.050

$154.620

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Chip1Stop

Japan . 87 parts In-Stock

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$210.000

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$157.000

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87

$210.000

$157.000

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Flip Electronics (Authorized)

USA . 1,920 parts In-Stock

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DigiKey

USA . 711 parts In-Stock

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Verical

USA . 630 parts In-Stock

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$90.146

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Rochester

USA . 5 parts In-Stock

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$106.950

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$95.690

10k+ parts

$90.060

5

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$95.690

$90.060

Distributors (In-Stock)

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Digiode

USA . 444 parts In-Stock

1+ parts

$113.174

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$113.174

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IBS Electronics

USA . 87 parts In-Stock

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$197.752

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$167.963

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87

$197.752

$167.963

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Nova Conductors

Japan . 100 parts In-Stock

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$198.980

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100

$198.980

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Flip Electronics

USA . 1,533 parts In-Stock

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DigiKey Marketplace

USA . 826 parts In-Stock

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Vyrian

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Speed Components Ltd

Israel . 75 parts In-Stock

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Electronics Depot

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 2,647 parts In-Stock

1+ parts

$5.708

100+ parts

$5.480

1k+ parts

$5.251

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2,647

$5.708

$5.480

$5.251

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Ampacity Inc.

Singapore . 253 parts In-Stock

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$101.260

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Corphita

USA . 531 parts In-Stock

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$107.217

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Component Stockers USA

USA . 114 parts In-Stock

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Microchip USA

USA . 2,174 parts In-Stock

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$171.540

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Continental Prestige Electronics

USA . 923 parts In-Stock

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$198.980

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$195.000

923

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Netroflash

USA . 50 parts In-Stock

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$198.980

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Argo Parts USA

USA . 2,817 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

USA . 124 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the CY7C1520KV18-250BZXI from Infineon Technologies. As a leading manufacturer in the industry, Infineon's SRAM technology offers cutting-edge solutions for a wide range of applications. With a nominal supply voltage of 1.8V and a maximum clock frequency of 250MHz, this DDR SRAM delivers exceptional speed and efficiency. Whether you're looking to enhance your industrial machinery or upgrade your networking equipment, the CY7C1520KV18-250BZXI provides the value, benefits, and advantages you need for optimal performance. Trust in Infineon Technologies to elevate your systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and reliable packaging for the SRAM, ensuring long-term performance.

Surface Mount: YES

Easy installation and integration onto PCBs, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Allows for synchronized data transfers, enhancing overall system performance and efficiency.

Nominal Supply Voltage / Vsup (V): 1.8

Optimal voltage for stable operation, ensuring consistent performance of the SRAM.

Maximum Clock Frequency (fCLK): 250 MHz

High clock frequency enables fast data processing, making this SRAM suitable for high-speed applications.

Technology: CMOS

Low power consumption and high noise immunity, ideal for use in various electronic devices.

Memory IC Type: DDR SRAM

DDR technology offers improved data transfer rates and efficiency compared to traditional SRAM.

Technical Specifications

SRAM CY7C1520KV18-250BZXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

.45 ns

Additional Features:

PIPELINED ARCHITECTURE

Maximum Clock Frequency (fCLK):

250 MHz

Input/Output Type:

COMMON

JESD-30 Code:

R-PBGA-B165

JESD-609 Code:

e1

Length:

15 mm

Memory Density:

75497472 bit

Memory IC Type:

Memory Width:

36

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

165

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2MX36

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA165,11X15,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/1.8,1.8

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Minimum Standby Voltage:

1.7 V

Sub-Category:

SRAMs

Maximum Supply Current:

530 mA

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

13 mm

Trade Compliance

CY7C1520KV18-250BZXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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