Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
CY7C1049GN30-10VXI by Infineon Technologies is a 512Kx8 SRAM with 3-STATE output, operating at 3V. It features an industrial temperature grade, parallel interface, and J BEND terminal form. Ideal for applications requiring fast access times and low standby current in industrial environments.
Median Price
$4.500
Lifecycle Status
Suppliers In-Stock
17
In-Stock Inventory
1k+
Newark
1+ parts
$1.920
100+ parts
1k+ parts
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Arrow
$2.264
$2.223
Chip1Stop
$4.300
Mouser Electronics
$5.300
$4.550
$4.200
DigiKey
$4.656
$4.307
$4.202
Farnell
$5.520
$4.720
$4.470
Element14
$10.120
$8.150
$7.360
Rochester
$2.800
$2.510
$2.360
Master Electronics
$4.700
$4.330
$4.150
Verical
$3.138
$2.950
Digiode
$1.824
Nova Conductors
$5.790
Flip Electronics
IBS Electronics
$5.203
$4.993
Schukat
$2.195
$2.097
Vyrian
Rutronik
$3.960
$3.900
Ampacity Inc.
$1.630
Semicontronic
$1.589
$1.581
Corphita
$1.728
Aztec Data Supply Inc.
$3.446
Component Stockers USA
$4.920
Continental Prestige Electronics
$5.170
$4.160
Modulus Dynamics
$5.528
$5.307
$5.086
Corohmni
Netroflash
QUARKTWIN TECHNOLOGY LTD
Authorized Procurement Solutions
Argo Parts USA
Perfect Parts
GreenTree Electronics
This material provides durability and protection for the SRAM, making it suitable for various environments.
Allows for easy installation and space-saving on PCBs, ideal for compact electronic devices.
The rectangular shape is a standard design, making it compatible with most PCB layouts.
Offers flexibility in data transfer without requiring a clock signal, enhancing compatibility with different systems.
Simplifies interfacing with other components and devices, ensuring seamless communication.
Standard voltage requirement for stable operation in a wide range of applications.
Sufficient number of terminals for connecting to other circuitry and peripherals.
Compact size allows for efficient use of space on PCBs, ideal for designs with limited room.
Can withstand high temperatures without affecting performance, suitable for industrial applications.
Provides a large memory capacity for storing and accessing data efficiently.
Offers flexibility in controlling the output signal, enhancing versatility in system design.
Low standby voltage requirement helps conserve power when the SRAM is not in use.
Can operate in extremely cold environments, making it suitable for various conditions.
Pure tin finish ensures reliable electrical connections and corrosion resistance.
Dual terminal positioning provides stability and secure connectivity on the PCB.
Low-profile design minimizes space requirements, suitable for slim devices.
Compact width allows for easy integration into PCB layouts of different sizes.
Can operate at lower voltages, enabling power-efficient performance.
Able to withstand high reflow temperatures during assembly, ensuring reliability.
Suitable length for accommodating the necessary components and connections on the PCB.
Designed to meet the demanding requirements of industrial applications.
CMOS technology offers low power consumption and high noise immunity, enhancing efficiency.
Parallel data transfer allows for faster communication compared to serial interfaces.
J bend terminals provide secure connections and easy soldering during assembly.
Low current consumption for efficient power usage in various applications.
Large word capacity for storing and retrieving data efficiently.
8-bit memory width for processing data in chunks, suitable for a wide range of applications.
Standard terminal pitch for compatibility with common PCB layouts.
Indicates the memory capacity and organization of the SRAM.
MSL 3 rating ensures reliability during storage and handling in different environments.
Safely operates within the specified voltage range, preventing damage to the SRAM.
High memory density for storing large amounts of data in a compact form factor.
Standard SRAM design for reliable data storage and retrieval in diverse applications.
Output enable feature allows for efficient control of data flow, enhancing functionality.
Low standby current consumption for power-efficient operation in standby mode.
Fast access time ensures quick data retrieval, enhancing overall system performance.
SRAM CY7C1049GN30-10VXI attributes and parameters. Explore more SRAM devices from Infineon Technologies
Maximum Access Time:
Input/Output Type:
JESD-30 Code:
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Moisture Sensitivity Level (MSL):
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No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Output Enable:
Package Body Material:
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Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Maximum Seated Height:
Maximum Standby Current:
Minimum Standby Voltage:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
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CY7C1049GN30-10VXI Memory ICs trade compliance attributes, and parameters.
ECCN
3A991.B.2.A
ECCN Governance
EAR
HTS
8542.32.00.41
SB
8542.32.00.40
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
LL4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
1N4148WS
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
EU2B-YS3203F
Idec
ROTARY SWITCH;
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
2N7002
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
1N4148
Grande Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
ULN2803A
STMicroelectronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
PIC18F4550-I/ML
The Microchip Technology PIC18F4550-I/ML is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this chip offers efficient performance in compact designs.
SMBJ18CA
Jgd Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Polarity: BIDIRECTIONAL; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
MBRS130LT3G
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRG0805F10K
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10000 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358D-T
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
CY62167DV30LL-55ZXI
Infineon Technologies
CY62167DV30LL-55ZXI by Infineon Technologies is a 1MX16 SRAM with 3.6V max supply voltage, 55ns access time, and operates in industrial temperature range. It features common I/O type and 3-STATE output characteristics, suitable for applications requiring fast and reliable memory storage in harsh environments.
7008L20PFI8
Integrated Device Technology
7008L20PFI8 by Integrated Device Technology is a 64Kx8 SRAM with 3-STATE output, operating at 5V. It features a low profile flatpack package with 0.5mm terminal pitch, suitable for industrial applications requiring fast access times of up to 20ns. This multi-port SRAM has a memory density of 524288 bits and can operate in parallel mode.
AS7C31024B-12TCN
Alliance Memory
Alliance Memory's AS7C31024B-12TCN is a 128Kx8 SRAM with 12ns access time, operating at 3.3V. Ideal for commercial applications, it features a small outline package and operates in asynchronous mode with common I/O type.
5962-8855203YA
Defense Logistics Agency
Defense Logistics Agency's 5962-8855203YA is a MIL-STD-883 compliant SRAM chip with 32KX8 organization, operating at 5V. It features a ceramic, metal-sealed co-fired package in rectangular shape, suitable for military applications. With a memory density of 262144 bit and max access time of 55 ns, it offers reliable performance in harsh environments.
5962-8685910LA
Performance Semiconductor
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Standby Current: .001 Amp;
CY7C1062G30-10BGXI
Cypress Semiconductor
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 119; Package Code: HBGA; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260;
IDT71V124SA12TYGI8
Renesas Electronics
The Renesas Electronics IDT71V124SA12TYGI8 is a 128Kx8 SRAM with 3.3V supply voltage, operating in asynchronous mode. It features a max access time of 12ns and offers 131072 words of memory. Ideal for industrial applications requiring fast and reliable data storage with a compact small outline package design.
23LC1024-I/SNVAO
Microchip Technology's 23LC1024-I/SNVAO is a 128KX8 SRAM with synchronous operation and 3-STATE output. It operates at up to 20 MHz clock frequency, suitable for industrial applications requiring high-speed memory access. With a small outline package style and low standby current of 0.00001 Amp, it is ideal for space-constrained designs in automotive electronics.
CY62158EV30LL-45ZSXI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
CY62148ELL-55SXI
CY62148ELL-55SXI by Infineon Technologies is a 512Kx8 SRAM with 55ns access time, operating at 5V. It features a small outline package, industrial temperature grade, and Gull Wing terminal form. Ideal for applications requiring fast and reliable memory storage in industrial environments.
5962-8866204NA
Temic Semiconductors
STANDARD SRAM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel; Parallel or Serial: PARALLEL;
7008L20PFGI8
MULTI-PORT SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; No. of Ports: 2;
CY62128EV30LL-45ZXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TSOP1; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V;
23LCV512-I/ST
23LCV512-I/ST by Microchip Technology is a 64KX8 SERIAL SRAM with 20 MHz fCLK, -40 to 85 °C temp range. Ideal for industrial applications requiring low standby current and common I/O type in a small outline package.
CY7C1062G30-10BGXIT
Infineon's CY7C1062G30-10BGXIT is a 512Kx32 SRAM with 10ns access time, operating at 3V. It features asynchronous mode, parallel interface, and industrial temperature grade. Ideal for applications requiring fast and reliable memory storage in compact electronic devices.
74F189SJ
Texas Instruments
74F189SJ by Texas Instruments is a 16x4 SRAM with a memory density of 64 bit. It operates asynchronously at a max access time of 27 ns and has a nominal voltage of 5V. This memory IC is commonly used in applications requiring fast and reliable data storage.
CY62167EV18LL-55BVXI
CY62167EV18LL-55BVXI by Infineon: 1MX16 SRAM with 55ns access time, operates at 1.8V, and has 3-STATE output. Ideal for industrial applications requiring high-speed memory with low standby current. Package style is grid array, very thin profile, fine pitch.
71321LA20JG8
Renesas Electronics' 71321LA20JG8 is a 2Kx8 MULTI-PORT SRAM with 20ns access time, operating at 5V. It features a 3-STATE output and operates in asynchronous mode. This chip carrier package is ideal for applications requiring fast and efficient memory storage in commercial-grade devices.
CY7C1049DV33-10ZSXIT
CY7C1049DV33-10ZSXIT by Cypress Semiconductor is a 512Kx8 SRAM with 3.3V supply, operating at -40 to 85°C. It features a parallel interface, 10ns access time, and low standby current of 0.01Amp. Ideal for industrial applications requiring fast and reliable memory storage in a compact thin profile package.
CY62128EV30LL-45SXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Standby Current: .000003 Amp;
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CY7C1041GN30-10BVXI
Infineon Technologies' CY7C1041GN30-10BVXI is a 256KX16 SRAM with a package style of GRID ARRAY, VERY THIN PROFILE, FINE PITCH. It operates asynchronously at a nominal voltage of 3V and has a max access time of 10ns. This memory IC is commonly used in industrial applications requiring high-speed data storage.
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
CY7C1041GN30-10BVXIT
CY7C1041GN30-10BVXIT by Infineon: 256Kx16 SRAM with 10ns access time, operates at -40 to 85°C. Ideal for industrial applications requiring fast and reliable parallel memory storage. Package style: grid array, very thin profile, fine pitch.
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: VFBGA; Package Shape: RECTANGULAR; Input/Output Type: COMMON;
CY7C1041GN30-10ZSXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; JESD-609 Code: e3;
CY7C1041DV33-10ZSXI
CY7C1041DV33-10ZSXI by Cypress Semiconductor is a 256Kx16 SRAM with 3.3V supply, 10ns access time, and 85°C max temp. Ideal for industrial applications requiring fast, common I/O asynchronous memory in a small outline package.
CY7C1049GN30-10VXIT
CY7C1049GN30-10VXIT by Infineon: 512Kx8 SRAM with 10ns access time, operates at -40 to 85°C. Ideal for industrial applications, featuring common I/O type and 3-state output characteristics. Package style is small outline, with a supply voltage range of 2.2V to 3.6V.
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 36; Package Code: SOJ; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
CY7C1041DV33-10ZSXIT
CY7C1041DV33-10ZSXIT by Cypress Semiconductor is a 256KX16 SRAM with 3.3V supply, operating at -40 to 85°C. It features 10ns access time, 90mA max supply current, and GULL WING terminals. Ideal for industrial applications requiring fast and reliable memory storage in a compact form factor.
CY7C1041GN30-10ZSXI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Surface Mount: YES;
CY7C1041GN30-10ZSXI by Infineon: 256KX16 SRAM with 10ns access time, 3.6V max supply voltage, and -40 to 85°C temp range. Ideal for industrial applications requiring fast and reliable memory storage in a compact 0.8mm pitch package.
CY7C1049GN30-10VXI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 36; Package Code: SOJ; Package Shape: RECTANGULAR; Width: 10.16 mm;
CY7C1041G30-10ZSXIT
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Access Time: 10 ns;
Infineon's CY7C1041G30-10ZSXIT is a 256Kx16 SRAM with 100MHz clock frequency, 10ns access time, and 3-state output. It operates at -40 to 85°C, suitable for high-speed applications like networking equipment and industrial automation systems. The memory IC features a small outline package with gull wing terminals for surface mount assembly.
CY7C1051DV33-10ZSXI
Infineon's CY7C1051DV33-10ZSXI is a 512Kx16 SRAM with 3.3V supply, operating at -40 to 85°C. It features asynchronous mode, 10ns access time, and 44 terminals in a small outline package. Ideal for industrial applications requiring fast and reliable memory storage.
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30;
Infineon Technologies' CY7C1062G30-10BGXI is a 512KX32 SRAM with a 10 ns max access time. It operates asynchronously at a nominal voltage of 3V and has a temperature range of -40 to 85°C. This memory IC is commonly used in industrial applications requiring high-speed data storage.
CY7C1049GN30-10ZSXI
STANDARD SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
Supply Digital Components
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