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CY7C1062G30-10BGXI

Infineon Technologies

CY7C1062G30-10BGXI by Infineon Technologies

Infineon Technologies' CY7C1062G30-10BGXI is a 512KX32 SRAM with a 10 ns max access time. It operates asynchronously at a nominal voltage of 3V and has a temperature range of -40 to 85°C. This memory IC is commonly used in industrial applications requiring high-speed data storage.

Median Price

$46.200

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 642 parts In-Stock

1+ parts

$38.800

100+ parts

$36.950

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-

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642

$38.800

$36.950

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Newark

USA . 160 parts In-Stock

1+ parts

$40.610

100+ parts

$40.610

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-

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160

$40.610

$40.610

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Chip1Stop

Japan . 67 parts In-Stock

1+ parts

$46.200

100+ parts

-

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-

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67

$46.200

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Arrow

USA . 21 parts In-Stock

1+ parts

$46.280

100+ parts

$40.520

1k+ parts

$37.700

10k+ parts

-

21

$46.280

$40.520

$37.700

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Farnell

UK . 150 parts In-Stock

1+ parts

$59.580

100+ parts

$53.240

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-

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150

$59.580

$53.240

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DigiKey

USA . 118 parts In-Stock

1+ parts

$67.860

100+ parts

$57.987

1k+ parts

$56.512

10k+ parts

-

118

$67.860

$57.987

$56.512

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Mouser Electronics

USA . 171 parts In-Stock

1+ parts

$70.130

100+ parts

$59.150

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171

$70.130

$59.150

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Element14

Singapore . 150 parts In-Stock

1+ parts

$100.070

100+ parts

$83.350

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-

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150

$100.070

$83.350

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Flip Electronics (Authorized)

USA . 5,880 parts In-Stock

1+ parts

-

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5,880

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Verical

USA . 168 parts In-Stock

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168

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RS (Exports)

UK . 84 parts In-Stock

1+ parts

-

100+ parts

$34.035

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84

-

$34.035

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Rochester

USA . 75 parts In-Stock

1+ parts

-

100+ parts

$39.330

1k+ parts

$35.190

10k+ parts

$33.120

75

-

$39.330

$35.190

$33.120

Avnet

USA . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$44.673

10k+ parts

$41.999

40

-

-

$44.673

$41.999

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 212 parts In-Stock

1+ parts

$37.240

100+ parts

-

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212

$37.240

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$55.057

100+ parts

-

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50

$55.057

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IBS Electronics

USA . 2,799 parts In-Stock

1+ parts

$59.929

100+ parts

$57.068

1k+ parts

$61.654

10k+ parts

-

2,799

$59.929

$57.068

$61.654

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DigiKey Marketplace

USA . 420 parts In-Stock

1+ parts

-

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420

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Vyrian

USA . 400 parts In-Stock

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400

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Flip Electronics

USA . 336 parts In-Stock

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336

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Prism Electronics

USA . 1 parts In-Stock

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-

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1

-

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

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-

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,944 parts In-Stock

1+ parts

$2.946

100+ parts

-

1k+ parts

-

10k+ parts

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1,944

$2.946

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Andel Nordic

Denmark . 4,224 parts In-Stock

1+ parts

$3.416

100+ parts

-

1k+ parts

$3.279

10k+ parts

$3.279

4,224

$3.416

-

$3.279

$3.279

Corphita

USA . 104 parts In-Stock

1+ parts

$35.280

100+ parts

-

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104

$35.280

-

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Ampacity Inc.

Singapore . 411 parts In-Stock

1+ parts

$35.360

100+ parts

-

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411

$35.360

-

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Continental Prestige Electronics

USA . 86 parts In-Stock

1+ parts

$43.970

100+ parts

-

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86

$43.970

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Modulus Dynamics

Lithuania . 6,453 parts In-Stock

1+ parts

$49.500

100+ parts

$47.520

1k+ parts

$45.540

10k+ parts

-

6,453

$49.500

$47.520

$45.540

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Corohmni

South Africa . 96 parts In-Stock

1+ parts

$49.500

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-

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96

$49.500

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$55.057

100+ parts

-

1k+ parts

$52.305

10k+ parts

$51.203

1,000

$55.057

-

$52.305

$51.203

Semicontronic

India . 347 parts In-Stock

1+ parts

$74.920

100+ parts

$73.047

1k+ parts

$72.672

10k+ parts

-

347

$74.920

$73.047

$72.672

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Futuretech Components

Singapore . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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2,000

-

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Argo Parts USA

USA . 1,748 parts In-Stock

1+ parts

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1,748

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Perfect Parts

USA . 566 parts In-Stock

1+ parts

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566

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Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

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100+ parts

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550

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Overview

Experience the exceptional quality and reliability of Infineon Technologies with the CY7C1062G30-10BGXI SRAM. This versatile memory chip offers numerous advantages, making it the perfect choice for a wide range of applications. With its solid construction and innovative technology, this product ensures optimal performance even in demanding industrial environments. Its parallel interface and high-speed access time of just 10 ns guarantee lightning-fast data retrieval. From embedded systems to telecommunications equipment, the CY7C1062G30-10BGXI delivers unparalleled value, benefits, and advantages, empowering you to stay ahead of the competition. Trust Infineon Technologies for your memory needs and unlock new possibilities for your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This product's plastic/epoxy package body material ensures durability and lightweight design, making it an ideal choice for various applications.

Surface Mount: YES

With surface mount capability, this product offers easy and efficient installation, improving the overall productivity and convenience of the user.

No. of Functions: 1

Featuring a single function, this product simplifies design and integration processes, reducing complexity and enhancing overall reliability.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact and space-saving solution, allowing for efficient utilization of limited board space.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode of this product enables independent and simultaneous memory access, offering high-speed data processing capabilities.

Nominal Supply Voltage / Vsup (V): 3

With a nominal supply voltage of 3V, this product ensures reliable and stable performance within specified power requirements.

No. of Terminals: 119

The high number of terminals on this product allows for seamless integration and connectivity, providing enhanced versatility and ease of use.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style, along with the added heat sink/slug, facilitates efficient heat dissipation, preventing thermal issues and improving overall reliability.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand challenging environments, ensuring reliable operation even under extreme conditions.

Organization: 512KX32

The organization of this product as 512KX32 enables efficient data storage and retrieval, supporting high-capacity memory requirements for various applications.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures as low as -40°C, this product is suitable for use in both extreme hot and cold environments.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable and long-lasting electrical connections.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and connection processes, allowing for easy integration into existing systems.

Maximum Seated Height: 2.4 mm

With a maximum seated height of 2.4mm, this product offers a low-profile design, making it compatible with compact and space-constrained applications.

Width: 14 mm

With a width of 14mm, this product offers a compact form factor, allowing for efficient utilization of available board space.

Minimum Supply Voltage (Vsup): 2.2 V

With a minimum supply voltage of 2.2V, this product provides flexibility in power supply options while ensuring reliable performance.

Peak Reflow Temperature °C: 260

Capable of withstanding peak reflow temperature of 260°C, this product is suitable for soldering processes, enhancing the ease of manufacturing.

Length: 22 mm

With a length of 22mm, this product offers a compact size, enabling easy integration and installation in various applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product ensures reliable operation and durability in demanding environments.

Technology: CMOS

The CMOS technology utilized in this product provides low power consumption, high-speed operation, and integration capabilities, making it an efficient choice for applications with tight power budgets.

Parallel or Serial: PARALLEL

Featuring a parallel interface, this product allows for simultaneous transfer of multiple data bits, enabling high-speed and efficient data processing.

Terminal Form: BALL

The ball terminal form simplifies the soldering process and improves mechanical stability, ensuring secure connections and long-term reliability.

No. of Words: 524288 words

With a high number of memory words, this product supports extensive data storage and retrieval requirements, enabling a wide range of applications.

Memory Width: 32

The 32-bit memory width of this product supports high-speed data processing and compatibility with other system components, enhancing overall performance.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this product provides easy connectivity and compatibility with standard electronic components, simplifying the integration process.

No. of Words Code: 512K

The 512K words code provides a large memory capacity, enabling storage of a significant amount of data for various applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product offers enhanced resistance to moisture, ensuring long-term reliability and performance even in humid environments.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this product allows for a wider range of power supply options while maintaining reliable operation.

Memory Density: 16777216 bit

Providing a high memory density of 16,777,216 bits, this product fulfills the requirements of applications demanding large data storage and retrieval capabilities.

Memory IC Type: STANDARD SRAM

As a standard SRAM, this product offers fast and reliable random access to memory cells, making it suitable for a wide range of applications.

Maximum Access Time: 10 ns

With a maximum access time of 10ns, this product ensures quick and efficient data retrieval, enabling high-speed and responsive system performance.

Technical Specifications

SRAM CY7C1062G30-10BGXI attributes and parameters. Explore more SRAM devices from Infineon Technologies

Specs

Maximum Access Time:

10 ns

JESD-30 Code:

R-PBGA-B119

JESD-609 Code:

e1

Length:

22 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

32

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

119

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX32

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.4 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Width:

14 mm

Trade Compliance

CY7C1062G30-10BGXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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